SMTA International 2026: Full Schedule

7:30am CDT

SMTA Registration

Monday October 26, 2026 7:30am - 5:00pm CDT

LOBBY

Monday October 26, 2026 7:30am - 5:00pm CDT
LOBBY

Registration

8:30am CDT

AME Track Keynote Presentation: Hybrid Electronics - Accelerating Innovation and Adoption

Monday October 26, 2026 8:30am - 9:30am CDT

AME

Kick-Off SMTA International with the AME Track Keynote Presentation*This opening track keynote presentation is only available to paid conference participants Hybrid Electronics: Accelerating Innovation and AdoptionPresenter: Nick Morris, Ph.D., Deputy Director of Technology, NextFlexHybrid Electronics integrates additively manufactured electronic features including printed conductors,...
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Speakers

Nick Morris

Deputy Director of Technology, NextFlex

Monday October 26, 2026 8:30am - 9:30am CDT
AME

Conference Session, Keynote Presentation

8:30am CDT

PDC1: Solder Joint Voids: Impact on Bottom Terminated Components (BTCs) and Ball Grid Arrays Solder Joint Reliability

Monday October 26, 2026 8:30am - 12:00pm CDT

PDC1

Instructor: Dave Hillman, Hillman Electronic Assembly Solutions LLCCourse Overview: This workshop explores the impact of solder joint voids on BTC and BGA component reliability, covering materials, design considerations, and manufacturing processes. Topics include solder joint reliability for both tin/lead and lead-free soldering processes, with an in-depth focus on the effects of voids on solder...
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Speakers

David Hillman

Founder / CEO, Hillman EAS LLC

David D. Hillman was a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins/Collins Aerospace in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his... Read More →

Monday October 26, 2026 8:30am - 12:00pm CDT
PDC1

Professional Development Course

8:30am CDT

PDC2: Mastering Intermetallics for Reliable Electronics

Monday October 26, 2026 8:30am - 12:00pm CDT

PDC2

Instructor: Dr. Jennie S. Hwang, Ph.D., D.Sc. H-Technologies Group Course Overview: Intermetallic compounds (IMCs) play a critical role in electronic interconnection reliability, influencing solder joint integrity and overall product performance at the chip, package, and board levels. This course provides a comprehensive understanding of IMC formation, evolution, and control throughout the entire...
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Monday October 26, 2026 8:30am - 12:00pm CDT
PDC2

Professional Development Course

8:30am CDT

PDC3: Data-Driven Solder Paste Qualification

Monday October 26, 2026 8:30am - 12:00pm CDT

PDC3

Instructor: Chrys Shea Shea Engineering Services Course Overview: Selecting a new solder paste can be a complex process with many factors to consider, including printability, reflow performance, reliability, and supplier support. This course introduces a data-driven approach to solder paste qualification using a structured scorecard methodology to evaluate candidate materials based on...
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Speakers

Chrys Shea

Founder, SHEA Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction,” an SMTA “Distinguished Speaker” and four-time... Read More →

Monday October 26, 2026 8:30am - 12:00pm CDT
PDC3

Professional Development Course

8:30am CDT

PDC4: Principles and Practice of Developing Soldering Profiles

Monday October 26, 2026 8:30am - 12:00pm CDT

PDC4

Instructor: Ray Prasad SMT Consultant and Author, SMT Principles and Practice Course Overview: Based on IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes, this course provides practical guidance on developing, measuring, and controlling thermal profiles to reduce soldering defects and improve product quality and reliability. Participants will learn best practices for...
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Monday October 26, 2026 8:30am - 12:00pm CDT
PDC4

Professional Development Course

10:00am CDT

AME1: Additive Processes for Circuit Manufacture

Monday October 26, 2026 10:00am - 11:30am CDT

AME

Session Chair: Prathiksha Ramprasad Dhanpal, Westcliff UniversitySession Co-Chair: 10:00am-10:30amNext Generation Direct Metallization Processes are Adaptable to the Evolving Printed Circuit Board Material LandscapePresenter: Lindsey Mercurio, MacDermid Alpha Electronics Solutions 10:30am-11:00amHigh Resolution Copper Printed RF DevicesPresenter: Tom Rovere, Lockheed...
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Speakers

Lindsey Mercurio

Primary Metallization Applications Specialist, MacDermid Alpha Electronics Solutions

Lindsey Mercurio is an Applications Specialist with MacDermid Alpha Electronics Solutions. In her role, Lindsey conducts the final stages of new product development including process parameter verification, customer site beta testing, and transition to full commercialization. She... Read More →

Tom Rovere

LM Fellow, Lockheed Martin

Tom Rovere is a Research Scientist for Lockheed Martin Rotary and Mission Systems division in Owego, NY. In this capacity, he is responsible for research and development related to flexible hybrid electronics (FHE), printed electronics, antenna manufacturing, circuit card assembly... Read More →

Carolyn Ellinger

VP, Printed Electronics, Eastman Kodak Company

Carolyn Ellinger is Vice President of Printed Electronics at Eastman Kodak Company. During her more than 30 years at Kodak, she has held a variety of technical and leadership roles spanning film systems, flexible displays, nanotechnology, semiconductor devices, MEMS-based devices... Read More →

Monday October 26, 2026 10:00am - 11:30am CDT
AME

Conference Session, AME Track

12:30pm CDT

AME2: Embedded and Conformal Electronics

Monday October 26, 2026 12:30pm - 2:00pm CDT

AME

Session Chair: Karen Ebner, Raytheon TechnologiesSession Co-Chair: Audrey Lee, Collins Aerospace----------------------------------------- 12:30pm-1:00pmThermal and Moisture Reliability of In-Mold Gravure Offset Additive Circuits for Automotive ApplicationsPresenter: Pradeep Lall, Ph.D., Auburn UniversityCo-Authors: Padma Choudhury, Auburn University; Scott Miller, NextFlex National...
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Speakers

Pradeep Lall, Ph.D.

Professor, Auburn University

Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of Auburn University’s Electronics Packaging Research Institute. He holds Joint Courtesy Appointments in the Department of Electrical and... Read More →

Nate Bode

Director of Strategy and Growth, Impossible Objects

Dr. Nate Bode is the Director of Strategy and Growth at Impossible Objects, a high-speed additive manufacturing company. This role encompasses supporting core company initiatives including leading government grant work, new market entry, and fundraising. Dr. Bode brings to this... Read More →

Douglas Schardt

Komori America Corporation

Douglas Schardt is currently the Director of Printed Electronics for Komori America Corp., a global supplier of industrial printing equipment, headquartered in Rolling Meadows, IL. Previously he held the title of Director of Product Management which necessitated a knowledge of equipment... Read More →

Monday October 26, 2026 12:30pm - 2:00pm CDT
AME

Conference Session, AME Track

1:00pm CDT

MFX1: Reflow Technology

Monday October 26, 2026 1:00pm - 2:30pm CDT

MFX

Session Chair: Ram Wissel, KYZEN Corporation Session Co-Chair: Colette Anctil, Collins Aerospace1:00pm-2:30pm Impact of Fixture Material on Thermal Stability and Process Performance in Reflow Soldering Presenter: Ricardo Chuma, 2B Automacao 2:30pm-3:00pm Impact of Operation Environment and Flux Residues on the Electrochemical Reliability of In Bi SAC Solder Paste Presenter: Sirine Bayram,...
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Speakers

Ricardo Chuma

Co-Owner and Engineering Director, 2B AUTOMACAO E USINAGEM

Ricardo Chuma is Co-Owner and Engineering Director at 2B Automacao e Usinagem, a Brazilian company specializing in tooling and fixtures for the electronics manufacturing industry. He leads engineering initiatives focused on SMT and PTH process optimization, including the development... Read More →

Sirine Bayram

Senior Research Scientist, AIM Solder

Sirine Bayram is a Senior Research Scientist at AIM Solder specializing in solder paste product development and innovation. She holds a Master's degree in Chemistry from the American University of Beirut and a Ph.D. in Chemistry from McGill University. Dr. Bayram has published in... Read More →

Mathilde BURET

R&D Soldering Engineer, Inventec Performance Chemicals

Mathilde has a master's degree in Chemistry within a chemical engineering school in France, specialized in Formulation Chemistry. She's been part of Inventec Performance Chemicals since 2018. She's working as an R&D soldering engineer with expertise in soldering fluxes and pastes... Read More →

