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Tuesday October 27, 2026 10:30am - 12:00pm CDT
Session Chair:
Session Co-Chair:

10:30am-11:00am
AOI Should Not Be Used as a Pass/Fail Gate: Applying SPC Principles to Inspection Data for Earlier Root Cause Identification in SMT
Presenter: Jeremy Orbach, Omron Automation USA

11:00am-11:30am
Computed Tomography (CT) vs. Computed Laminography CL for Non-Destructive Inspection of Printed Circuit Boards and Electronic Packages
Presenter: Vineeth Bastin, Comet Technologies USA Inc.
Co-Author: David Kruidhof, Comet Technologies USA Inc

11:30am-12:00pm
Failure Mechanism Investigation of NVMe Link Degradation from PCIe Gen4 to Gen3 Due to PCB Dielectric Collapse
Presenter: Zhipeng Wang, IBM Corporation
Speakers
avatar for Jeremy Orbach

Jeremy Orbach

Application Engineer II, Omron Automation Americas
Jeremy Orbach is an Applications Engineer and technical leader in electronics manufacturing focused on AOI, SPI, AXI, machine vision, and data-driven process improvement. At Omron Automation Americas, he supports customers in applying inspection systems not only to detect defects... Read More →
avatar for Vineeth Bastin

Vineeth Bastin

Senior Applications Engineer, Comet Technologies USA inc
Vineeth Bastin is a Senior Applications Engineer at Comet Yxlon, with over 15 years of experience in advanced electronics inspection systems. He has a strong track record in driving the adoption of X-ray, CT, and bond testing technologies, enhancing customer training programs, and... Read More →
avatar for Zhipeng Wang

Zhipeng Wang

Project Manager, IBM Corporation
Zhipeng (Grady) WangTitle:Project Manager, Global Supplier Test EngineeringOrganization:System Supply Chain, IBM CorporationBio:Grady is currently a Supply Chain Engineering Professional at IBM, where he specializes in test solution delivery for medium- to high-complexity server applications... Read More →
Tuesday October 27, 2026 10:30am - 12:00pm CDT
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