SMTA International 2026: Full Schedule

1:00pm CDT

Monday October 26, 2026 1:00pm - 2:30pm CDT

Session Chair:
Session Co-Chair:

1:00pm-2:30pm
Impact of Fixture Material on Thermal Stability and Process Performance in Reflow Soldering
Presenter: Ricardo Chuma, 2B Automacao

2:30pm-3:00pm
Impact of Operation Environment and Flux Residues on the Electrochemical Reliability of In Bi SAC Solder Paste
Presenter: Sirine Bayram, Ph.D., AIM Solder

3:00pm-3:30pm
Junction Formation Through Photonic Soldering under Ambient and Flux-less Conditions
Presenter: Vahid Akhavan, Ph.D., PulseForge
Co-Authors: Nick Snyder, Ara Parsekian, PulseForge

Speakers

Vahid Akhavan

Director of Transitional Technologies, PulseForge

Dr. Vahid Akhavan is the Director of Transitional Technologies at PulseForge. Enabling the next generation of electronic devices by drawing on his expertise in colloidal synthesis, additive manufacturing and kinetic thermal processing. He has over 20 peer-reviewed publications, several... Read More →

Sirine Bayram

Senior Research Scientist, AIM Solder

Sirine Bayram is a Senior Research Scientist at AIM Solder specializing in solder paste product development and innovation. She holds a Master's degree in Chemistry from the American University of Beirut and a Ph.D. in Chemistry from McGill University. Dr. Bayram has published in... Read More →

Ricardo Chuma

Co-Owner and Engineering Director, 2B AUTOMACAO E USINAGEM

Ricardo Chuma is Co-Owner and Engineering Director at 2B Automacao e Usinagem, a Brazilian company specializing in tooling and fixtures for the electronics manufacturing industry. He leads engineering initiatives focused on SMT and PTH process optimization, including the development... Read More →

Monday October 26, 2026 1:00pm - 2:30pm CDT
MFX

Conference Session, MFX Track

3:00pm CDT

MFX2: AI & Smart Factory Evolution

Monday October 26, 2026 3:00pm - 5:00pm CDT

MFX

Session Chair:
Session Co-Chair:

3:00pm-3:30pm
Industrial AI in Electronics Manufacturing: A Comprehensive Review of State-of-the-Art Applications, Challenges, and Future Directions
Presenter: Sai Kolli, Foxconn Industrial Internet (FII)

3:30pm-4:00pm
Solving SMT Component Attrition at Scale Using LLM-Based Agentic Analysis
Presenter: Cameron Sobie, Ph.D., Arch Systems
Co-Authors: Andrew Scheuermann, Tim Burke, Arch Systems

4:00pm-4:30pm
Smart Factory Evolution 1.0 -4.0
Presenter: Chris Dayney, Fuji America
Co-Authors:

4:30pm-5:00pm
Human vs. AI-Collaborative PCB Design: Comparative Analysis of Routing Efficiency and Manufacturing Performance
Presenter: Athula Kulatunga, Purdue University Northwest
Co-Author: Jagadish Kirla, Purdue University Northwest

Speakers

Sai Kolli

Project Manager, Foxconn Industrial Internet (FII)

Sai Srikanth is a Project Manager at Foxconn Industrial Internet (FII) and a PhD candidate in Industrial and Systems Engineering at Binghamton University – State University of New York. His research focuses on manufacturing systems, advanced optimization approaches, Artificial Intelligence... Read More →

Cameron Sobie

Director of AI Strategy, Arch Systems, Arch Systems

Cameron Sobie is the Director of AI Strategy at Arch Systems, where he focuses on identifying where emerging AI capabilities can unlock value in manufacturing and leads the transformation of those ideas into deployed solutions. His work drives bottom line results by helping manufacturers... Read More →

Chris Dayney

Technical Marketing Manager, Fuji America Corporation

Technical Marketing Manager for Fuji America Corporation, headquartered in Vernon Hills, IL. Based in Crossville, TN, Chris brings 30 years of expertise in the SMT industry to his role. He spent 3 years as Regional Sales Manager and 25 years as an Instructor and Training Team Leader... Read More →