Monday October 26, 2026 1:00pm - 2:30pm CDT
MFX

Conference Session, MFX Track

1:30pm CDT

WLP: Invited Keynote Presentations & Panel Discussion

Monday October 26, 2026 1:30pm - 3:30pm CDT

WLP

Monday October 26, 2026 1:30pm - 3:30pm CDT
WLP

Women's Leadership Program, Free Event

2:30pm CDT

AME3: Interconnection and Ablation Processes for Additive Circuits

Monday October 26, 2026 2:30pm - 4:00pm CDT

AME

Session Chair:Session Co-Chair:2:30pm-3:00pmChallenges of Low Temperature Component AttachPresenter: Kalsi Kwan, Boeing Engineering & Technology Innovation3:00pm-3:30pmEnhanced Design Rules and Optimization for Laser DepanelingPresenter: Jake Benz, LPKF Laser & Electronics SECo-Author: Patrick Stockbruegger, M.Sc., LPKF Laser & Electronics SE 3:30pm-4:00pmJunction Formation Through Photonic...
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Speakers

Kalsi Kwan

Boeing Engineering & Technology Innovation

Kalsi Kwan is a principal investigator with the Additive Electronics Technology group within Engineering & Technology Innovation (E&TI) in Huntsville, AL. Kalsi specializes in novel process development for Flexible Hybrid Electronics for next-generation products. She has been with... Read More →

Jake Benz

Sales Manager, LPKF Laser & Electronics SE

Jake Benz is the Production Laser Systems Sales Manager at LPKF Laser and Electronics, where he leads sales efforts for LPKF’s Laser Induced Deep Etching (LIDE) technology, PCB Laser Depaneling, and SMT Stencil Laser equipment in North America. Based in Portland, OR, Jake plays... Read More →

Vahid Akhavan

Director of Transitional Technologies, PulseForge

Dr. Vahid Akhavan is the Director of Transitional Technologies at PulseForge. Enabling the next generation of electronic devices by drawing on his expertise in colloidal synthesis, additive manufacturing and kinetic thermal processing. He has over 20 peer-reviewed publications, several... Read More →

Tom Rovere

LM Fellow, Lockheed Martin

Monday October 26, 2026 2:30pm - 4:00pm CDT
AME

Conference Session, AME Track

3:00pm CDT

MFX2: AI & Smart Factory Evolution

Monday October 26, 2026 3:00pm - 5:00pm CDT

MFX

Session Chair: James Elliott Fowler, Sandia National LabsSession Co-Chair:3:00pm-3:30pm Industrial AI in Electronics Manufacturing: A Comprehensive Review of State-of-the-Art Applications, Challenges, and Future Directions Presenter: Sai Kolli, Foxconn Industrial Internet (FII)Co-Authors: Edward Wong, Fii; Daryl Santos, Ph.D., Binghamton University3:30pm-4:00pm Solving SMT Component...
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Speakers

Sai Kolli

Project Manager, Foxconn Industrial Internet (FII)

Sai Srikanth is a Project Manager at Foxconn Industrial Internet (FII) and a PhD candidate in Industrial and Systems Engineering at Binghamton University – State University of New York. His research focuses on manufacturing systems, advanced optimization approaches, Artificial Intelligence... Read More →

Cameron Sobie

Director of AI Strategy, Arch Systems, Arch Systems

Cameron Sobie is the Director of AI Strategy at Arch Systems, where he focuses on identifying where emerging AI capabilities can unlock value in manufacturing and leads the transformation of those ideas into deployed solutions. His work drives bottom line results by helping manufacturers... Read More →

Chris Dayney

Technical Marketing Manager, Fuji America Corporation

Technical Marketing Manager for Fuji America Corporation, headquartered in Vernon Hills, IL. Based in Crossville, TN, Chris brings 30 years of expertise in the SMT industry to his role. He spent 3 years as Regional Sales Manager and 25 years as an Instructor and Training Team Leader... Read More →

Athula Kulatunga

Professor of Electrical Engineering Technology, Purdue University Northwest

Prof. Dr. N. Athula Kulatunga is an Electrical Engineering Technology (EET) professor at Purdue University Northwest (PNW) and served as department head from 2015 to 2022. Previously, he taught and conducted research for 15 years at Purdue University in West Lafayette, where he was... Read More →

Monday October 26, 2026 3:00pm - 5:00pm CDT
MFX

Conference Session, MFX Track

4:00pm CDT

WLP: Round Table Discussions

Monday October 26, 2026 4:00pm - 5:00pm CDT

WLP

Monday October 26, 2026 4:00pm - 5:00pm CDT
WLP

Women's Leadership Program, Free Event

4:15pm CDT

AME4: Panel Discussion

Monday October 26, 2026 4:15pm - 5:00pm CDT

AME

Challenges with the Integration of Additive Circuits into Traditional SMT Process Workflows

Panelists:
Tom, Rovere, Lockheed Martin
John Williams, Boeing
Carolyn Ellinger, Eastman Kodak
Lindsey Mercurio, MacDermid Alpha

Speakers

Tom Rovere

LM Fellow, Lockheed Martin

Lindsey Mercurio

Primary Metallization Applications Specialist, MacDermid Alpha Electronics Solutions

Carolyn Ellinger

VP, Printed Electronics, Eastman Kodak Company

John Williams

Boeing Engineering & Technology Innovation

Monday October 26, 2026 4:15pm - 5:00pm CDT
AME

Conference Session, AME Track

5:00pm CDT

WLP: Connection Reception

Monday October 26, 2026 5:00pm - 6:00pm CDT

WLP

Monday October 26, 2026 5:00pm - 6:00pm CDT
WLP

Women's Leadership Program, Free Event

7:30am CDT

SMTA Registration

Tuesday October 27, 2026 7:30am - 7:00pm CDT

LOBBY

Tuesday October 27, 2026 7:30am - 7:00pm CDT
LOBBY

Registration

8:30am CDT

RHE1: Microstructure and Reliability

Tuesday October 27, 2026 8:30am - 10:00am CDT

RHE

Session Chair: Thomas Zanatta, ITM ConsultingSession Co-Chair: Jia-Xin Ooi, Keysight Technologies 8:30am-9:00am The Effect of Component Construction and Microstructure on the Thermal Cycling Performance of Reverse Hybrid Ball Grid Array Assemblies Presenter: Richard Coyle, Ph.D., Nokia Bell Labs Co-Authors: See paper for full co-author listing9:00am-9:30am Microstructure Evolution and Failure...
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Speakers

Richard Coyle

Consulting Member of the Technical Staff, Nokia Bell Labs

Richard Coyle is a Consulting Member of the Technical Staff in the Reliability Engineering organization at Nokia in Murray Hill, NJ. He is responsible for evaluating the reliability and quality of electronic assemblies in the Bell Labs Interconnection Failure Analysis Lab. Richard... Read More →

Chris Gourlay

Professor of Physical Metallurgy, Imperial College London

Chris is a Professor of Physical Metallurgy in the Department of Materials at Imperial College London. His group studies the origins of microstructure in phase transformations and microstructure stability. In recent years, research in the group has targeted understanding and controlling... Read More →

Keith Sweatman

Senior Technical Advisor, Nihon Superior Co., Ltd

Australia-based Keith Sweatman is a graduate in metallurgical engineering who, in technical and management roles with the International Tin Research Institute, Multicore Solders, and most recently Nihon Superior Co. Ltd, has accumulated 50 years’ experience in the electronics manufacturing... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
RHE

Conference Session, RHE Track

8:30am CDT

Back 2 Basics Session 1: From Design to Fab

Tuesday October 27, 2026 8:30am - 10:00am CDT

WFD

Back to BasicsWhether you’re new to electronics manufacturing or strengthening your foundational knowledge, Back to Basics provides a practical introduction to the PCB ecosystem. This full-day track at SMTA International features ten sessions led by industry practitioners covering the processes, equipment, and decisions that drive quality on the manufacturing floor.Session Presentations"PCB...
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Tuesday October 27, 2026 8:30am - 10:00am CDT
WFD

Special Event, Back 2 Basics

8:30am CDT

PDC5: AI-Powered Manufacturing: From Fundamentals to Factory Impact

Tuesday October 27, 2026 8:30am - 12:00pm CDT

PDC5

Instructor: Dr. Jennie S. Hwang, Ph.D., D.Sc. H-Technologies Group Course Overview: Artificial Intelligence is transforming modern manufacturing, creating new opportunities to improve quality, productivity, supply chain performance, and decision-making. This course provides an accessible introduction to AI fundamentals and explores how these technologies are being applied on the manufacturing...
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Tuesday October 27, 2026 8:30am - 12:00pm CDT
PDC5

Professional Development Course

8:30am CDT

PDC6: Assembly: Best Practices for Improving Manufacturing Productivity

Tuesday October 27, 2026 8:30am - 12:00pm CDT

PDC6

Instructors: Jim Hall & Phil Zarrow ITM Consulting Course Overview: This course provides practical strategies for improving productivity, quality, and yield in electronic assembly operations. Participants will explore how non-optimal processes, materials, equipment, and procedures can impact manufacturing performance and financial success. The course identifies common assembly challenges and...
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Tuesday October 27, 2026 8:30am - 12:00pm CDT
PDC6

Professional Development Course

8:30am CDT

PDC7: Design and Assembly Process Challenges for Bottom Termination Components (BTCs) in Tin-Lead and Lead-Free Applications

