Name: RHE9: Factors Affected Thermal Cycling Performance
Start: 2026-10-29T11:00:00-0500
End: 2026-10-29T12:00:00-0500

RHE9: Factors Affected Thermal Cycling Performance

Thursday October 29, 2026 11:00am - 12:00pm CDT

RHE

Session Chair:
Session Co-Chair:

11:00am-11:30am
Ball Grid Array Footprint Impacts on Reliability
Presenter: William Fox, Lockheed Martin
Co-Author: Ben Gumpert, Lockheed Martin

11:30am-12:00pm
Effects of Thermal Cycling on Electromigration Life of SnAgCu Solder Joints
Presenter: Anola Semndili, Binghamton University
Co-Authors: Sai Kiran Reddy Munnangi, Sitaram Panta, Eric Cotts, Ph.D., Peter Borgesen, Binghamton University

Speakers

William Fox

LM Fellow, Lockheed Martin

William Fox is a materials engineer specializing in failure analysis and laboratory operations. He earned a B.S. in Materials Science & Engineering from Purdue University and an M.S. in Materials Engineering from the University of Dayton. He has published papers in Journal of Nanomaterials... Read More →

Anola Semndili

Research Aide, Binghamton University

Anola Semndili is a third year Ph.D. student in Materials Science and Engineering at Binghamton University., Hher current research is on solder joint reliability including regular, high reliability and low temperature alloys under accelerated testing conditions of electromigration... Read More →

Thursday October 29, 2026 11:00am - 12:00pm CDT
RHE

Conference Session, RHE Track

SMTA International 2026

William Fox

Anola Semndili

Get help with the event

SMTA International 2026

William Fox

Anola Semndili

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

Get help with the event