Athula Kulatunga

Professor of Electrical Engineering Technology, Purdue University Northwest

Prof. Dr. N. Athula Kulatunga is an Electrical Engineering Technology (EET) professor at Purdue University Northwest (PNW) and served as department head from 2015 to 2022. Previously, he taught and conducted research for 15 years at Purdue University in West Lafayette, where he was... Read More →

Monday October 26, 2026 3:00pm - 5:00pm CDT
MFX

Conference Session, MFX Track

8:30am CDT

MFX3: Solder Paste Printing & Reliability 1

Tuesday October 27, 2026 8:30am - 10:00am CDT

MFX

Session Chair:
Session Co-Chair:

8:30am-9:00am
Are Gaps Bad for Printing?
Presenter: Hong Kim Lee, Indium Corporation
Co-Authors:

9:00am-9:30am
Reliability Evaluation of Low-Silver Solder Alloy Solder Paste
Presenter: Shantanu Joshi, Koki Solder America Inc.
Co-Authors: Yuki Yamamoto, Kimiaki Mori, Satoshi Otani, Noriyoshi Uchida, Jasbir Bath, Jerome McIntyre, Koki Solder America Inc

9:30am-10:00am
Solder Powder Size Types and Their Associated Print Capabilities in Ultra High Density Applications
Presenter: Chrys Shea, Shea Engineering Services
Co-Authors: Shantanu Joshi, Michael Butler, Koki Solder America

Speakers

Hong Kim Lee

Area Technical Manager, Indium Corporation of America

Lee Hong Kim is an Area Technical Manager at Indium Corporation with over 20 years of experience in the semiconductor and Surface Mount Technology (SMT) industries. He specializes in solder materials and assembly process engineering, with a focus on process optimization and defect... Read More →

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Shantanu Joshi is the Head of Customer Solutions and Operational Excellence at KOKI Solder America and an Engineering Sales Manager at Koki Company Ltd., a global leader in soldering materials and solutions. With more than 10 years of experience in electronics manufacturing, he has... Read More →

Chrys Shea

Founder, SHEA Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction,” an SMTA “Distinguished Speaker” and four-time... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
MFX

Conference Session, MFX Track

10:30am CDT

MFX4: Cleaning & Coating

Tuesday October 27, 2026 10:30am - 12:00pm CDT

MFX

Session Chair:
Session Co-Chair:

10:30am-11:00am
Assessing SMT Component Compatibility and Reliability in Assembly and Cleaning Processes
Presenter: Chelsea Jewell, KYZEN Corporation
Co-Author: Nicholas Ostrom, Lockheed Martin

11:00am-11:30am
What is a Sufficient Rinse?
Presenter: Vladimir Sitko, PBT Works

11:30am-12:00pm
Process Characterization for Determining Acceptable Levels of Flux Residue
Presenter: Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Matt Imburgia, Magnalytix, LLC

Speakers

Chelsea Jewell

Application Lab Manager, KYZEN Corporation

Chelsea Jewell is the Application Lab Manager at KYZEN, supporting electronics and advanced manufacturing customers with precision cleaning processes. She works closely with customers to evaluate cleaning challenges, develop data-driven process recommendations, and support implementation... Read More →

Vladimir Sitko

Founder / CEO, PBT Works

Vladimir Sitko is the founder and mentor of PBT Works s.r.o., a recognized manufacturer of cleaning equipment for electronic assemblies. After completing his studies at the Technical University, he began his career nearly 50 years ago as a designer of measuring instruments for silicon... Read More →

Mike Bixenman

SME Cleaning and Reliability, Magnalytix, LLC

Dr. Mike Bixenman is a Subject Matter Expert in Cleaning and Reliability. He has over 35 years of experience in designing electronic assembly cleaning materials and integrating processes. Sharing his research, knowledge, and expertise is Mike’s passion. He believes in the power... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
MFX

Conference Session, MFX Track

1:30pm CDT

MFX5: OPS Excellence & Box Level Assembly

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

MFX

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Factors in Maximizing the Return on an Investment in Automation
Presenter: Troy Gueller, Rockwell Automation

2:00pm-2:30pm
Enhanced Design Rules and Optimization for Laser Depaneling
Presenter: Jake Benz, LPKF Laser & Electronics SE
Co-Author: Patrick Stockbruegger, M.Sc., LPKF Laser & Electronics SE