Tuesday October 27, 2026 8:30am - 12:00pm CDT

PDC7

Instructor: Ray Prasad SMT Consultant and Author, SMT Principles and Practice Course Overview: Bottom Termination Components (BTCs), including QFN, DFN, SON, LGA, and MLF packages, present unique design, assembly, inspection, and reliability challenges due to their hidden solder connections and sensitivity to process variation. This course provides practical guidance for successfully implementing...
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Tuesday October 27, 2026 8:30am - 12:00pm CDT
PDC7

Professional Development Course

9:00am CDT

INS1: AI Infiltrates Inspection: Latest from the Coalface

Tuesday October 27, 2026 9:00am - 10:00am CDT

INS

Session Chair: Robert Boguski, Datest Corporation
Session Co-Chair:

9:00am-9:30am
Counterfeit Detection as an AI-Based AOI Software Add-On
Presenter: Eyal Weiss, Ph.D., Cybord

9:30am-10:00am
AI-Native Automated Optical Inspection: Sub-10-Minute Programming for New Boards with Low False-Call Rates
Presenter: Collin Stoner, Selene Photonics

Speakers

Eyal Weiss

Founder & CTO, Cybord

Dr. Eyal Weiss is the Founder and Chief Technology Officer (CTO) of Cybord, a company specializing in AI-driven solutions for electronic manufacturing that protect against counterfeit and tampered components, providing full transparency and resilience across the supply chain. With... Read More →

Collin Stoner

Consulting Engineer, Selene Photonics Inc.

Collin Stoner is an electronics and product design consultant and the Owner and Principal Consulting Engineer of Selene Photonics Inc. (DBA NVZN Labs), where he leads a team that designs custom electronics and manufactures PCBAs for clients across aerospace, defense, and emerging-technology... Read More →

Tuesday October 27, 2026 9:00am - 10:00am CDT
INS

Conference Session, INS Track

9:00am CDT

MFX Track Keynote Presentation: AI Infrastructure Technology: Driving Forces, Challenges & Key Directions

Tuesday October 27, 2026 9:00am - 10:00am CDT

MFX

Join the Manufacturing for Excellence (MFX) track keynote on Tuesday morning!*This opening track keynote presentation is only available to paid conference participants AI Infrastructure Technology Driving Forces, Challenges & Key DirectionsAI infrastructure growth is driven by surging computational demand from increasingly large & complex generative AI models as companies shift to massive,...
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Speakers

Jung Yoon, Ph.D.

Distinguished Engineer & CTO, Supplier Technology & Quality, IBM Supply Chain

Jung is a Distinguished Engineer & CTO of IBM Supply Chain. He is a recognized industry leading expert in DRAM, Flash, SSDs, and semiconductor devices, and drives technology convergence between industry capabilities and IBM’s strategic product offerings across IBM’s server infrastructure... Read More →

Tuesday October 27, 2026 9:00am - 10:00am CDT
MFX

Conference Session, Keynote Presentation

10:30am CDT

INS2: Cautionary Tales from Imaging Analysis

Tuesday October 27, 2026 10:30am - 12:00pm CDT

INS

Session Chair: David Dworak, Dymax CorporationSession Co-Chair:10:30am-11:00am AOI Should Not Be Used as a Pass/Fail Gate: Applying SPC Principles to Inspection Data for Earlier Root Cause Identification in SMT Presenter: Jeremy Orbach, Omron Automation USA 11:00am-11:30am Computed Tomography (CT) vs. Computed Laminography CL for Non-Destructive Inspection of Printed Circuit Boards and Electronic...
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Speakers

Jeremy Orbach

Application Engineer II, Omron Automation Americas

Jeremy Orbach is an Applications Engineer and technical leader in electronics manufacturing focused on AOI, SPI, AXI, machine vision, and data-driven process improvement. At Omron Automation Americas, he supports customers in applying inspection systems not only to detect defects... Read More →

Vineeth Bastin

Senior Applications Engineer, Comet Technologies USA inc

Vineeth Bastin is a Senior Applications Engineer at Comet Yxlon, with over 15 years of experience in advanced electronics inspection systems. He has a strong track record in driving the adoption of X-ray, CT, and bond testing technologies, enhancing customer training programs, and... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
INS

Conference Session, INS Track

10:30am CDT

MFX3: Cleaning & Coating

Tuesday October 27, 2026 10:30am - 12:00pm CDT

MFX

Session Chair: Kristen Eckart, Lockheed MartinSession Co-Chair: Ram Wissel, KYZEN Corporation 10:30am-11:00am Assessing SMT Component Compatibility and Reliability in Assembly and Cleaning Processes Presenter: Chelsea Jewell, KYZEN CorporationCo-Author: Nicholas Ostrom, Lockheed Martin 11:00am-11:30am What is a Sufficient Rinse? Presenter: Vladimir Sitko, PBT Works 11:30am-12:00pm Process...
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Speakers

Chelsea Jewell

Application Lab Manager, KYZEN Corporation

Chelsea Jewell is the Application Lab Manager at KYZEN, supporting electronics and advanced manufacturing customers with precision cleaning processes. She works closely with customers to evaluate cleaning challenges, develop data-driven process recommendations, and support implementation... Read More →

Vladimir Sitko

Founder / CEO, PBT Works

Vladimir Sitko is the founder and mentor of PBT Works s.r.o., a recognized manufacturer of cleaning equipment for electronic assemblies. After completing his studies at the Technical University, he began his career nearly 50 years ago as a designer of measuring instruments for silicon... Read More →

Mike Bixenman

SME Cleaning and Reliability, Magnalytix, LLC

Dr. Mike Bixenman is a Subject Matter Expert in Cleaning and Reliability. He has over 35 years of experience in designing electronic assembly cleaning materials and integrating processes. Sharing his research, knowledge, and expertise is Mike’s passion. He believes in the power... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
MFX

Conference Session, MFX Track

10:30am CDT

RHE2: Alloying Effects on Performance

Tuesday October 27, 2026 10:30am - 12:00pm CDT

RHE

Session Chair: Francis Mutuku, Indium CorporationSession Co-Chair: 10:30am-11:00am Revisiting Silver-Content in Lead-Free Alloys: Reliability of Low-Cost Alternatives to SAC305 in Modern Electronics Assembly Presenter: Anna Lifton, MacDermid Alpha Electronics SolutionsCo-Authors: Kennedy Fox, Suraj Saifullah, Ebad Rehman, MacDermid Alpha Electronics Solutions 11:00am-11:30am Effect of...
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Speakers

Anna Lifton

Director R&D Application -Circuit Board Assembly, MacDermid Alpha Electronics Solutions

Anna Lifton is R&D Director at Macdermid Alpha Assembly Solutions, overseeing Application, Reliability, and Failure Analysis for the Circuit Board Assemblies business unit. With a Bachelor's degree from Moscow Steel and Alloys Institute, Russia, and a Master's degree in Material Science... Read More →

Waad Tarman

Ph.D. Candidate, Auburn University

Waad Tarman is a Ph.D. candidate in Industrial and Systems Engineering at Auburn University. Her research focuses on the mechanical and microstructural reliability of lead-free solder joints in electronic assemblies, with an emphasis on solder alloy composition, thermal aging, surface... Read More →

Pritha Choudhury

Principal R&D Scientist, MacDermid Alpha Electronics Solutions India Pvt. Ltd.

Pritha Choudhury is a Principal R&D Scientist with MacDermid Alpha Electronics Solutions (MAES), Bangalore, India. She has a Ph.D. in Metallurgical and Materials Engineering from the Indian Institute of Technology, Kharagpur, India. She has been working for MAES since 2011. Her... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
RHE

Conference Session, RHE Track

10:30am CDT

Back 2 Basics Session 2: SMT Assembly Essentials

Tuesday October 27, 2026 10:30am - 12:00pm CDT

WFD

Tuesday October 27, 2026 10:30am - 12:00pm CDT
WFD

Special Event, Back 2 Basics

10:30am CDT

Workforce Development & Student Technical Session

Tuesday October 27, 2026 10:30am - 4:00pm CDT

EMAC

The Workforce Development and Student Technical Sessions are designed to engage both students and industry professionals through keynote presentations, interactive tables, and focused technical content on emerging technologies in electronics manufacturing.RegistrationFree and open to the public. RSVP for this session when registering for SMTA International.Workforce Development SessionThe session...
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Tuesday October 27, 2026 10:30am - 4:00pm CDT
EMAC

Special Event, Workforce Development

12:00pm CDT

Next Gen Connect: Pizza and Perspectives

Tuesday October 27, 2026 12:00pm - 1:30pm CDT

SLYCE Restaurant @ Embassy Suites Rosemont

Next Gen Connect: Pizza and Perspectives brings students, young professionals, and experienced industry leaders together for an informal lunch focused on career guidance, shared knowledge, and meaningful connections.Held over pizza at Slyce, this event is designed to help the next generation of electronics manufacturing professionals meet longtime SMTA members, chapter leaders, committee...
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Tuesday October 27, 2026 12:00pm - 1:30pm CDT
SLYCE Restaurant @ Embassy Suites Rosemont 5500 N River Rd, Rosemont, IL 60018, United States

