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LTS1: Low-Temperature Solder Materials
Tuesday October 27, 2026 1:30pm - 3:00pm CDT
LTS
Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Reliability performance and challenges of Bi-Sn based Homogeneous Low Temperature Solder Joint
Presenter: Choongpyo Jeon, Samsung Electronics
Co-Authors: Soojin Yoo, Seungjin Oh, Keunho Rhew, Yuchul Hwang, Kichul Chun, Samsung Electronics

2:00pm-2:30pm
Electrical Resistivity and Microstructure of Sn-Bi Solder
Presenters: Frances Holcomb, Binghamton University
Co-Author: Silas Wieland, Eric Cotts, Ph.D., Binghamton University

2:30pm-3:00pm
Lead-Free Flux-less Soldering Below 120°C
Presenter: Martijn Mulder, Mat-Tech BV
Co-Authors: Arthur Miles, Mo Biglari, Alexandre Kodentsov, Mat-Tech BV
Speakers
avatar for Choongpyo Jeon

Choongpyo Jeon

Reliability Engineer, Samsung Electronics
Choongpyo Jeon has been a reliability engineer at Samsung Electronics for more than 15 years. He has studied package reliability assessment and modelling. Over the course of his career, he published three papers as a 1st author, and he is currently the board-level reliability lead... Read More →
avatar for Frances Holcomb

Frances Holcomb

Research Assistant, Binghamton University
Frances Holcomb is a student at Binghamton university in physics and mathematics. She conducts materials science research in Dr. Eric Cotts laboratory. She is investigating the factors which influence the resistivity of alloys such as tin bismuth, as well as models which describe... Read More →
avatar for Martijn Mulder

Martijn Mulder

Process & Quality Engineering Lead, Mat-Tech BV
Martijn Mulder is at present affiliated at the Development & Testing department of Mat-Tech BV (TheNetherlands) in the role of Process & Quality Engineering Lead. His tasks consist of addressing quality issues andresearching new ways to join similar and dissimilar materials.His primary... Read More →
Tuesday October 27, 2026 1:30pm - 3:00pm CDT
LTS
  Conference Session, LTS Track

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