Instructor: Chrys Shea
Shea Engineering Services
Course Overview: Selecting a new solder paste can be a complex process with many factors to consider, including printability, reflow performance, reliability, and supplier support. This course introduces a data-driven approach to solder paste qualification using a structured scorecard methodology to evaluate candidate materials based on assembler-specific requirements. Participants will learn how to compare solder paste options, identify tradeoffs, optimize testing efficiency, and confidently select the best material for their manufacturing needs.
Topics Include: • Reasons to evaluate new solder paste formulations, including:
- Fine-feature printing and Type 5 solder powders
- High-reliability alloys
- Low-temperature alloys
- Defect reduction and customer requirements
• Solder paste selection scorecard methodology
• PCB design strategies for solder paste testing
• Maximizing test efficiency through optimized test plans and data collection
• Step-by-step solder paste evaluation procedures
• BOM and sample size calculations
• Key solder paste characteristics and performance metrics
• Data collection, analysis, and decision-making
• Candidate disqualifiers and risk identification
Who Should Attend: This course is designed for process and quality engineers evaluating solder paste performance, manufacturing and production professionals considering material upgrades, technicians involved in printing and reflow processes, and suppliers interested in understanding solder paste qualification methods.
