SMTA International 2026

Session Chair: Ray Prasad, SMT Principles and Practice
Session Co-Chair:

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8:30am-9:00am
A Study of How Nozzle Tip Diameter and PCB Copper Mass Impact the Transfer of Thermal Energy during Mini-Wave Selective Soldering
Presenter: Joseph Clure, KurtzERSA Inc
Co-Authors: Thomas Shoaf, David Miller, KurtzERSA Inc

9:00am-9:30am
Comparative Evaluation of Eutectic and Non-Eutectic Lead-Free Alloy Behavior in Hand Soldering Applications
Presenter: Gayle Towell, AIM Solder
Co-Authors: Kevin Pigeon, Lauren Porto, Leo Lambert, Marcia McLaughlin

9:30am-10:00am
Shelf-Life Study of Near-Chip Connectors on PCB and in Tape and Reel
Presenters: Christine Taylor, Ph.D., IBM Corporation & Tony Sass, IBM Corporation

10:00am-10:30am
Meeting the Challenges of Proper Tinning Today
Presenter: Brian Watson, Ph.D., HyRel Technologies
Co-Authors: John Kerr, Scott Baker, HyRel Technologies

SMT Process Technologist (CSMTPT) Certification
One comprehensive examination. Two professional credentials.
Validate your advanced process knowledge, troubleshooting skills, and technical decision-making across both Surface Mount and Liquid Soldering assembly processes.

VIEW CERTIFICATION INFORMATION

SMTA International is the first opportunity to earn SMTA's new Certified SMT Process Technologist (CSMTPT) credentials. Designed for experienced electronics manufacturing professionals with approximately 7–10 years of industry experience, the CSMTPT validates applied process knowledge, troubleshooting, process optimization, and technical decision-making across two major areas of electronics assembly.

Candidates complete one comprehensive examination covering both Surface Mount and Liquid Soldering processes. Successful completion of the full examination earns two SMTA professional credentials:

CSMTPT – Surface Mount
Recognizes demonstrated competency in surface mount assembly processes, including solder paste and stencil engineering, component placement, reflow, inspection, troubleshooting, and rework.

CSMTPT – Liquid Soldering
Recognizes demonstrated competency in wave, selective, through-hole, and related soldering processes, including flux and solder application, thermal processing, inspection, troubleshooting, rework, and specialized soldering processes.
The examination emphasizes the ability to apply process knowledge to real-world manufacturing situations rather than simply recall technical information. Following the initial launch at SMTA International, the CSMTPT examination will become available to the broader industry through an online, proctored format.

Instructor:
Vern Solberg

Course Overview:
This half-day tutorial provides PCB design engineers and manufacturing professionals with guidance on developing next-generation semiconductor packaging solutions, including 2D, 2.5D, and 3D System-in-Package (SiP) technologies and ultra-high-density interposers. As advanced electronics increasingly rely on chiplet-based architectures and heterogeneous integration, this course explores design strategies, manufacturing considerations, and reliability challenges associated with high-density packaging technologies. Participants will gain insight into evolving package architectures, interposer technologies, and practical design approaches for future electronic systems.

Topics Include:
• Evolution of advanced array packaging and industry standards

• BGA, FBGA, die-size packages, and chiplet package technologies
  • 2D, 2.5D, and 3D semiconductor die and package stacking
• Wire-bond memory stacking
• Homogeneous and heterogeneous package integration
• Package-on-package technologies and risk considerations
  • PCB design guidelines for high-density array packaging
• Multiple-die and stacked package methodologies
• 2.5D high-density BGA applications
  • HDI and UHDI substrate and interposer design
• Organic, silicon, polymer, and glass-based interposer technologies
• Fabrication methods and design considerations
  • Wafer-level and panel-level packaging technologies
• Fan-out wafer-level packaging (FOWLP)
• Fan-out panel-level packaging (FOPLP)
• Mold-first manufacturing approaches
  • Heterogeneous integration and hybrid/direct bond interconnect technologies

Who Should Attend:
This course is designed for PCB designers, design engineers, semiconductor packaging professionals, manufacturing engineers, and test specialists involved in advanced electronic product development. It is also beneficial for OEM, ODM, EMS, and OSAT professionals seeking a deeper understanding of next-generation packaging technologies and their impact on design, manufacturing, and supply chain strategies.

Instructors:
Matthias Zapatka & Travis Walker
INGUN USA, Inc.

Course Overview:
This back-to-basics course provides a practical introduction to selecting and applying test probes and fixtures for successful printed circuit board assembly (PCBA) testing, including in-circuit test (ICT) and functional test (FCT). The course covers essential fixture and probe technologies, helping engineers, technicians, and test professionals understand the fundamentals needed to develop reliable and effective test solutions. A hands-on session allows participants to explore probe plate assembly and discuss real-world test fixture design challenges.

