SMTA International 2026: Full Schedule

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9:00am CDT

Thursday October 29, 2026 9:00am - 10:30am CDT

Session Chair:
Session Co-Chair:

9:00am-9:30am
Electromigration Behavior of Solder Joints as a Function of Current Density and Joint Temperature
Presenter: Nithin Lakshminarayan, Universal Instruments Corporation
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)

9:30am-10:00am
Advanced Packaging Qualification for Harsh Environments
Presenter: Gilad Nave, Ph.D., SLB
Co-Authors: Masahiro, Tsuriya, iNEMI; David Locker, US Army

10:00am-10:30am
Atomic Layer Deposition/Parylene Conformal Nanocoatings
Presenter: Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.

Speakers

Nithin Lakshminarayan

SMT Lab Engineer, Universal Instruments Corporation

Nithin Lakshminarayan is an SMT Lab Engineer II at Universal Instruments’ Advanced Process Lab, where he specializes in the process optimization, thermomechanical reliability, and failure analysis of advanced electronic interconnects. He holds an M.S. in Manufacturing and Mechanical... Read More →

Gilad Nave

Material and Process Engineer, SLB

Gilad holds a PhD from the University of Maryland, with research conducted at the Center for Advanced Life Cycle Engineering (CALCE), where his work focused on high‑temperature Pb‑free solder systems and transient liquid phase sintering (TLPS) materials, including microstructural... Read More →

Rakesh Kumar

Vice President of Technology, Specialty Coating Systems, Inc.

Dr. Rakesh Kumar is currently the V.P. of Technology for Specialty Coating Systems, Inc., where he leads the R&D group and manages Parylene, Plasma CVD and ALD coatings R&D activities worldwide. He has more than 34 years of extensive experience in advanced polymeric materials and... Read More →

Thursday October 29, 2026 9:00am - 10:30am CDT
RHE

Conference Session, RHE Track

11:00am CDT

RHE9: Factors Affected Thermal Cycling Performance

Thursday October 29, 2026 11:00am - 12:00pm CDT

RHE

Session Chair:
Session Co-Chair:

11:00am-11:30am
Ball Grid Array Footprint Impacts on Reliability
Presenter: William Fox, Lockheed Martin
Co-Author: Ben Gumpert, Lockheed Martin

11:30am-12:00pm
Effects of Thermal Cycling on Electromigration Life of SnAgCu Solder Joints
Presenter: Anola Semndili, Binghamton University
Co-Authors: Sai Kiran Reddy Munnangi, Sitaram Panta, Eric Cotts, Ph.D., Peter Borgesen, Binghamton University

Speakers

William Fox

LM Fellow, Lockheed Martin

William Fox is a materials engineer specializing in failure analysis and laboratory operations. He earned a B.S. in Materials Science & Engineering from Purdue University and an M.S. in Materials Engineering from the University of Dayton. He has published papers in Journal of Nanomaterials... Read More →

Anola Semndili

Research Aide, Binghamton University

Anola Semndili is a third year Ph.D. student in Materials Science and Engineering at Binghamton University., Hher current research is on solder joint reliability including regular, high reliability and low temperature alloys under accelerated testing conditions of electromigration... Read More →

Thursday October 29, 2026 11:00am - 12:00pm CDT
RHE