Name: AME4: Panel Discussion
Start: 2026-10-26T16:15:00-0500
End: 2026-10-26T17:00:00-0500

Monday October 26, 2026 4:15pm - 5:00pm CDT

Challenges with the Integration of Additive Circuits into Traditional SMT Process Workflows

Panelists:
Tom, Rovere, Lockheed Martin
John Williams, Boeing
Carolyn Ellinger, Eastman Kodak
Lindsey Mercurio, MacDermid Alpha

Speakers

Tom Rovere

LM Fellow, Lockheed Martin

Tom Rovere is a Research Scientist for Lockheed Martin Rotary and Mission Systems division in Owego, NY. In this capacity, he is responsible for research and development related to flexible hybrid electronics (FHE), printed electronics, antenna manufacturing, circuit card assembly... Read More →

Lindsey Mercurio

Primary Metallization Applications Specialist, MacDermid Alpha Electronics Solutions

Lindsey Mercurio is an Applications Specialist with MacDermid Alpha Electronics Solutions. In her role, Lindsey conducts the final stages of new product development including process parameter verification, customer site beta testing, and transition to full commercialization. She... Read More →

Carolyn Ellinger

VP, Printed Electronics, Eastman Kodak Company

Carolyn Ellinger is Vice President of Printed Electronics at Eastman Kodak Company. During her more than 30 years at Kodak, she has held a variety of technical and leadership roles spanning film systems, flexible displays, nanotechnology, semiconductor devices, MEMS-based devices... Read More →

John Williams

Boeing Engineering & Technology Innovation

Monday October 26, 2026 4:15pm - 5:00pm CDT
AME

Conference Session, AME Track

SMTA International 2026

Tom Rovere

Lindsey Mercurio

Carolyn Ellinger

John Williams

Get help with the event

SMTA International 2026

Tom Rovere

Lindsey Mercurio

Carolyn Ellinger

John Williams

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