SMTA International 2026

Yoshinori Ejiri is a chief researcher at the R and D center of Resonac in Japan. He received a B. S. and a M. S. from Tokyo University of Science. He joined Hitachi Chemical in 2000, where he did research and development on Electrolytic plating, Electroless plating and surface finishing... Read More →

Takamasa Takano received the M.E. degree in Electrical and electronic engineering from Hosei University, in 1999.He joined Dai Nippon Printing Corporation in 1999 and has been working on the development of
next-generation semiconductor packages for approximately 25 years, including organic substrates (FC-BGA), MEMS packages, silicon interposers (TSV), glass interposers (TGV), and RDL interposers. He currently serves as principal researcher for the Fine Packaging Division, focusing on th... Read More →

Dr. Yiliang Wu is the Vice President of Technology and Innovation at CollTech Materials Corporation that specialized in adhesives and thermal interface materials (TIM). His research interests are in advanced materials and their applications for electronics integration. Before joining... Read More →