SMTA International 2026

Instructor:
Dave Hillman, Hillman Electronic Assembly Solutions LLC

Course Overview:
This workshop explores the impact of solder joint voids on BTC and BGA component reliability, covering materials, design considerations, and manufacturing processes. Topics include solder joint reliability for both tin/lead and lead-free soldering processes, with an in-depth focus on the effects of voids on solder joint integrity and thermal performance.

Topics Include:

• Classification and types of voids

• Solder joint void specifications, including IPC-7093, IPC J-STD-001, and J-STD-001 Automotive Addendum requirements

• Manufacturing influences on void formation:

• Pad design
• Solder paste
• Stenciling, reflow, and cleaning processes
• Solder joint reliability considerations for:
• Ball Grid Arrays (BGAs)
• Bottom Terminated Components (BTCs)
• Other electronic components

Who Should Attend:
This course is designed for product design engineers, process engineers and technicians, and product reliability and safety engineers interested in understanding how solder joint voids impact BTC and BGA reliability.

Instructor:
Dr. Jennie S. Hwang, Ph.D., D.Sc.
H-Technologies Group

Course Overview:
Intermetallic compounds (IMCs) play a critical role in electronic interconnection reliability, influencing solder joint integrity and overall product performance at the chip, package, and board levels. This course provides a comprehensive understanding of IMC formation, evolution, and control throughout the entire lifecycle of an electronic assembly, from reflow and storage to field service. Participants will explore the relationship between IMCs, solder alloys, surface finishes, component metallization, and long-term reliability, with practical insights connecting materials science fundamentals to real-world manufacturing challenges.

Topics Include:
• Fundamentals, characteristics, and behavior of intermetallic compounds
• Role of phase diagrams in SnPb and lead-free solder systems
• IMC formation and growth during assembly, storage, and service life
• Interfacial vs. bulk intermetallics
• Impact of IMCs on solder joint failure mechanisms and reliability
• Effects of PCB surface finishes and component metallization
• Gold embrittlement: causes, factors, and considerations
• Influence of different IMC systems (Ni/Au, Ni/Pd/Au, Ni/Pd, Cu) on solder reliability
• SAC alloys with doping elements and their performance characteristics
• Reliability considerations for low-temperature solder alloys
• Case studies and practical recommendations

Who Should Attend:
This course is designed for engineers, researchers, managers, and professionals involved in electronics design, manufacturing, quality, and reliability. Attendees will gain practical knowledge to better understand solder joint behavior, evaluate reliability risks, and make informed decisions regarding materials selection and process optimization.

Instructor:
Chrys Shea
Shea Engineering Services

Course Overview:
Selecting a new solder paste can be a complex process with many factors to consider, including printability, reflow performance, reliability, and supplier support. This course introduces a data-driven approach to solder paste qualification using a structured scorecard methodology to evaluate candidate materials based on assembler-specific requirements. Participants will learn how to compare solder paste options, identify tradeoffs, optimize testing efficiency, and confidently select the best material for their manufacturing needs.

Topics Include:
• Reasons to evaluate new solder paste formulations, including:

• Fine-feature printing and Type 5 solder powders
• High-reliability alloys
• Low-temperature alloys
• Defect reduction and customer requirements
  • Solder paste selection scorecard methodology
  • PCB design strategies for solder paste testing
  • Maximizing test efficiency through optimized test plans and data collection
  • Step-by-step solder paste evaluation procedures
  • BOM and sample size calculations
  • Key solder paste characteristics and performance metrics
  • Data collection, analysis, and decision-making
  • Candidate disqualifiers and risk identification

Who Should Attend:
This course is designed for process and quality engineers evaluating solder paste performance, manufacturing and production professionals considering material upgrades, technicians involved in printing and reflow processes, and suppliers interested in understanding solder paste qualification methods.

Instructor:
Ray Prasad
SMT Consultant and Author, SMT Principles and Practice

Course Overview:
Based on IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes, this course provides practical guidance on developing, measuring, and controlling thermal profiles to reduce soldering defects and improve product quality and reliability. Participants will learn best practices for creating profiles across various soldering processes, including reflow, wave, vapor phase, laser, and selective soldering. The course addresses challenges such as mixed alloy assemblies, varying component thermal masses, and balancing profile requirements to achieve reliable solder joints.