2:30pm-3:00pm
The Science of Bonding
Presenter: Dave Dworak, Dymax Corporation

Speakers

Troy Gueller

Senior Project Engineer, Rockwell Automation

Troy Gueller is a Senior Project Engineer at Rockwell Automation, where he leads Automation initiatives across the company’s global footprint. With a career of over 30+ years, Troy brings a unique blend of hands-on technical expertise and overall process vision. He has a strong... Read More →

Jake Benz

Sales Manager, LPKF Laser & Electronics SE

Jake Benz is the Production Laser Systems Sales Manager at LPKF Laser and Electronics, where he leads sales efforts for LPKF’s Laser Induced Deep Etching (LIDE) technology, PCB Laser Depaneling, and SMT Stencil Laser equipment in North America. Based in Portland, OR, Jake plays... Read More →

Dave Dworak

Material Scientist, Dymax Corporation

Dave has over 20 years of adhesive chemistry and formulation experience. He has worked as a polymer chemistspecializing in polyurethane synthesis and formulations as well as living radical polymerization of novel polyacrylates.Dave received his chemistry degree from the University... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
MFX

Conference Session, MFX Track

3:30pm CDT

MFX6: Solder Paste Printing 2

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

MFX

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
The Effect of Viscosity on Solder Paste Performance
Presenter: Gayle Towell, AIM Solder

4:00pm-4:30pm
A Mixed Powder Strategy to Improve Printing and Eliminate Nitrogen in Reflow
Presenter: Mathilde Buret, Inventec Performance Chemicals
Co-Authors: Yvan Bouyou, Mélanie Mathon, Emmanuelle Guene, Inventec Performance Chemicals

Speakers

Gayle Towell

Technical Marketing Lead, AIM Solder

As Technical Marketing Lead for AIM Solder, Gayle Towell serves as a critical bridge between the company’s technical, commercial, and industry engagement functions. She combines deep technical expertise with strategic communication and public-facing research initiatives to align... Read More →

Mathilde BURET

R&D Soldering Engineer, Inventec Performance Chemicals

Mathilde has a master's degree in Chemistry within a chemical engineering school in France, specialized in Formulation Chemistry. She's been part of Inventec Performance Chemicals since 2018. She's working as an R&D soldering engineer with expertise in soldering fluxes and pastes... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
MFX

Conference Session, MFX Track

11:30am CDT

MFX7: Conformal Coating

Wednesday October 28, 2026 11:30am - 12:30pm CDT

MFX

Session Chair:
Session Co-Chair:

11:30am-12:00pm
Conformal Coating - Between De-wetting and Crystalline Growth. The Quality Problem Identification by FT-IR Spectroscopy
Presenter: Viktoria Rawinski, Rawinski GMBH

12:00pm-12:30pm
The Dirty Dozen - 12 Common Mistakes Made When Cleaning Circuit Assemblies
Presenter: Michael Konrad, Aqueous Technologies

Speakers

Viktoria Rawinski

CEO, Rawinski GmbH

Viktoria Rawinski graduated in Plastics and Rubber Engineering from the University of Applied Science in Wuerzburg. After her thesis on "Development and Design of a Temperature Controlled Electromechanic Test Rig for the Analysis of Piezo-fibre Sensors" she has been called to the... Read More →

Mike Konrad

Founder / CEO, Aqueous Technologies

Mike began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents. Mike is an internationally known speaker... Read More →

Wednesday October 28, 2026 11:30am - 12:30pm CDT
MFX

Conference Session, MFX Track

2:00pm CDT

MFX8: OPS Excellence

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

MFX

Session Chair:
Session Co-Chair:

2:00pm-2:30pm
Manufacturing Readiness: The Six Pillars of Operational Excellence
Presenter: Mark Dydyk, Dydyk Consulting LLC

2:30pm-3:00pm
The Lost Art of Auditing PCB and SMT Suppliers
Presenter: Albert Block, Better Boards

3:00pm-3:30pm
Don't Change It Yet: A Data-Driven Framework for Extending Cleaning Agent Bath Life
Presenter: Ram Wissel, KYZEN Corporation

