Instructor: Ray Prasad
SMT Consultant and Author,
SMT Principles and Practice Course Overview: Bottom Termination Components (BTCs), including QFN, DFN, SON, LGA, and MLF packages, present unique design, assembly, inspection, and reliability challenges due to their hidden solder connections and sensitivity to process variation. This course provides practical guidance for successfully implementing robust BTC assembly processes in both tin-lead and lead-free environments. Participants will learn how to address common design and manufacturing challenges, optimize solder paste printing and rework processes, and reduce the risk of field failures.
Topics Include: • Overview of BTC package types and characteristics
• Advantages and challenges of BTC technology
• BTC package construction and manufacturing considerations
• Design considerations, including:
- PCB laminates and surface finishes
- Land pattern and stencil design
- Component considerations
• Assembly process guidelines: - Solder paste printing optimization
- Reflow process requirements
- Solder joint quality considerations
- BTC rework processes
• Inspection challenges and reliability considerations
• Strategies to prevent field failures and improve manufacturing success
Who Should Attend: This course is designed for managers, design engineers, process engineers, quality engineers, operators, and technicians involved in electronic design, assembly, inspection, and repair processes. Professionals working with tin-lead or lead-free BTC assemblies, including QFN, DFN, and similar packages, will benefit from learning practical approaches to improving design and manufacturing reliability.