Special Event, Student & Young Professionals

1:00pm CDT

MFX4: OPS Excellence & Box Level Assembly

Tuesday October 27, 2026 1:00pm - 3:00pm CDT

MFX

Session Chair: Gregory Vance, Rockwell AutomationSession Co-Chair: Colette Anctil, Collins Aerospace 1:00pm-1:30pmLine SPOCK: A Holistic Approach to Statistical Process Optimization, Control, and Kinematics in High-Frequency SMT Performance ValidationPresenter: Michael Sivigny, CeTaQ Americas 1:30pm-2:00pm Factors in Maximizing the Return on an Investment in AutomationPresenter: Troy Gueller,...
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Speakers

Troy Gueller

Senior Project Engineer, Rockwell Automation

Troy Gueller is a Senior Project Engineer at Rockwell Automation, where he leads Automation initiatives across the company’s global footprint. With a career of over 30+ years, Troy brings a unique blend of hands-on technical expertise and overall process vision. He has a strong... Read More →

Michael Sivigny

Owner/General Manager, CeTaQ Americas

Michael Sivigny, now in his 25th year as owner and General Manager of CeTaQ Americas, built the company from the ground up after recognizing an opportunity in February 2001. The parent company, CeTaQ GmbH, based in Dresden, Germany, pioneered a mobile measurement solution in 1996... Read More →

Ed Dodd

VP of Government and Defense, Cofactr

A Navy veteran with twenty years of experience in electronics assurance for critical applications, Ed Dodd is currently working on improving parts management and industry supply chain processes. He currently serves as the Vice President, Government and Defense for Cofactr, a leading... Read More →

Dave Dworak

Material Scientist, Dymax Corporation

Dave has over 20 years of adhesive chemistry and formulation experience. He has worked as a polymer chemistspecializing in polyurethane synthesis and formulations as well as living radical polymerization of novel polyacrylates.Dave received his chemistry degree from the University... Read More →

Tuesday October 27, 2026 1:00pm - 3:00pm CDT
MFX

Conference Session, MFX Track

1:00pm CDT

RHE3: Conformal Coating and Reliability 1

Tuesday October 27, 2026 1:00pm - 3:00pm CDT

RHE

Session Chair: Sal Sparacino, ZESTRON CorporationSession Co-Chair: Carol Doscher, MDI Power 1:00pm-1:30pm Effect of Standoff Height, Pitch, and Component Type on Conformal Coating Ingress and Solder Joint Reliability in BGA and BTC Assemblies Presenter: Suraj Saifullah, MacDermid Alpha Electronics SolutionsCo-Authors: Kennedy Fox, Anna Lifton, MacDermid Alpha Electronics Solutions...
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Speakers

Jayse McLean

Senior Engineer, John Deere Intelligent Solutions Group

Jayse is a senior engineer in the advanced engineering group as a part of the overall John Deere Intelligent Solutions Group. He has a Bachelor of Science and Master of Science in Mechanical Engineering from North Dakota State University. He has worked at Deere for 7 years and during... Read More →

Suraj Saifullah

Application Engineer, MacDermid Alpha Electronics Solutions

Suraj Saifullah has worked at MacDermid Alpha Electronics Solutions for two years as an application engineer. He holds a master’s degree in chemical engineering from Columbia University and a bachelor’s in chemistry from Case Western Reserve University. His research focuses on... Read More →

Andrea Charif

Lead Application Engineer, Henkel Corporation

Andrea Charif, Ph.D., is a polymer scientist with over 10 years of experience delivering high-performance solutions in application development for materials across the automotive and electronics industries. Her expertise centers on material selection, testing, and implementation to... Read More →

Michael Osterman

Research Scientist, CALCE/University of Maryland

Michael Osterman is a Research Scientist and the Operations Director for the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland. In addition, he leads the development of the calceSARA software for printed-board assembly-level reliability assessment... Read More →

Tuesday October 27, 2026 1:00pm - 3:00pm CDT
RHE

Conference Session, RHE Track

1:00pm CDT

Back 2 Basics Session 3: Solder, Repair & Protect

Tuesday October 27, 2026 1:00pm - 3:00pm CDT

WFD

Tuesday October 27, 2026 1:00pm - 3:00pm CDT
WFD

Special Event, Back 2 Basics

1:30pm CDT

INS3: Eat Your Vegetables, Part I: Test Methods You Need to Know

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

INS

Session Chair: Gary TanelSession Co-Chair: 1:30pm-2:00pm Process Qualification to J-STD-001 Section 8 CleanlinessPresenter: Mike Bixenman, Ph.D., Magnalytix, LLCCo-Author: Zach Papiez, Magnalytix, LLC 2:30pm-3:00pm Mitigation Strategies for Failures Resulting from Ionizing Radiation Presenter: David Kruidhof, Comet Technologies USA, Inc.Co-Author: Vineeth Bastin, Comet Technologies USA, Inc....
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Speakers

Mike Bixenman

SME Cleaning and Reliability, Magnalytix, LLC

David Kruidhof

Technical Sales Manager, Comet Technologies USA, Inc.

David Kruidhof is the Technical Sales Manager for Comet Yxlon, who provide X-ray, laminography, and CT inspection systems for R&D labs and production environments, especially for semiconductor manufacturers and PCB assemblers. In his role at Comet Yxlon, David is responsible for technical... Read More →

Matt Turpin

Sr. Test Engineer, Datest Corporation

Matt Turpin is Sr. Test Engineer at Datest, responsible for ICT program and fixture development, and pre-development mechanical and electrical DFT analysis. Matt has over 45 years’ experience in testing and test engineering, primarily with Zehntel, Teradyne, and HP/Agilent/Keysight... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
INS

Conference Session, INS Track

1:30pm CDT

LTS1: Low-Temperature Solder Materials

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

LTS

Session Chair: Ronald Lasky, Ph.D., P.E., Dartmouth CollegeSession Co-Chair: Paul E. Wang Ph.D., Mitac Corporation 1:30pm-2:00pm Reliability performance and challenges of Bi-Sn based Homogeneous Low Temperature Solder Joint Presenter: Choongpyo Jeon, Samsung Electronics Co-Authors: Soojin Yoo, Seungjin Oh, Keunho Rhew, Yuchul Hwang, Kichul Chun, Samsung Electronics2:00pm-2:30pm Electrical...
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Speakers

Choongpyo Jeon

Reliability Engineer, Samsung Electronics

Choongpyo Jeon has more than 15 years of experience as a reliability engineer at Samsung Electronics. His work focuses on semiconductor package reliability assessment, modeling, and standardization. He currently manages board-level reliability activities, resolves reliability issues... Read More →

Frances Holcomb

Research Assistant, Binghamton University

Frances Holcomb is a student at Binghamton university in physics and mathematics. She conducts materials science research in Dr. Eric Cotts laboratory. She is investigating the factors which influence the resistivity of alloys such as tin bismuth, as well as models which describe... Read More →

Martijn Mulder

Process & Quality Engineering Lead, Mat-Tech BV

Martijn Mulder is at present affiliated at the Development & Testing department of Mat-Tech BV (TheNetherlands) in the role of Process & Quality Engineering Lead. His tasks consist of addressing quality issues andresearching new ways to join similar and dissimilar materials.His primary... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
LTS

Conference Session, LTS Track

3:30pm CDT

LTS2: Low-Temperature Soldering Advances

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

LTS

Session Chair: Kristen Eckart, Lockheed MartinSession Co-Chair: Anthony Rafanelli3:30pm-4:00pm Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and TCT Reliability Presenter: Hongwen Zhang, Ph.D., Indium CorporationCo-Authors: Danyang Zheng, Ph.D., Cassandra Goppert, Mengyao Wen, Yifan Wu Ph.D., Francis...
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Speakers

Hongwen Zhang

Principal Research Metallurgist & RnD Director, Indium Corporation

Dr. Hongwen Zhang is the Principal Research Metallurgist and Research & Development Director at Indium Corporation, with over eighteen years of experience in developing lead-free solder materials. He holds a Ph.D. in Materials Science and Engineering, along with master’s degrees... Read More →

Sai Reddy Munnangi

Student, Binghamton University

This is Sai Kiran, an Industrial and systems engineering PhD student from Binghamton University. My research is focused on Electronics Packaging, reliability testing of interconnects. My work includes identifying and characterizing Sn-Bi-In based alloys for low temperature applications... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
LTS

Conference Session, LTS Track

3:30pm CDT

INS4: Eat Your Vegetables, Part II: Test Methods You Need to Know

Tuesday October 27, 2026 3:30pm - 5:00pm CDT

INS

Session Chair: Session Co-Chair: 3:30pm-4:00pm FCT for RF/High Speed Applications with Test Probes. Strategies, Pitfalls and How to Avoid Those Presenter: Matthias Zapatka, Ingun USA 4:00pm-4:30pm A Three-Camera based Digital Image Correlation System for Warpage Measurement and CTE Distribution Analysis Presenters: Liam Crosbie, Dantec Dynamics Co-Author: LiKang Luan, Dantec Dynamics...
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Speakers

Matthias Zapatka

Senior FAE, INGUN USA, Inc.

