Instructor: Dave Hillman, Hillman Electronic Assembly Solutions LLC
Course Overview: This workshop explores the impact of solder joint voids on BTC and BGA component reliability, covering materials, design considerations, and manufacturing processes. Topics include solder joint reliability for both tin/lead and lead-free soldering processes, with an in-depth focus on the effects of voids on solder joint integrity and thermal performance.
Topics Include:- Classification and types of voids
- Solder joint void specifications, including IPC-7093, IPC J-STD-001, and J-STD-001 Automotive Addendum requirements
- Manufacturing influences on void formation:
- Pad design
- Solder paste
- Stenciling, reflow, and cleaning processes
- Solder joint reliability considerations for:
- Ball Grid Arrays (BGAs)
- Bottom Terminated Components (BTCs)
- Other electronic components
Who Should Attend: This course is designed for product design engineers, process engineers and technicians, and product reliability and safety engineers interested in understanding how solder joint voids impact BTC and BGA reliability.
