Name: APT2: Advanced Packaging and Reliability
Start: 2026-10-28T14:00:00-0500
End: 2026-10-28T16:00:00-0500

APT2: Advanced Packaging and Reliability

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

APT

Session Chair: Marie Cole, Retired (Formerly with IBM Corporation)
Session Co-Chair:

2:00pm-2:30pm
Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration
Presenter: Charles Woychik, NHanced Semiconductors

2:30pm-3:00pm
Failure Modes in Flip Chip and Wire Bonded Packages
Presenter: Mumtaz Bora, pSemi

3:00pm-3:30pm
Finite Difference Based Model to Estimate Eutectic SnPb Solder Joint Fatigue Life
Presenter: Robert Darveaux, Ph.D., TMBS, LLC
Co-Authors: Andrew Mawer, NXP Semiconductors; Jean-Paul Clech, Ph.D., EPSI; Pradeep Lall, Ph.D., Auburn University

3:30pm-4:00pm
Copper Core Solder Columns Transfer Heat from Semiconductor Chip Packages More Efficiently than Solder Balls at Cryogenic Temperatures for Quantum, Aerospace, Data Centers and Harsh Environments
Presenter: Martin Hart, Topline Corporation

Speakers

Mumtaz Bora

Principal Packaging Engineer, pSemi

Mumtaz Y. Bora is a Principal packaging Engineer supporting development and outsource assembly of RF -IC packages at pSemi. She directs qualification of fcLGAs, WLCSPs and wire-bonded packages and supportsboard level reliability testing of RF packages. She has worked in advanced PCB... Read More →

Charles Woychik

VP Business Development, NHanced Semiconductors

Charles Woychik is currently the VP of Business Development at NHanced Semiconductor, Inc. Previously he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research... Read More →

Robert Darveaux

President, TMBS, LLC

Robert Darveaux is currently President of TMBS, LLC providing expert witness and engineering consulting services in electronic packaging and related fields. He was previously with Skyworks Solutions, Amkor Technology, Motorola, and Microelectronics Center of North Carolina. Robert... Read More →

Martin Hart

CEO, Topline Corporation

Marty Hart is the founder and CEO of TopLine Corporation. He earned his degree in electrical engineering from California State University, Long Beach, and holds 17 patents related to Column Grid Arrays and vibration dampers. Marty is passionate about advancing the art and science... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
APT

Conference Session, APT Track

SMTA International 2026

Mumtaz Bora

Charles Woychik

Robert Darveaux

Martin Hart

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SMTA International 2026

Mumtaz Bora

Charles Woychik

Robert Darveaux

Martin Hart

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