Matthias is the co-founder and Sr. FAE at INGUN USA, Inc. the North American subsidiary of the INGUN group. He has been in the PCBA test industry for over 18 years. Matthias is a frequent speaker at industry related events. Matthias' academic background is RF&Wireless technologies... Read More →

Liam Crosbie

R&D Manager, Dantec Dynamics

Liam Crosbie works as the Research, Development & Product Manager for the Solids Division at Dantec Dynamics in Ulm, Germany. He has over 15 years worth of professional work experience in the materials testing industry, focusing on the application, product & streategic development... Read More →

Chris Nicholson

Product Manager, Comet X-ray

Originally from Scotland, Chris Nicholson completed his PhD in 2018 at the Max Planck Institute in Berlin focusing on laser-induced phase transitions at metal-semiconductor interfaces. Following postdoctoral research he transitioned to industry as an application scientist for electron... Read More →

Tuesday October 27, 2026 3:30pm - 5:00pm CDT
INS

Conference Session, INS Track

3:30pm CDT

RHE4: Conformal Coating and Reliability 2

Tuesday October 27, 2026 3:30pm - 5:00pm CDT

RHE

Session Chair: Chintan Sanghani, SLBSession Co-Chair: Brian Toleno, MateriaSolve3:30pm-4:00pm How to Know If Your Conformal Coating Process is Good or Not Presenter: Jason Keeping, P.E., Celestica 4:00pm-4:30pm Defects in Conformal Coating Presenter: Doug Pauls, ItDepends Electronics LLC & Deb Vorwald, Collins Aerospace 4:30pm-5:00pm BGA Solder Joint Solder Joint Reliability...
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Speakers

Jason Keeping

Staff Engineer, Celestica Inc.

Jason Keeping is the Global Process Subject Matter Expert for Ruggedized Electronics at Celestica. He holds a B.A.Sc. in Electrical Engineering, is a Six Sigma/Lean Professional, and a licensed professional engineer. With more than 15 years of experience, Jason specializes in conformal... Read More →

Doug Pauls

Sr. Technical Fellow, ItDepends Electronics LLC

Doug is a Material Scientist with degrees in Chemistry, Physics and Electrical Engineering.He worked 9 years for the Navy, 8 years as Technical Director of Contamination Studies Labs, and 24 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering... Read More →

David Hillman

Founder / CEO, Hillman EAS LLC

Tuesday October 27, 2026 3:30pm - 5:00pm CDT
RHE

Conference Session, RHE Track

3:30pm CDT

Back 2 Basics Session 4: Test & Verify + Guided Expo Walk

Tuesday October 27, 2026 3:30pm - 5:00pm CDT

WFD

Tuesday October 27, 2026 3:30pm - 5:00pm CDT
WFD

Special Event, Back 2 Basics

3:30pm CDT

MFX5: Solder Paste Printing & Reliability

Tuesday October 27, 2026 3:30pm - 5:30pm CDT

MFX

Session Chair: Maurice Dore, ValeoSession Co-Chair: Jeff Schake, ASMPT SMT Solutions3:30pm-4:00pmAre Gaps Bad for Printing? Presenter: Hong Kim Lee, Indium Corporation 4:00pm-5:00pmReliability Evaluation of Low-Silver Solder Alloy Solder Paste Presenter: Shantanu Joshi, Koki Solder America Inc.Co-Authors: Yuki Yamamoto, Kimiaki Mori, Satoshi Otani, Noriyoshi Uchida, Jasbir Bath, Jerome...
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Speakers

Chrys Shea

Founder, SHEA Engineering Services

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Shantanu Joshi is the Head of Customer Solutions and Operational Excellence at KOKI Solder America and an Engineering Sales Manager at Koki Company Ltd., a global leader in soldering materials and solutions. With more than 10 years of experience in electronics manufacturing, he has... Read More →

Hong Kim Lee

Area Technical Manager, Indium Corporation of America

Lee Hong Kim is an Area Technical Manager at Indium Corporation with over 20 years of experience in the semiconductor and Surface Mount Technology (SMT) industries. He specializes in solder materials and assembly process engineering, with a focus on process optimization and defect... Read More →

Jose Gonzalez, Ph.D.

R&D Chemist, AIM Solder

Jose Gonzalez is an R&D Scientist at AIM Solder based in Juárez, Mexico, specializing in the design and product optimization of next-generation electronics assembly materials. He holds a Ph.D. in Chemical Engineering and has authored more than 60 publications in peer-reviewed, high-impact... Read More →

Tuesday October 27, 2026 3:30pm - 5:30pm CDT
MFX

Conference Session, MFX Track

4:00pm CDT

Electronics Exhibition

Tuesday October 27, 2026 4:00pm - 7:00pm CDT

EXPO HALL B,C,D

See full exhibitor listing and floorplan here: https://www.smtai.org/exhibitors

Tuesday October 27, 2026 4:00pm - 7:00pm CDT
EXPO HALL B,C,D

Exhibition

4:00pm CDT

Bright Manufacturing Challenge Round 2 (Team Robotics Challenge)

Tuesday October 27, 2026 4:00pm - 7:00pm CDT

SMTA Booth #2851

What is the Bright Electronics Manufacturing Challenge?The Bright Electronics Manufacturing Challenge is an immersive, hands-on experience where student teams will design, fabricate, and test a custom printed circuit board to serve as the control center for a robot — simulating a real-world engineering product development cycle.ROUND 2 - Assembly$500 prizeHands-on PCB assembly in a timed...
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Tuesday October 27, 2026 4:00pm - 7:00pm CDT
SMTA Booth #2851

Special Event, Student & Young Professionals

4:00pm CDT

Tuesday Evening Reception: Pit Stop Party

Tuesday October 27, 2026 4:00pm - 7:00pm CDT

SMTA Booth #2851

Refuel, Recharge & Connect.

Join us at the SMTA Booth for complimentary drinks and light bites! This is a great opportunity to network, connect with fellow attendees, and unwind in a fun and relaxed atmosphere.

Tuesday October 27, 2026 4:00pm - 7:00pm CDT
SMTA Booth #2851

Special Event

5:00pm CDT

RHE Town Hall: The Impact of Conformal Coating on Reliability

Tuesday October 27, 2026 5:00pm - 6:00pm CDT

RHE

Join SMTA for a Town Hall open to all attendees, featuring an engaging and interactive discussion on conformal coating and its impact on solder joint reliability.The Town Hall will immediately follow the Reliability, Harsh Environment (RHE) technical session on conformal coating, which provides important background and context for the discussion. This attendee-driven forum welcomes a wide range of...
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Speakers

Richard Coyle

Consulting Member of the Technical Staff, Nokia Bell Labs

David Hillman

Founder / CEO, Hillman EAS LLC

Tuesday October 27, 2026 5:00pm - 6:00pm CDT
RHE

Conference Session, RHE Track

7:30am CDT

SMTA Registration

Wednesday October 28, 2026 7:30am - 5:00pm CDT

LOBBY

Wednesday October 28, 2026 7:30am - 5:00pm CDT
LOBBY

Registration

10:00am CDT

Electronics Assembly Explorer Kickoff

Wednesday October 28, 2026 10:00am - 10:30am CDT

Room 13 - Level 1

Welcome to the Electronics Manufacturing Explorer Step into the world of electronics manufacturing through hands-on challenges, expert conversations, and practical problem-solving - all on the SMTA International expo floor. Enter for a chance to win a pair of Bose noise cancelling headphones!Can You Keep Production Moving?You are the lead manufacturing engineer for a new electronics product. As...
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Wednesday October 28, 2026 10:00am - 10:30am CDT
Room 13 - Level 1

Special Event, Student & Young Professionals

10:00am CDT

SMTA International Keynote Presentation

Wednesday October 28, 2026 10:00am - 11:00am CDT

Room 13 - Ground Floor

Information coming soon….