3:30pm-4:00pm
Evaluation of Solder Paste Printability with Solder Paste Inspection Equipment After Extended Stencil Cleaning Cycle Intervals
Presenter: Shantanu Joshi, Koki Solder America
Co-Authors: Takeshi Yahagi, Jasbir Bath, Koki Solder America Inc; Ray Welch, Joel Scutchfield, Brent Fischthal, Koh Young Technology

Speakers

Mark Dydyk

President, Mark Dydyk Consulting LLC

Mark Dydyk is a manufacturing executive and consultant with four decades of leadership experience spanning the semiconductor, specialty chemical, and medical device industries.
He has held roles including Plant Director, VP of Engineering, Director of Engineering and Operations, R&D Manager, Process Engineering Manager, and consultant supporting organizations ranging from emerging growth companies to global manufacturers... Read More →

Albert Block

Chief Manufacturing Strategist, Better Board Buying- DirectPCB

ALBERT (AL) BLOCK is a seasoned PCB Manufacturing Strategist, bringing to DirectPCB over 45 years of expertise in the SMTA/PCB industry. Throughout his 22-year tenure at National Instruments (NI), Al evaluated new designs for product reliability and led supplier audits to ensure... Read More →

Ram Wissel

Vice President, KYZEN Corporation

Ram is a process-driven engineer with a passion for developing “greener” cleaning solutions that enhance wash process efficiency while reducing environmental impact. His work focuses on advancing technologies that control, contain, and recycle materials, helping customers operate... Read More →

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
MFX

Conference Session, MFX Track

4:30pm CDT

MFX9: AI-Driven Optimization & Resilience

Wednesday October 28, 2026 4:30pm - 5:30pm CDT

MFX

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
Line SPOCK: A Holistic Approach to Statistical Process Optimization, Control, and Kinematics in High-Frequency SMT Performance Validation
Presenter: Michael Sivigny, CeTaQ Americas
Co-Authors:

5:00pm-5:30pm
No Parts, No Boards: A Risk-Based Framework for Mitigating Supply Chain Volatility
Presenter: Ed Dodd, Cofactr
Co-Authors:

Speakers

Michael Sivigny

Owner/General Manager, CeTaQ Americas

Michael Sivigny, now in his 25th year as owner and General Manager of CeTaQ Americas, built the company from the ground up after recognizing an opportunity in February 2001. The parent company, CeTaQ GmbH, based in Dresden, Germany, pioneered a mobile measurement solution in 1996... Read More →

Ed Dodd

VP of Government and Defense, Cofactr

A Navy veteran with twenty years of experience in electronics assurance for critical applications, Ed Dodd is currently working on improving parts management and industry supply chain processes. He currently serves as the Vice President, Government and Defense for Cofactr, a leading... Read More →

Wednesday October 28, 2026 4:30pm - 5:30pm CDT
MFX

Conference Session, MFX Track

8:30am CDT

MFX10: Unique Processes for Assembly 1

Thursday October 29, 2026 8:30am - 10:30am CDT

MFX

Session Chair:
Session Co-Chair:

8:30am-9:00am
A Study of How Nozzle Tip Diameter and PCB Copper Mass Impact the Transfer of Thermal Energy during Mini-Wave Selective Soldering
Presenter: Joseph Clure, KurtzERSA Inc
Co-Authors: Thomas Shoaf, David Miller, KurtzERSA Inc

9:00am-9:30am
Comparative Evaluation of Eutectic and Non-Eutectic Lead-Free Alloy Behavior in Hand Soldering Applications
Presenter: Gayle Towell, AIM Solder
Co-Authors: Kevin Pigeon, Lauren Porto, Leo Lambert, Marcia McLaughlin

9:30am-10:00am
Shelf-Life Study of Near-Chip Connectors on PCB and in Tape and Reel
Presenters: Christine Taylor, Ph.D., IBM Corporation & Tony Sass, IBM Corporation

10:00am-10:30am
Meeting the Challenges of Proper Tinning Today
Presenter: Brian Watson, Ph.D., HyRel Technologies
Co-Authors: John Kerr, Scott Baker, HyRel Technologies