Topics Include:
• Overview of soldering processes and thermal profiling methods

• Reflow, wave, vapor phase, laser, and selective soldering
  • Soldering zones and profile development
• Preheat, soak, reflow, cooling, peak temperature, TAL, and True TAL
  • Thermal profile requirements for tin-lead, lead-free, and low-temperature solder alloys
  • Proper thermocouple placement for accurate measurements, including BGA applications
  • Oven performance monitoring and control
  • Managing profile tradeoffs to reduce defects such as voiding and head-in-pillow
  • Mixed alloy and backward/forward compatibility considerations
  • Examples of effective and ineffective profiles and associated defects

Who Should Attend:
This course is designed for managers, design engineers, process engineers, quality engineers, operators, and technicians involved in soldering processes and thermal profile development. Professionals in manufacturing, purchasing, and management who want a stronger understanding of soldering reliability for BGAs, BTCs, and other SMT components will also benefit.

Instructor:
Dr. Jennie S. Hwang, Ph.D., D.Sc.
H-Technologies Group

Course Overview:
Artificial Intelligence is transforming modern manufacturing, creating new opportunities to improve quality, productivity, supply chain performance, and decision-making. This course provides an accessible introduction to AI fundamentals and explores how these technologies are being applied on the manufacturing floor. Attendees will gain practical insights into AI concepts, real-world applications, and strategies for evaluating opportunities and challenges in implementing AI-powered manufacturing solutions.

Topics Include:
• AI fundamentals and key concepts

• Machine learning, deep learning, neural networks, digital twins, IoT, generative AI, and AI agents
  • Understanding AI capabilities, trust, and practical applications
  • Prompt engineering techniques and recommendations
  • AI’s impact on the workforce and future roles
  • Data quality, management, and its importance in AI implementation
  • AI-powered manufacturing concepts and use cases
  • Applications of AI in electronics manufacturing
  • Benefits, challenges, and implementation considerations
  • Future trends, including enterprise opportunities and artificial general intelligence (AGI)

Who Should Attend:
This course is designed for professionals at all levels, including engineers, researchers, managers, production, quality, and reliability professionals, executives, and business leaders interested in understanding AI’s impact on manufacturing. No prior AI experience is required. Participants will gain a practical foundation for evaluating AI opportunities and applying AI concepts within electronics manufacturing and beyond.

Instructors:
Jim Hall & Phil Zarrow
ITM Consulting

Course Overview:
This course provides practical strategies for improving productivity, quality, and yield in electronic assembly operations. Participants will explore how non-optimal processes, materials, equipment, and procedures can impact manufacturing performance and financial success. The course identifies common assembly challenges and provides actionable solutions to optimize existing production lines and improve overall efficiency.

Topics Include:
• Manufacturing optimization and maximizing productivity from existing lines
• Defining and implementing assembly best practices
• Solder paste printing process best practices
• Reflow soldering best practices
• Low-temperature soldering considerations
• Wave and selective soldering best practices
• Best practices for challenging technologies, including BTCs and ultra-fine pitch components
• Q&A and practical discussion

Who Should Attend:
This course is designed for manufacturing, process, design, test, and quality engineering professionals, as well as managers and supervisors involved in surface mount and mixed technology assembly operations. Participants responsible for improving production efficiency, quality, and reliability will benefit from this course.

Instructor:
Ray Prasad
SMT Consultant and Author, SMT Principles and Practice

Course Overview:
Bottom Termination Components (BTCs), including QFN, DFN, SON, LGA, and MLF packages, present unique design, assembly, inspection, and reliability challenges due to their hidden solder connections and sensitivity to process variation. This course provides practical guidance for successfully implementing robust BTC assembly processes in both tin-lead and lead-free environments. Participants will learn how to address common design and manufacturing challenges, optimize solder paste printing and rework processes, and reduce the risk of field failures.

Topics Include:
• Overview of BTC package types and characteristics
• Advantages and challenges of BTC technology
• BTC package construction and manufacturing considerations
• Design considerations, including:

• PCB laminates and surface finishes
• Land pattern and stencil design
• Component considerations
  • Assembly process guidelines:
• Solder paste printing optimization
• Reflow process requirements
• Solder joint quality considerations
• BTC rework processes
  • Inspection challenges and reliability considerations
  • Strategies to prevent field failures and improve manufacturing success

Who Should Attend:
This course is designed for managers, design engineers, process engineers, quality engineers, operators, and technicians involved in electronic design, assembly, inspection, and repair processes. Professionals working with tin-lead or lead-free BTC assemblies, including QFN, DFN, and similar packages, will benefit from learning practical approaches to improving design and manufacturing reliability.