Wednesday October 28, 2026 10:00am - 11:00am CDT
Room 13 - Ground Floor

Special Event, Free Event

10:00am CDT

Electronics Exhibition

Wednesday October 28, 2026 10:00am - 5:00pm CDT

EXPO HALL B,C,D

See full exhibitor listing and floorplan here: https://www.smtai.org/exhibitors

Wednesday October 28, 2026 10:00am - 5:00pm CDT
EXPO HALL B,C,D

Exhibition

10:30am CDT

Bright Manufacturing Challenge Round 3 (Team Robotics Challenge)

Wednesday October 28, 2026 10:30am - 4:00pm CDT

SMTA Booth #2851

What is the Bright Electronics Manufacturing Challenge?The Bright Electronics Manufacturing Challenge is an immersive, hands-on experience where student teams will design, fabricate, and test a custom printed circuit board to serve as the control center for a robot — simulating a real-world engineering product development cycle.ROUND 3- The Final Challenge$2,000 prizeThe culminating event —...
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Wednesday October 28, 2026 10:30am - 4:00pm CDT
SMTA Booth #2851

Special Event, Student & Young Professionals

11:00am CDT

SMTA Benefits & Max (AI) Demonstration Session

Wednesday October 28, 2026 11:00am - 12:00pm CDT

SMTA Booth #2851

SMTA Benefits & Max (AI) Demonstration Session

What Can SMTA Do for You? Stop by the SMTA booth for an overview of the benefits, resources, and opportunities available to you with a membership. See how Max, our AI research assistant, can be an asset in your job every day.

Wednesday October 28, 2026 11:00am - 12:00pm CDT
SMTA Booth #2851

Special Event

11:00am CDT

APT1: Advanced Interconnect Materials and Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

APT

Session Chair: Andrew Mawer, NXP SemiconductorsSession Co-Chair: Prathiksha Ramprasad Dhanpal, Westcliff University 11:00am-11:30am Improving Cu-to-Cu Bonding through Cu Nanoparticle Characteristics and Substrate Residual Stress Control Presenter: Albert Wu, Ph.D., National Central University Co-Authors: Li-Chen Wu; Shao-Chi Chen; En-Szu Chang; Chang-Meng Wang, National Central...
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Speakers

ALBERT TZU-CHIA WU

Professor, National Central University

Prof. Wu earned his Ph.D. from the University of California, Los Angeles. Since August 2012, he has served as a Professor in the Department of Chemical and Materials Engineering at National Central University. His research focuses on reliability challenges in advanced electronic packaging... Read More →

Ronald Lasky

Senior Technologist, Indium Corporation

Ronald C. Lasky, Ph.D., P.E. Ron is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM. Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly... Read More →

Gilad Nave

Material and Process Engineer, SLB

Gilad holds a PhD from the University of Maryland, with research conducted at the Center for Advanced Life Cycle Engineering (CALCE), where his work focused on high‑temperature Pb‑free solder systems and transient liquid phase sintering (TLPS) materials, including microstructural... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
APT

Conference Session, APT Track

11:00am CDT

RHE5: Mechanical Testing and Interconnect Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

RHE

Session Chair: Cathi Miles, Raytheon TechnologiesSession Co-Chair: Tim Pearson, Collins Aerospace11:00am-11:30am Sinusoidal Vibration Testing of Wafer Level Chip Scale Packages Presenter: Jayse McLean, John Deere Intelligent Solutions Group 11:30am-12:00pm High Density Connector Solder Joint Producibility and Reliability Evaluation for Military & Aerospace Environments Presenter:...
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Speakers

Jayse McLean

Senior Engineer, John Deere Intelligent Solutions Group

Jacob Weber

Senior Mechanical Engineer, Collins Aerospace

Jacob is a Senior Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. He is involved with evaluating commercial off the shelf (COTS) and custom components for thermal cycle reliability and... Read More →

Daphne Gates

Mechanical Engineer, Collins Aerospace

Daphne Gates is a Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. She has a B.S. in Materials Engineering from Iowa State University and has been in her current position for 6 years... Read More →

George Winstead

Senior Systems Engineer, Technology Service Corporation

George K. Winstead serves as a Senior Systems Engineer at Leidos at Huntsville, AL. He spent the last 22+ years working in military defense as a mechanical engineer, systems engineer, IPT lead, and chief engineer for Leidos and Northrop Grumman. His work covers designing and developing... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
RHE

Conference Session, RHE Track

11:00am CDT

Interactive Presentations (Posters) on the Show Floor

Wednesday October 28, 2026 11:00am - 1:00pm CDT

EXPO HALL B

Explore cutting-edge research and technical innovations at the Interactive Presentations session. This interactive poster event allows attendees to connect directly with presenters, ask questions, and gain valuable insights into the latest developments shaping the electronics manufacturing industry.Posters/Presenters:Expanding Electronic Technician Workforce Opportunities – Introduction to PCB...
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Wednesday October 28, 2026 11:00am - 1:00pm CDT
EXPO HALL B

Special Event, Free Event

11:30am CDT

MFX6: Conformal Coating

Wednesday October 28, 2026 11:30am - 12:30pm CDT

MFX

Session Chair: Adam Klett, Ph.D., KYZEN CorporationSession Co-Chair: Jeff Kennedy, Retired (Formerly with ZESTRON Corporation)11:30am-12:00pm Conformal Coating - Between De-wetting and Crystalline Growth. The Quality Problem Identification by FT-IR Spectroscopy Presenter: Viktoria Rawinski, Rawinski GMBH12:00pm-12:30pmThe Dirty Dozen - 12 Common Mistakes Made When Cleaning Circuit...
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Speakers

Viktoria Rawinski

CEO, Rawinski GmbH

Viktoria Rawinski graduated in Plastics and Rubber Engineering from the University of Applied Science in Wuerzburg. After her thesis on "Development and Design of a Temperature Controlled Electromechanic Test Rig for the Analysis of Piezo-fibre Sensors" she has been called to the... Read More →

Mike Konrad

Founder / CEO, Aqueous Technologies

Mike began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents. Mike is an internationally known speaker... Read More →

Wednesday October 28, 2026 11:30am - 12:30pm CDT
MFX

Conference Session, MFX Track

1:00pm CDT

NextGen10 Award Ceremony

Wednesday October 28, 2026 1:00pm - 2:00pm CDT

SMTA Booth #2851

Next Gen 10 Awards Ceremony

Celebrate the emerging leaders shaping the future of the electronics manufacturing industry as SMTA recognizes this year’s Next Gen 10 honorees.

Wednesday October 28, 2026 1:00pm - 2:00pm CDT
SMTA Booth #2851

Special Event, Student & Young Professionals

2:00pm CDT

APT2: Advanced Packaging and Reliability

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

APT

Session Chair: Marie Cole, Retired (Formerly with IBM Corporation)Session Co-Chair: 2:00pm-2:30pm Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration Presenter: Charles Woychik, NHanced Semiconductors 2:30pm-3:00pm Failure Modes in Flip Chip and Wire Bonded Packages Presenter: Mumtaz Bora, pSemi 3:00pm-3:30pm Finite Difference Based Model to Estimate Eutectic...
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Speakers

Mumtaz Bora

Principal Packaging Engineer, pSemi

Mumtaz Y. Bora is a Principal packaging Engineer supporting development and outsource assembly of RF -IC packages at pSemi. She directs qualification of fcLGAs, WLCSPs and wire-bonded packages and supportsboard level reliability testing of RF packages. She has worked in advanced PCB... Read More →

Charles Woychik

VP Business Development, NHanced Semiconductors

Charles Woychik is currently the VP of Business Development at NHanced Semiconductor, Inc. Previously he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research... Read More →

Robert Darveaux

President, TMBS, LLC

Robert Darveaux is currently President of TMBS, LLC providing expert witness and engineering consulting services in electronic packaging and related fields. He was previously with Skyworks Solutions, Amkor Technology, Motorola, and Microelectronics Center of North Carolina. Robert... Read More →

Martin Hart

CEO, Topline Corporation

Marty Hart is the founder and CEO of TopLine Corporation. He earned his degree in electrical engineering from California State University, Long Beach, and holds 17 patents related to Column Grid Arrays and vibration dampers. Marty is passionate about advancing the art and science... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
APT

Conference Session, APT Track

2:00pm CDT

MFX7: OPS Excellence

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

MFX

Session Chair: Nick Ostrom, Lockheed MartinSession Co-Chair: Sharissa Johns, Lockheed Martin2:00pm-2:30pm Manufacturing Readiness: The Six Pillars of Operational Excellence Presenter: Mark Dydyk, Dydyk Consulting LLC 2:30pm-3:00pm The Lost Art of Auditing PCB and SMT Suppliers Presenter: Albert Block, Better Boards 3:00pm-3:30pm Don't Change It Yet: A Data-Driven Framework for...
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Speakers

Mark Dydyk

President, Mark Dydyk Consulting LLC

Mark Dydyk is a manufacturing executive and consultant with four decades of leadership experience spanning the semiconductor, specialty chemical, and medical device industries.
He has held roles including Plant Director, VP of Engineering, Director of Engineering and Operations, R&D Manager, Process Engineering Manager, and consultant supporting organizations ranging from emerging growth companies to global manufacturers... Read More →