Speakers

Joseph Clure

Head of Application and Demo Centers, KurtzERSA Inc

Joseph Clure is currently the Head of the Applications and Demo Center at KurtzERSA Inc. based at the company’s North American Head Quarters in Plymouth, Wisconsin. He has worked in the Soldering Industry for over 25 years holding the positions of Site Process Engineer, Regional... Read More →

Christine Taylor

Quality Engineer, IBM Corporation

Christine Taylor is an Interconnect Quality Engineer at IBM, supporting connector reliability for high‑performance computing system. She has experience spanning advanced packaging development, electronic materials characterization, and component qualification across research, development... Read More →

Tony Sass

Senior Technical Staff Member, IBM Corporation

Tony Sass is a Senior Technical Staff Member and interconnect qualification engineer based in North Carolina, with over two decades of experience in hardware engineering and product development. He has built a career specializing in interconnect technologies, reliability, and qualification... Read More →

Gayle Towell

Technical Marketing Lead, AIM Solder

Brian Watson

Managing Parter, HyRel Technologies

Brian has been involved in the Industry for over 30 years. He started MRB in 1998 as an electronic packaging recycler for all of Motorola Chicagoland facilities, selling that to ITW Electronics in 1999. He then founded TSR, doing Tape & Reel packaging for AVX. In 2001, he founded... Read More →

Thursday October 29, 2026 8:30am - 10:30am CDT
MFX

Conference Session, MFX Track

11:00am CDT

MFX11: Unique Processes for Assembly 2

Thursday October 29, 2026 11:00am - 12:30pm CDT

MFX

Session Chair:
Session Co-Chair:

11:00am-11:30am
SMT Defects Bringing you Down? We’ve Got Solution
Presenters: Tony Lentz, FCT Solder & Greg Smith, StenTech, Inc

11:30am-12:00pm
The challenge and solution for Automation of Straddle Mount Connector Assembly in Card Assembly
Presenter: Wayne Zhang, IBM Corporation
Co-Authors: Theron Lewis, Robin Hou, Andrew Chong, Alex Chan, Kenny Chew, Venothraaj Rajandran, Ridwan Muhamad, Chin Kar Heng, William Chong Sook Kean, Mustaza Abdul Malik, Muhammad Syahmi Shafidin, Mohd Nasrul Ismail, Thinagaran Selvan, Vijia Nant, IBM Corporation

12:00pm-12:30pm
How Heavy Copper Designs Influence Through‑Hole Barrel Fill
Presenter: Mei Ming Khaw, Keysight Technologies
Co-Author: Xi Lin, Por, Keysight Technologies

Speakers

Tony Lentz

Chemist & Field Application, FCT Solder

Tony Lentz worked as a PCB manufacturing engineer from 1994-1999, and a lab manager from 1999-2012. Since 2013, he has worked in R&D and field application for FCT Solder. Tony is the vice-chair of the IPC JSTD-005 task group and chair-emeritus of the IPC J-STD-004 task group. Tony... Read More →

Greg Smith

Technology Director, StenTech, Inc

Greg Smith has worked in the electronics industry since 1989. He owned a stencil manufacturing company for 23 years prior to joining BlueRing Stencils which has now merged with Stentech. He is currently the Technology Director for Stentech. Greg writes and presents white papers, works... Read More →

Wayne Zhang

Supply Chain Engineer, IBM Corporation

Wayne Zhang is a Supply Chain Engineer with ECAT Interconnect Technology at IBM Corporation. He currently works as a Qualification Engineer, focusing on reliability assessments for medium- to high-complexity server applications. In this role, Wayne ensures that server technologies... Read More →

Mei Ming Khaw

Material Reliability Program Manager, Keysight Technologies

Khaw Mei Ming holds a bachelor’s degree in Electronics and Computer Engineering and has 29 years of experience in the EMS and OEM industries. She has presented several technical papers at international conferences on topics ranging from PCB materials to PCA manufacturing processes... Read More →

Thursday October 29, 2026 11:00am - 12:30pm CDT
MFX

Conference Session, MFX Track

1:00pm CDT

3:00pm CDT

8:30am CDT

10:30am CDT

1:30pm CDT

3:30pm CDT

11:30am CDT

2:00pm CDT

4:30pm CDT

8:30am CDT

11:00am CDT

Get help with the event