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SMTA International 2026
SMTA International 2026
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Monday
, October 26
AME
8:30am •
AME Track Keynote Presentation: Hybrid Electronics - Accelerating Innovation and Adoption
10:00am •
AME1: Additive Processes for Circuit Manufacture
12:30pm •
AME2: Embedded and Conformal Electronics
2:30pm •
AME3: Interconnection and Ablation Processes for Additive Circuits
4:15pm •
AME4: Panel Discussion
LOBBY
7:30am •
SMTA Registration
MFX
1:00pm •
MFX1: Reflow Technology
3:00pm •
MFX2: AI & Smart Factory Evolution
PDC1
8:30am •
PDC1: Solder Joint Voids: Impact on Bottom Terminated Components (BTCs) and Ball Grid Arrays Solder Joint Reliability
PDC2
8:30am •
PDC2: Mastering Intermetallics for Reliable Electronics
PDC3
8:30am •
PDC3: Data-Driven Solder Paste Qualification
PDC4
8:30am •
PDC4: Principles and Practice of Developing Soldering Profiles
WLP
1:30pm •
WLP: Invited Keynote Presentations & Panel Discussion
4:00pm •
WLP: Round Table Discussions
5:00pm •
WLP: Connection Reception
Tuesday
, October 27
EMAC
10:30am •
Workforce Development & Student Technical Session
EXPO HALL B,C,D
4:00pm •
Electronics Exhibition
INS
9:00am •
INS1: AI Infiltrates Inspection: Latest from the Coalface
10:30am •
INS2: Cautionary Tales from Imaging Analysis
1:30pm •
INS3: Eat Your Vegetables, Part I: Test Methods You Need to Know
3:30pm •
INS4: Eat Your Vegetables, Part II: Test Methods You Need to Know
LOBBY
7:30am •
SMTA Registration
LTS
1:30pm •
LTS1: Low-Temperature Solder Materials
3:30pm •
LTS2: Low-Temperature Soldering Advances
MFX
9:00am •
MFX Track Keynote Presentation: AI Infrastructure Technology: Driving Forces, Challenges & Key Directions
10:30am •
MFX3: Cleaning & Coating
1:00pm •
MFX4: OPS Excellence & Box Level Assembly
3:30pm •
MFX5: Solder Paste Printing & Reliability
PDC5
8:30am •
PDC5: AI-Powered Manufacturing: From Fundamentals to Factory Impact
PDC6
8:30am •
PDC6: Assembly: Best Practices for Improving Manufacturing Productivity
PDC7
8:30am •
PDC7: Design and Assembly Process Challenges for Bottom Termination Components (BTCs) in Tin-Lead and Lead-Free Applications
RHE
8:30am •
RHE1: Microstructure and Reliability
10:30am •
RHE2: Alloying Effects on Performance
1:00pm •
RHE3: Conformal Coating and Reliability 1
3:30pm •
RHE4: Conformal Coating and Reliability 2
5:00pm •
RHE Town Hall: The Impact of Conformal Coating on Reliability
SLYCE Restaurant @ Embassy Suites Rosemont
12:00pm •
Next Gen Connect: Pizza and Perspectives
SMTA Booth #2851
4:00pm •
Tuesday Evening Reception: Pit Stop Party
4:00pm •
Bright Manufacturing Challenge Round 2 (Team Robotics Challenge)
WFD
8:30am •
Back 2 Basics Session 1: From Design to Fab
10:30am •
Back 2 Basics Session 2: SMT Assembly Essentials
1:00pm •
Back 2 Basics Session 3: Solder, Repair & Protect
3:30pm •
Back 2 Basics Session 4: Test & Verify + Guided Expo Walk
Wednesday
, October 28
APT
11:00am •
APT1: Advanced Interconnect Materials and Reliability
2:00pm •
APT2: Advanced Packaging and Reliability
4:30pm •
APT3: Korean Packaging Integration Association
EXPO HALL B
11:00am •
Interactive Presentations (Posters) on the Show Floor
EXPO HALL B,C,D
10:00am •
Electronics Exhibition
LOBBY
7:30am •
SMTA Registration
5:00pm •
Wednesday Reception: Halloween Bash
MFX
11:30am •
MFX6: Conformal Coating
2:00pm •
MFX7: OPS Excellence
RHE
11:00am •
RHE5: Mechanical Testing and Interconnect Reliability
2:00pm •
RHE6: Predictive Modeling
4:30pm •
RHE7: Lead-Free Solder Evolution
Room 13 - Ground Floor
10:00am •
SMTA International Keynote Presentation
Room 13 - Level 1
10:00am •
Electronics Assembly Explorer Kickoff
SMTA Booth #2851
10:30am •
Bright Manufacturing Challenge Round 3 (Team Robotics Challenge)
11:00am •
SMTA Benefits & Max (AI) Demonstration Session
1:00pm •
NextGen10 Award Ceremony
TBA
4:00pm •
SMTA Officer Meeting and Social
Thursday
, October 29
APT
9:00am •
APT4: Substrates
EXPO HALL B,C,D
9:00am •
Electronics Exhibition
LOBBY
7:30am •
SMTA Registration
MFX
8:30am •
MFX8: Unique Processes for Assembly 1
11:00am •
MFX9: Unique Processes for Assembly 2
PDC10
8:30am •
PDC10: PCB Interposer Design Strategies for Heterogeneous System-in-Package Technology
PDC8
8:30am •
PDC8: Test Probes and Test Fixtures 101 for ICT/FCT: Back to Basics
PDC9
8:30am •
PDC9: Practical PCB Strain Measurement for Reliability Evaluation
RHE
9:00am •
RHE8: Harsh Use Conditions
11:00am •
RHE9: Factors Affected Thermal Cycling Performance
Room 57
8:30am •
SMT Process Technologist (CSMTPT) Certification Exam
SMTA Booth #2851
11:00am •
Electronics Assembly Explorer Raffle
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Oct 26
-
29, 2026
Monday
, October 26
Tuesday
, October 27
Wednesday
, October 28
Thursday
, October 29
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Donald E Stephens Convention Center, Rosemont, IL, USA
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AME
APT
EMAC
EXPO HALL B
EXPO HALL B,C,D
INS
LOBBY
LTS
MFX
PDC1
PDC10
PDC2
PDC3
PDC4
PDC5
PDC6
PDC7
PDC8
PDC9
RHE
Room 13 - Ground Floor
Room 13 - Level 1
Room 57
SLYCE Restaurant @ Embassy Suites Rosemont
SMTA Booth #2851
TBA
WFD
WLP
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Free Event
Student & Young Professionals
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Dates
Monday
, October 26
Tuesday
, October 27
Wednesday
, October 28
Thursday
, October 29
Session Type
Conference Session
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AME Track
APT Track
Certification
INS Track
Keynote Presentation
LTS Track
MFX Track
RHE Track
Exhibition
Professional Development Course
Registration
Special Event
All
Back 2 Basics
Free Event
Student & Young Professionals
Workforce Development
Women's Leadership Program
All
Free Event
Other Filters
Popular