Instructor: Dr. Jennie S. Hwang, Ph.D., D.Sc. H-Technologies Group
Course Overview: Intermetallic compounds (IMCs) play a critical role in electronic interconnection reliability, influencing solder joint integrity and overall product performance at the chip, package, and board levels. This course provides a comprehensive understanding of IMC formation, evolution, and control throughout the entire lifecycle of an electronic assembly, from reflow and storage to field service. Participants will explore the relationship between IMCs, solder alloys, surface finishes, component metallization, and long-term reliability, with practical insights connecting materials science fundamentals to real-world manufacturing challenges.
Topics Include: • Fundamentals, characteristics, and behavior of intermetallic compounds • Role of phase diagrams in SnPb and lead-free solder systems • IMC formation and growth during assembly, storage, and service life • Interfacial vs. bulk intermetallics • Impact of IMCs on solder joint failure mechanisms and reliability • Effects of PCB surface finishes and component metallization • Gold embrittlement: causes, factors, and considerations • Influence of different IMC systems (Ni/Au, Ni/Pd/Au, Ni/Pd, Cu) on solder reliability • SAC alloys with doping elements and their performance characteristics • Reliability considerations for low-temperature solder alloys • Case studies and practical recommendations
Who Should Attend: This course is designed for engineers, researchers, managers, and professionals involved in electronics design, manufacturing, quality, and reliability. Attendees will gain practical knowledge to better understand solder joint behavior, evaluate reliability risks, and make informed decisions regarding materials selection and process optimization.
