Name: MFX9: Unique Processes for Assembly 2
Start: 2026-10-29T11:00:00-0500
End: 2026-10-29T12:00:00-0500

Thursday October 29, 2026 11:00am - 12:00pm CDT

Session Chair:
Session Co-Chair:

11:00am-11:30am
How Heavy Copper Designs Influence Through‑Hole Barrel Fill
Presenter: Mei Ming Khaw, Keysight Technologies
Co-Author: Xi Lin, Por, Keysight Technologies

11:30am-12:00pm
SMT Defects Bringing you Down? We’ve Got Solution
Presenters: Tony Lentz, FCT Solder & Greg Smith, StenTech, Inc

Speakers

Mei Ming Khaw

Material Reliability Program Manager, Keysight Technologies

Khaw Mei Ming holds a bachelor’s degree in Electronics and Computer Engineering and has 29 years of experience in the EMS and OEM industries. She has presented several technical papers at international conferences on topics ranging from PCB materials to PCA manufacturing processes... Read More →

Greg Smith

Technology Director, StenTech, Inc

Greg Smith has worked in the electronics industry since 1989. He owned a stencil manufacturing company for 23 years prior to joining BlueRing Stencils which has now merged with Stentech. He is currently the Technology Director for Stentech. Greg writes and presents white papers, works... Read More →

Tony Lentz

Chemist & Field Application, FCT Solder

Tony Lentz worked as a PCB manufacturing engineer from 1994-1999, and a lab manager from 1999-2012. Since 2013, he has worked in R&D and field application for FCT Solder. Tony is the vice-chair of the IPC JSTD-005 task group and chair-emeritus of the IPC J-STD-004 task group. Tony... Read More →

Thursday October 29, 2026 11:00am - 12:00pm CDT
MFX

Conference Session, MFX Track

SMTA International 2026

Mei Ming Khaw

Greg Smith

Tony Lentz

Get help with the event

SMTA International 2026

Mei Ming Khaw

Greg Smith

Tony Lentz

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