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APT3: Korean Packaging Integration Association
Wednesday October 28, 2026 4:30pm - 6:00pm CDT
APT
Session Chair: Sung-Jin Kim, Chungbuk National University
Session Co-Chair: HyunHo Kim, Korea Packaging Integration Association 

4:30pm-5:00pm
AI and HPC Advanced Packaging Technology
Presenter: YoungDo Kweon, AMKOR Technology

5:00pm-5:30pm
Metal- Oxide Sphere-Structured Thermal Interface Material for Efficient Heat Dissipation
Presenter: Jinsub Park, Ph.D., Hanyang University

5:30pm-6:00pm
Comprehensive review on Artificial Synaptic Devices with Amorphous Oxide Semiconductor Thin Film Transistors  for Neuromorphic Computing: Materials, Devices, and Emerging Applications
Presenters: Sang Yeol Lee, PhD., Gachon University
Co-Authors: Sandeep Kumar, Hyeonji Kim, Gachon University
Speakers
avatar for Jinsub Park

Jinsub Park

Professor, Hanyang University
Jinsub Park is a Professor in the Department of Electronic Engineering at Hanyang University, Seoul, Korea, where he also serves as the Head of the Department of Semiconductor Engineering and the Department of Electronic Engineering. He is the Director of the Advanced Convergence... Read More →
avatar for Sang Yeol Lee

Sang Yeol Lee

Professor, Cheongju University
Sang Yeol Lee is a Professor in the Department of Semiconductor Engineering at Cheongju University and Director of the Research Institute of Advanced Semiconductor Convergence Technology. He also serves as Director of the Gachon Advanced Institute of Semiconductor Technology (GAIST... Read More →
avatar for YoungDo Kweon

YoungDo Kweon

AMKOR Technology
YoungDo Kweon joined Amkor Technology in 2015 and currently serves as Senior Director of 
Development Program Management, focusing on advanced chiplet-based flip chip packaging
technologies for AI and high-performance computing applications. Since 1988, he has built extensive
exp... Read More →
Wednesday October 28, 2026 4:30pm - 6:00pm CDT
APT
  Conference Session, APT Track

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