Albert Block

Chief Manufacturing Strategist, Better Board Buying- DirectPCB

ALBERT (AL) BLOCK is a seasoned PCB Manufacturing Strategist, bringing to DirectPCB over 45 years of expertise in the SMTA/PCB industry. Throughout his 22-year tenure at National Instruments (NI), Al evaluated new designs for product reliability and led supplier audits to ensure... Read More →

Ram Wissel

Vice President, KYZEN Corporation

Ram is a process-driven engineer with a passion for developing “greener” cleaning solutions that enhance wash process efficiency while reducing environmental impact. His work focuses on advancing technologies that control, contain, and recycle materials, helping customers operate... Read More →

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
MFX

Conference Session, MFX Track

2:00pm CDT

RHE6: Predictive Modeling

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

RHE

Session Chair: Charlie Polidoro, Inventec Performance Chemicals Session Co-Chair: Thiagarajan Raman, Google 2:00pm-2:30pm A Metamodel for Screening Solder Fatigue Life of BGA Joints with Voids Presenter: Arvind Purushotaman, SynopsysCo-Author: Josh Akman, Synopsys 2:30pm-3:00pm Comparison of Analytical Thermomechanical Modeling and Finite Element Analysis for Lead-Free Wafer-Level...
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Speakers

Arvind Purushotaman

R&D Engineering, Staff Engineer, Synopsys

–R&D Engineer, Synopsys Inc.–Have been developing Ansys Sherlock™ since 2020.–Focus is on developing analytical and finite element models and workflows for predicting board level reliability for electronics.

Jean-Baptiste Libot

Electronic Assembly Expert, Hooke Electronics

Dr. Jean-Baptiste Libot is an Electronic Assembly Expert with over 12 years of experience in the aerospace and defense industry. He began his career at Airbus Group, where he worked as a visiting researcher at the Center for Advanced Life Cycle Engineering (CALCE). He then joined... Read More →

Tyler Ferris

Sr Staff Consultant, Ansys, Part of Synopsys

Tyler Ferris is a Senior Staff Consultant at Synopsys focusing on electronics reliability simulation. He is an expert in the use of reliability physics, finite element analysis and hands-on laboratory failure analysis. Tyler has consulted with customers in the aerospace, automotive... Read More →

Josh Akman

Senior Staff Engineer, Synopsys

Josh Akman is a Senior Application Engineer at Synopsys. His background is in electronics reliability with a focus on simulation and physics-of-failure methodologies. Josh also has experience with reliability testing and failure analysis of electronics. Josh holds a bachelor’s degree... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
RHE

Conference Session, RHE Track

4:00pm CDT

SMTA Officer Meeting and Social

Wednesday October 28, 2026 4:00pm - 6:00pm CDT

TBA

All current Chapter and Alliance Group officers are invited to attend the Annual Officer Meeting. This event is a great opportunity to connect with fellow officers and the SMTA Board of Directors, hear the latest organizational updates, and celebrate outstanding volunteer achievements.

Wednesday October 28, 2026 4:00pm - 6:00pm CDT
TBA

Special Event

4:30pm CDT

APT3: Korean Packaging Integration Association

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

APT

Session Chair: Sung-Jin Kim, Chungbuk National UniversitySession Co-Chair: HyunHo Kim, Korea Packaging Integration Association 4:30pm-5:00pmAI and HPC Advanced Packaging TechnologyPresenter: YoungDo Kweon, AMKOR Technology5:00pm-5:30pmMetal- Oxide Sphere-Structured Thermal Interface Material for Efficient Heat DissipationPresenter: Jinsub Park, Ph.D., Hanyang...
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Speakers

Jinsub Park

Professor, Hanyang University

Jinsub Park is a Professor in the Department of Electronic Engineering at Hanyang University, Seoul, Korea, where he also serves as the Head of the Department of Semiconductor Engineering and the Department of Electronic Engineering. He is the Director of the Advanced Convergence... Read More →

Sang Yeol Lee

Professor, Cheongju University

Sang Yeol Lee is a Professor in the Department of Semiconductor Engineering at Cheongju University and Director of the Research Institute of Advanced Semiconductor Convergence Technology. He also serves as Director of the Gachon Advanced Institute of Semiconductor Technology (GAIST... Read More →

YoungDo Kweon

AMKOR Technology

YoungDo Kweon joined Amkor Technology in 2015 and currently serves as Senior Director of
Development Program Management, focusing on advanced chiplet-based flip chip packaging
technologies for AI and high-performance computing applications. Since 1988, he has built extensive
exp... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
APT

Conference Session, APT Track

4:30pm CDT

RHE7: Lead-Free Solder Evolution

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

RHE

Session Chair: Session Co-Chair: 4:30pm-5:00pm RoHS: Twenty Years Later Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation 5:00pm-5:30pm A Review on Impact of Isothermal Aging on Thermal Cycling Reliability of Ball Grid Array Packages Assembled Using SAC Lead-Free Solder Alloy Presenter: Anto Raj, Ph.D., Medtronic Co-Author: Richard Coyle, Ph.D., Nokia Bell Labs5:30pm-6:00pmImpact of...
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Speakers

Ronald Lasky

Senior Technologist, Indium Corporation

Anto Raj

Sr Reliability Engineer, Medtronic

Anto Raj received the B.Eng. degree in electronics and communications engineering from Anna University, Chennai, India, in 2011, and the M.I.S.E. and Ph.D. degrees in industrial and systems engineering from Auburn University, Auburn, AL, USA, in 2015 and 2019, respectively. From 2020... Read More →

Thuy Nguyen

Technical Support Engineer II, Indium Corporation

Thuy Nguyen is a Technical Support Engineer II at Indium Corporation, where she provides advanced soldering process support to customers across the Southwest and Rocky Mountains region. With over a decade of experience spanning Quality, Research and Development, and Manufacturing... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
RHE

Conference Session, RHE Track

5:00pm CDT

Wednesday Reception: Halloween Bash

Wednesday October 28, 2026 5:00pm - 7:30pm CDT

LOBBY

Information coming soon….

Wednesday October 28, 2026 5:00pm - 7:30pm CDT
LOBBY

Special Event

7:30am CDT

SMTA Registration

Thursday October 29, 2026 7:30am - 2:00pm CDT

LOBBY

Thursday October 29, 2026 7:30am - 2:00pm CDT
LOBBY

Registration

8:30am CDT

MFX8: Unique Processes for Assembly 1

Thursday October 29, 2026 8:30am - 10:30am CDT

MFX

Session Chair: Ray Prasad, SMT Principles and PracticeSession Co-Chair:8:30am-9:00am A Study of How Nozzle Tip Diameter and PCB Copper Mass Impact the Transfer of Thermal Energy during Mini-Wave Selective Soldering Presenter: Joseph Clure, KurtzERSA Inc Co-Authors: Thomas Shoaf, David Miller, KurtzERSA Inc 9:00am-9:30am Comparative Evaluation of Eutectic and Non-Eutectic...
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Speakers

Joseph Clure

Head of Application and Demo Centers, KurtzERSA Inc

Joseph Clure is currently the Head of the Applications and Demo Center at KurtzERSA Inc. based at the company’s North American Head Quarters in Plymouth, Wisconsin. He has worked in the Soldering Industry for over 25 years holding the positions of Site Process Engineer, Regional... Read More →

Christine Taylor

Quality Engineer, IBM Corporation

Christine Taylor is an Interconnect Quality Engineer at IBM, supporting connector reliability for high‑performance computing system. She has experience spanning advanced packaging development, electronic materials characterization, and component qualification across research, development... Read More →

Tony Sass

Senior Technical Staff Member, IBM Corporation

Tony Sass is a Senior Technical Staff Member and interconnect qualification engineer based in North Carolina, with over two decades of experience in hardware engineering and product development. He has built a career specializing in interconnect technologies, reliability, and qualification... Read More →

Gayle Towell

Technical Marketing Lead, AIM Solder

As Technical Marketing Lead for AIM Solder, Gayle Towell serves as a critical bridge between the company’s technical, commercial, and industry engagement functions. She combines deep technical expertise with strategic communication and public-facing research initiatives to align... Read More →

Brian Watson

Managing Parter, HyRel Technologies

Brian has been involved in the Industry for over 30 years. He started MRB in 1998 as an electronic packaging recycler for all of Motorola Chicagoland facilities, selling that to ITW Electronics in 1999. He then founded TSR, doing Tape & Reel packaging for AVX. In 2001, he founded... Read More →

Thursday October 29, 2026 8:30am - 10:30am CDT
MFX

Conference Session, MFX Track

8:30am CDT

SMT Process Technologist (CSMTPT) Certification Exam

Thursday October 29, 2026 8:30am - 12:00pm CDT

Room 57

SMT Process Technologist (CSMTPT) CertificationOne comprehensive examination. Two professional credentials.Validate your advanced process knowledge, troubleshooting skills, and technical decision-making across both Surface Mount and Liquid Soldering assembly processes.VIEW CERTIFICATION INFORMATIONSMTA International is the first opportunity to earn SMTA's new Certified SMT Process Technologist...
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Thursday October 29, 2026 8:30am - 12:00pm CDT
Room 57