Instructor:
Vern Solberg

Course Overview:
This half-day tutorial provides PCB design engineers and manufacturing professionals with guidance on developing next-generation semiconductor packaging solutions, including 2D, 2.5D, and 3D System-in-Package (SiP) technologies and ultra-high-density interposers. As advanced electronics increasingly rely on chiplet-based architectures and heterogeneous integration, this course explores design strategies, manufacturing considerations, and reliability challenges associated with high-density packaging technologies. Participants will gain insight into evolving package architectures, interposer technologies, and practical design approaches for future electronic systems.

Topics Include:
• Evolution of advanced array packaging and industry standards

• BGA, FBGA, die-size packages, and chiplet package technologies
  • 2D, 2.5D, and 3D semiconductor die and package stacking
• Wire-bond memory stacking
• Homogeneous and heterogeneous package integration
• Package-on-package technologies and risk considerations
  • PCB design guidelines for high-density array packaging
• Multiple-die and stacked package methodologies
• 2.5D high-density BGA applications
  • HDI and UHDI substrate and interposer design
• Organic, silicon, polymer, and glass-based interposer technologies
• Fabrication methods and design considerations
  • Wafer-level and panel-level packaging technologies
• Fan-out wafer-level packaging (FOWLP)
• Fan-out panel-level packaging (FOPLP)
• Mold-first manufacturing approaches
  • Heterogeneous integration and hybrid/direct bond interconnect technologies

Who Should Attend:
This course is designed for PCB designers, design engineers, semiconductor packaging professionals, manufacturing engineers, and test specialists involved in advanced electronic product development. It is also beneficial for OEM, ODM, EMS, and OSAT professionals seeking a deeper understanding of next-generation packaging technologies and their impact on design, manufacturing, and supply chain strategies.

Instructors:
Matthias Zapatka & Travis Walker
INGUN USA, Inc.

Course Overview:
This back-to-basics course provides a practical introduction to selecting and applying test probes and fixtures for successful printed circuit board assembly (PCBA) testing, including in-circuit test (ICT) and functional test (FCT). The course covers essential fixture and probe technologies, helping engineers, technicians, and test professionals understand the fundamentals needed to develop reliable and effective test solutions. A hands-on session allows participants to explore probe plate assembly and discuss real-world test fixture design challenges.

Topics Include:
• Overview of test fixture technologies
• Fundamentals of in-circuit and functional testing
• Test probe technologies, including pogo pins and receptacles
• Selecting the right probes and fixtures for PCBA test applications
• Test fixture design considerations and best practices
• Hands-on probe plate assembly exercise and Q&A

Who Should Attend:
This course is designed for production test engineers, PCBA design engineers, test planners, technicians, buyers, and anyone involved in developing, specifying, or supporting ICT and functional test solutions. It is suitable for beginners as well as intermediate and advanced-level professionals looking to strengthen their understanding of test fundamentals.

Instructor:
Takahiro James Hara
Kyowa Americas Inc.

Course Overview:
This course provides a practical introduction to PCB strain measurement techniques used for evaluating the reliability and durability of electronic assemblies. Participants will learn the fundamentals of strain measurement, strain gage selection and installation, data acquisition methods, and techniques for improving measurement accuracy. A hands-on session provides experience with strain gage installation, measurement setup, and real-time data collection. The course equips engineers with practical knowledge to implement reliable strain measurement methods for design validation, manufacturing evaluation, and failure prevention.

Topics Include:
• Fundamentals of strain measurement and strain gages

• Strain measurement principles
• Strain gage types and characteristics
• Selecting strain gages for PCB applications
• Overview of PCB strain measurement techniques
  • Hands-on strain gage installation and data acquisition
• PCB sample preparation and strain gage installation
• Wiring and measurement system setup
• Real-time data collection and recording
  • Improving measurement accuracy and reliability
• Common sources of measurement error
• Temperature compensation methods
• Signal filtering and noise reduction
• Sampling rates and FFT fundamentals
• Best practices for repeatable measurements
  • Q&A and technical discussion

Who Should Attend:
This course is designed for engineers and professionals involved in electronic assembly design, manufacturing, and reliability evaluation. It is especially beneficial for design engineers, reliability and test engineers, manufacturing and process engineers, quality engineers, and professionals interested in implementing PCB strain measurement for high-reliability applications.