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Monday October 26, 2026 1:00pm - 2:30pm CDT
Session Chair:
Session Co-Chair:

1:00pm-1:30pm
Next Generation Direct Metallization Processes are Adaptable to the Evolving Printed Circuit Board Material Landscape
Presenter: Lindsey Mercurio, MacDermid Alpha Electronics Solutions
 
1:30pm-2:00pm 
High Resolution Copper Printed RF Devices
Presenter: Tom Rovere, Lockheed Martin
Co-Authors: Maya Chiesa, Emuobosan Enakerakpo, Eric Whiting, Lockheed Martin

2:00pm-2:30pm
Roll-to-Roll Additive Manufacturing of Copper Micro-Wires for SMT Circuit
Presenter: Carolyn Ellinger, Eastman Kodak Company
Speakers
avatar for Lindsey Mercurio

Lindsey Mercurio

Primary Metallization Applications Specialist, MacDermid Alpha Electronics Solutions
Lindsey Mercurio is an Applications Specialist with MacDermid Alpha Electronics Solutions. In her role, Lindsey conducts the final stages of new product development including process parameter verification, customer site beta testing, and transition to full commercialization. She... Read More →
avatar for Tom Rovere

Tom Rovere

LM Fellow, Lockheed Martin
Tom Rovere is a Research Scientist for Lockheed Martin Rotary and Mission Systems division in Owego, NY.  In this capacity, he is responsible for research and development related to flexible hybrid electronics (FHE), printed electronics, antenna manufacturing, circuit card assembly... Read More →
avatar for Carolyn Ellinger

Carolyn Ellinger

VP, Printed Electronics, Eastman Kodak Company
Carolyn Ellinger is Vice President of Printed Electronics at Eastman Kodak Company. During her more than 30 years at Kodak, she has held a variety of technical and leadership roles spanning film systems, flexible displays, nanotechnology, semiconductor devices, MEMS-based devices... Read More →
Monday October 26, 2026 1:00pm - 2:30pm CDT
AME

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