Conference Session, Certification

8:30am CDT

PDC10: PCB Interposer Design Strategies for Heterogeneous System-in-Package Technology

Thursday October 29, 2026 8:30am - 12:00pm CDT

PDC10

Instructor: Vern Solberg Course Overview: This half-day tutorial provides PCB design engineers and manufacturing professionals with guidance on developing next-generation semiconductor packaging solutions, including 2D, 2.5D, and 3D System-in-Package (SiP) technologies and ultra-high-density interposers. As advanced electronics increasingly rely on chiplet-based architectures and heterogeneous...
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Thursday October 29, 2026 8:30am - 12:00pm CDT
PDC10

Professional Development Course

8:30am CDT

PDC8: Test Probes and Test Fixtures 101 for ICT/FCT: Back to Basics

Thursday October 29, 2026 8:30am - 12:00pm CDT

PDC8

Instructors: Matthias Zapatka & Travis Walker INGUN USA, Inc. Course Overview: This back-to-basics course provides a practical introduction to selecting and applying test probes and fixtures for successful printed circuit board assembly (PCBA) testing, including in-circuit test (ICT) and functional test (FCT). The course covers essential fixture and probe technologies, helping engineers,...
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Thursday October 29, 2026 8:30am - 12:00pm CDT
PDC8

Professional Development Course

8:30am CDT

PDC9: Practical PCB Strain Measurement for Reliability Evaluation

Thursday October 29, 2026 8:30am - 12:00pm CDT

PDC9

Instructor: Takahiro James Hara Kyowa Americas Inc. Course Overview: This course provides a practical introduction to PCB strain measurement techniques used for evaluating the reliability and durability of electronic assemblies. Participants will learn the fundamentals of strain measurement, strain gage selection and installation, data acquisition methods, and techniques for improving measurement...
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Thursday October 29, 2026 8:30am - 12:00pm CDT
PDC9

Professional Development Course

9:00am CDT

APT4: Substrates

Thursday October 29, 2026 9:00am - 10:30am CDT

APT

Session Chair: Session Co-Chair: 9:00am-9:30am Sintered Cu Paste as a Via- Filling Material for Through-Glass Vias (TGVs) - Via Planarization by Chemical Mechanical Polishing (CMP )- Presenter: Yoshinori Ejiri, Resonac Co., Ltd. Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.9:30am-10:00am Thermal-Mismatch Stress...
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Speakers

Yoshinori Eijiri

Chief Researcher, Resonac Co., Ltd.

Yoshinori Ejiri is a chief researcher at the R and D center of Resonac in Japan. He received a B. S. and a M. S. from Tokyo University of Science. He joined Hitachi Chemical in 2000, where he did research and development on Electrolytic plating, Electroless plating and surface finishing... Read More →

Takamasa Takano

Principal Researcher, Dai Nippon Printing Corporation

Takamasa Takano received the M.E. degree in Electrical and electronic engineering from Hosei University, in 1999.He joined Dai Nippon Printing Corporation in 1999 and has been working on the development of
next-generation semiconductor packages for approximately 25 years, including organic substrates (FC-BGA), MEMS packages, silicon interposers (TSV), glass interposers (TGV), and RDL interposers. He currently serves as principal researcher for the Fine Packaging Division, focusing on th... Read More →

Yiliang Wu

VP Technology, CollTech Materials Corporation

Dr. Yiliang Wu is the Vice President of Technology and Innovation at CollTech Materials Corporation that specialized in adhesives and thermal interface materials (TIM). His research interests are in advanced materials and their applications for electronics integration. Before joining... Read More →

Thursday October 29, 2026 9:00am - 10:30am CDT
APT

Conference Session, APT Track

9:00am CDT

RHE8: Harsh Use Conditions

Thursday October 29, 2026 9:00am - 10:30am CDT

RHE

Session Chair: Session Co-Chair: 9:00am-9:30am Electromigration Behavior of Solder Joints as a Function of Current Density and Joint Temperature Presenter: Nithin Lakshminarayan, Universal Instruments CorporationCo-Authors: Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology (RIT) 9:30am-10:00am Advanced Packaging Qualification for Harsh...
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Speakers

Nithin Lakshminarayan

SMT Lab Engineer, Universal Instruments Corporation

Nithin Lakshminarayan is an SMT Lab Engineer II at Universal Instruments’ Advanced Process Lab, where he specializes in the process optimization, thermomechanical reliability, and failure analysis of advanced electronic interconnects. He holds an M.S. in Manufacturing and Mechanical... Read More →

Gilad Nave

Material and Process Engineer, SLB

Rakesh Kumar

Vice President of Technology, Specialty Coating Systems, Inc.

Dr. Rakesh Kumar is currently the V.P. of Technology for Specialty Coating Systems, Inc., where he leads the R&D group and manages Parylene, Plasma CVD and ALD coatings R&D activities worldwide. He has more than 34 years of extensive experience in advanced polymeric materials and... Read More →

Thursday October 29, 2026 9:00am - 10:30am CDT
RHE

Conference Session, RHE Track

9:00am CDT

Electronics Exhibition

Thursday October 29, 2026 9:00am - 2:00pm CDT

EXPO HALL B,C,D

See full exhibitor listing and floorplan here: https://www.smtai.org/exhibitors

Thursday October 29, 2026 9:00am - 2:00pm CDT
EXPO HALL B,C,D

Exhibition

11:00am CDT

Electronics Assembly Explorer Raffle

Thursday October 29, 2026 11:00am - 11:30am CDT

SMTA Booth #2851

Thursday October 29, 2026 11:00am - 11:30am CDT
SMTA Booth #2851

Special Event, Student & Young Professionals

11:00am CDT

MFX9: Unique Processes for Assembly 2

Thursday October 29, 2026 11:00am - 12:00pm CDT

MFX

Session Chair:
Session Co-Chair:

11:00am-11:30am
How Heavy Copper Designs Influence Through‑Hole Barrel Fill
Presenter: Mei Ming Khaw, Keysight Technologies
Co-Author: Xi Lin, Por, Keysight Technologies

11:30am-12:00pm
SMT Defects Bringing you Down? We’ve Got Solution
Presenters: Tony Lentz, FCT Solder & Greg Smith, StenTech, Inc

Speakers

Mei Ming Khaw

Material Reliability Program Manager, Keysight Technologies

Khaw Mei Ming holds a bachelor’s degree in Electronics and Computer Engineering and has 29 years of experience in the EMS and OEM industries. She has presented several technical papers at international conferences on topics ranging from PCB materials to PCA manufacturing processes... Read More →

Greg Smith

Technology Director, StenTech, Inc

Greg Smith has worked in the electronics industry since 1989. He owned a stencil manufacturing company for 23 years prior to joining BlueRing Stencils which has now merged with Stentech. He is currently the Technology Director for Stentech. Greg writes and presents white papers, works... Read More →

Tony Lentz

Chemist & Field Application, FCT Solder

Tony Lentz worked as a PCB manufacturing engineer from 1994-1999, and a lab manager from 1999-2012. Since 2013, he has worked in R&D and field application for FCT Solder. Tony is the vice-chair of the IPC JSTD-005 task group and chair-emeritus of the IPC J-STD-004 task group. Tony... Read More →

Thursday October 29, 2026 11:00am - 12:00pm CDT
MFX

Conference Session, MFX Track

11:00am CDT

RHE9: Factors Affected Thermal Cycling Performance

Thursday October 29, 2026 11:00am - 12:00pm CDT

RHE

Session Chair: Session Co-Chair: 11:00am-11:30am Ball Grid Array Footprint Impacts on Reliability Presenter: William Fox, Lockheed Martin Co-Author: Ben Gumpert, Lockheed Martin 11:30am-12:00pm Effects of Thermal Cycling on Electromigration Life of SnAgCu Solder Joints Presenter: Anola Semndili, Binghamton UniversityCo-Authors: Sai Kiran Reddy Munnangi, Sitaram Panta, Eric Cotts, Ph.D.,...
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Speakers

William Fox

LM Fellow, Lockheed Martin

William Fox is a materials engineer specializing in failure analysis and laboratory operations. He earned a B.S. in Materials Science & Engineering from Purdue University and an M.S. in Materials Engineering from the University of Dayton. He has published papers in Journal of Nanomaterials... Read More →

Anola Semndili

Research Aide, Binghamton University

Anola Semndili is a third year Ph.D. student in Materials Science and Engineering at Binghamton University., Hher current research is on solder joint reliability including regular, high reliability and low temperature alloys under accelerated testing conditions of electromigration... Read More →

Thursday October 29, 2026 11:00am - 12:00pm CDT
RHE

Conference Session, RHE Track