Topics Include:
• Overview of test fixture technologies
• Fundamentals of in-circuit and functional testing
• Test probe technologies, including pogo pins and receptacles
• Selecting the right probes and fixtures for PCBA test applications
• Test fixture design considerations and best practices
• Hands-on probe plate assembly exercise and Q&A

Who Should Attend:
This course is designed for production test engineers, PCBA design engineers, test planners, technicians, buyers, and anyone involved in developing, specifying, or supporting ICT and functional test solutions. It is suitable for beginners as well as intermediate and advanced-level professionals looking to strengthen their understanding of test fundamentals.

Instructor:
Takahiro James Hara
Kyowa Americas Inc.

Course Overview:
This course provides a practical introduction to PCB strain measurement techniques used for evaluating the reliability and durability of electronic assemblies. Participants will learn the fundamentals of strain measurement, strain gage selection and installation, data acquisition methods, and techniques for improving measurement accuracy. A hands-on session provides experience with strain gage installation, measurement setup, and real-time data collection. The course equips engineers with practical knowledge to implement reliable strain measurement methods for design validation, manufacturing evaluation, and failure prevention.

Topics Include:
• Fundamentals of strain measurement and strain gages

• Strain measurement principles
• Strain gage types and characteristics
• Selecting strain gages for PCB applications
• Overview of PCB strain measurement techniques
  • Hands-on strain gage installation and data acquisition
• PCB sample preparation and strain gage installation
• Wiring and measurement system setup
• Real-time data collection and recording
  • Improving measurement accuracy and reliability
• Common sources of measurement error
• Temperature compensation methods
• Signal filtering and noise reduction
• Sampling rates and FFT fundamentals
• Best practices for repeatable measurements
  • Q&A and technical discussion

Who Should Attend:
This course is designed for engineers and professionals involved in electronic assembly design, manufacturing, and reliability evaluation. It is especially beneficial for design engineers, reliability and test engineers, manufacturing and process engineers, quality engineers, and professionals interested in implementing PCB strain measurement for high-reliability applications.

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9:00am-9:30am
Sintered Cu Paste as a Via- Filling Material for Through-Glass Vias (TGVs) - Via Planarization by Chemical Mechanical Polishing (CMP )-
Presenter: Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

9:30am-10:00am
Thermal-Mismatch Stress Analysis and Suppression of SEWARE in Glass Core Substrates with Multilayer ABF Build-Up Layers
Presenter: Takamasa Takano, Dai Nippon Printing Co. Ltd.
Co-Author: Satoru Kuramochi, Dai Nippon Printing Co. Ltd.

10:00am-10:30am
Epoxy Adhesives with Precision Beads to Control the Air-Gaps for SMT Planar Inductor Applications
Presenter: Yiliang Wu, CollTech Materials Corporation
Co-Authors: Fen Zhang, Jack Chen, CollTech Materials Corporation

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9:00am-9:30am
Electromigration Behavior of Solder Joints as a Function of Current Density and Joint Temperature
Presenter: Nithin Lakshminarayan, Universal Instruments Corporation
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)

9:30am-10:00am
Advanced Packaging Qualification for Harsh Environments
Presenter: Gilad Nave, Ph.D., SLB
Co-Authors: Masahiro, Tsuriya, iNEMI; David Locker, US Army

10:00am-10:30am
Atomic Layer Deposition/Parylene Conformal Nanocoatings
Presenter: Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.

See full exhibitor listing and floorplan here: https://www.smtai.org/exhibitors

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11:00am-11:30am 
How Heavy Copper Designs Influence Through‑Hole Barrel Fill
Presenter: Mei Ming Khaw, Keysight Technologies
Co-Author: Xi Lin, Por, Keysight Technologies

11:30am-12:00pm
SMT Defects Bringing you Down? We’ve Got Solution
Presenters: Tony Lentz, FCT Solder & Greg Smith, StenTech, Inc

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11:00am-11:30am
Ball Grid Array Footprint Impacts on Reliability
Presenter: William Fox, Lockheed Martin
Co-Author: Ben Gumpert, Lockheed Martin 

11:30am-12:00pm
Effects of Thermal Cycling on Electromigration Life of SnAgCu Solder Joints
Presenter: Anola Semndili, Binghamton University
Co-Authors: Sai Kiran Reddy Munnangi, Sitaram Panta, Eric Cotts, Ph.D., Peter Borgesen, Binghamton University