Name: LTS2: Low-Temperature Soldering Advances
Start: 2026-10-27T15:30:00-0500
End: 2026-10-27T16:30:00-0500

LTS2: Low-Temperature Soldering Advances

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

LTS

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and TCT Reliability
Presenter: Hongwen Zhang, Ph.D., Indium Corporation
Co-Authors: Danyang Zheng, Ph.D., Cassandra Goppert, Mengyao Wen, Yifan Wu Ph.D., Francis Mutuku Ph.D., Indium Corporation

4:00pm-4:30pm
Deformation and Damage Properties of Solder Joints Reflowed at Temperatures Between 80C and 140C
Presenter: Sai Reddy Munnangi, Ph.D., Binghamton University
Co-Authors: Anola Semndili, Ronit Das, Shantanu Joshi, Peter Borgesen, Binghamton University

Speakers

Hongwen Zhang

Principal Research Metallurgist & RnD Director, Indium Corporation

Dr. Hongwen Zhang is the Principal Research Metallurgist and Research & Development Director at Indium Corporation, with over eighteen years of experience in developing lead-free solder materials. He holds a Ph.D. in Materials Science and Engineering, along with master’s degrees... Read More →

Sai Reddy Munnangi

Student, Binghamton University

This is Sai Kiran, an Industrial and systems engineering PhD student from Binghamton University. My research is focused on Electronics Packaging, reliability testing of interconnects. My work includes identifying and characterizing Sn-Bi-In based alloys for low temperature applications... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
LTS

Conference Session, LTS Track

SMTA International 2026

Hongwen Zhang

Sai Reddy Munnangi

Get help with the event

SMTA International 2026

Hongwen Zhang

Sai Reddy Munnangi

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