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RHE7: Lead-Free Solder Evolution
Wednesday October 28, 2026 4:30pm - 6:00pm CDT
RHE
Session Chair:
Session Co-Chair:

4:30pm-5:00pm
RoHS: Twenty Years Later
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation

5:00pm-5:30pm
A Review on Impact of Isothermal Aging on Thermal Cycling Reliability of Ball Grid Array Packages Assembled Using SAC Lead-Free Solder Alloy
Presenter: Anto Raj, Ph.D., Medtronic
Co-Author: Richard Coyle, Ph.D., Nokia Bell Labs

5:30pm-6:00pm
Impact of Surface Finish on Voiding in Mixed Alloy Solder Paste Systems
Presenter: Thuy Nguyen, Indium Corporation
Co-Authors: Hongwen Zhang, Ph.D., Adam Murling,  Ronald Lasky, Ph.D., P.E.,Indium Corporation
Speakers
avatar for Ronald Lasky

Ronald Lasky

Senior Technologist, Indium Corporation
Ronald C. Lasky, Ph.D., P.E. Ron is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM.  Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly... Read More →
AR

Anto Raj

Sr Reliability Engineer, Medtronic
Anto Raj received the B.Eng. degree in electronics and communications engineering from Anna University, Chennai, India, in 2011, and the M.I.S.E. and Ph.D. degrees in industrial and systems engineering from Auburn University, Auburn, AL, USA, in 2015 and 2019, respectively. From 2020... Read More →
avatar for Thuy Nguyen

Thuy Nguyen

Technical Support Engineer II, Indium Corporation
Thuy Nguyen is a Technical Support Engineer II at Indium Corporation, where she provides advanced soldering process support to customers across the Southwest and Rocky Mountains region. With over a decade of experience spanning Quality, Research and Development, and Manufacturing... Read More →
Wednesday October 28, 2026 4:30pm - 6:00pm CDT
RHE
  Conference Session, RHE Track

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