SMTA International 2026: Full Schedule

1:00pm CDT

AME1: Additive Processes for Circuit Manufacture

Monday October 26, 2026 1:00pm - 2:30pm CDT

Session Chair:
Session Co-Chair:

1:00pm-1:30pm
Next Generation Direct Metallization Processes are Adaptable to the Evolving Printed Circuit Board Material Landscape
Presenter: Lindsey Mercurio, MacDermid Alpha Electronics Solutions

1:30pm-2:00pm
High Resolution Copper Printed RF Devices
Presenter: Tom Rovere, Lockheed Martin
Co-Authors: Maya Chiesa, Emuobosan Enakerakpo, Eric Whiting, Lockheed Martin

2:00pm-2:30pm
Roll-to-Roll Additive Manufacturing of Copper Micro-Wires for SMT Circuit
Presenter: Carolyn Ellinger, Eastman Kodak Company

Speakers

Lindsey Mercurio

Primary Metallization Applications Specialist, MacDermid Alpha Electronics Solutions

Lindsey Mercurio is an Applications Specialist with MacDermid Alpha Electronics Solutions. In her role, Lindsey conducts the final stages of new product development including process parameter verification, customer site beta testing, and transition to full commercialization. She... Read More →

Tom Rovere

LM Fellow, Lockheed Martin

Tom Rovere is a Research Scientist for Lockheed Martin Rotary and Mission Systems division in Owego, NY. In this capacity, he is responsible for research and development related to flexible hybrid electronics (FHE), printed electronics, antenna manufacturing, circuit card assembly... Read More →

Carolyn Ellinger

VP, Printed Electronics, Eastman Kodak Company

Carolyn Ellinger is Vice President of Printed Electronics at Eastman Kodak Company. During her more than 30 years at Kodak, she has held a variety of technical and leadership roles spanning film systems, flexible displays, nanotechnology, semiconductor devices, MEMS-based devices... Read More →

Monday October 26, 2026 1:00pm - 2:30pm CDT
AME

Conference Session, AME Track

1:00pm CDT

MFX1: Reflow Technology

Monday October 26, 2026 1:00pm - 2:30pm CDT

MFX

Session Chair:
Session Co-Chair:

1:00pm-2:30pm
Impact of Fixture Material on Thermal Stability and Process Performance in Reflow Soldering
Presenter: Ricardo Chuma, 2B Automacao

2:30pm-3:00pm
Impact of Operation Environment and Flux Residues on the Electrochemical Reliability of In Bi SAC Solder Paste
Presenter: Sirine Bayram, Ph.D., AIM Solder

3:00pm-3:30pm
Junction Formation Through Photonic Soldering under Ambient and Flux-less Conditions
Presenter: Vahid Akhavan, Ph.D., PulseForge
Co-Authors: Nick Snyder, Ara Parsekian, PulseForge

Speakers

Vahid Akhavan

Director of Transitional Technologies, PulseForge

Dr. Vahid Akhavan is the Director of Transitional Technologies at PulseForge. Enabling the next generation of electronic devices by drawing on his expertise in colloidal synthesis, additive manufacturing and kinetic thermal processing. He has over 20 peer-reviewed publications, several... Read More →

Sirine Bayram

Senior Research Scientist, AIM Solder

Sirine Bayram is a Senior Research Scientist at AIM Solder specializing in solder paste product development and innovation. She holds a Master's degree in Chemistry from the American University of Beirut and a Ph.D. in Chemistry from McGill University. Dr. Bayram has published in... Read More →

Ricardo Chuma

Co-Owner and Engineering Director, 2B AUTOMACAO E USINAGEM

Ricardo Chuma is Co-Owner and Engineering Director at 2B Automacao e Usinagem, a Brazilian company specializing in tooling and fixtures for the electronics manufacturing industry. He leads engineering initiatives focused on SMT and PTH process optimization, including the development... Read More →

Monday October 26, 2026 1:00pm - 2:30pm CDT
MFX

Conference Session, MFX Track

3:00pm CDT

AME2: Embedded and Conformal Electronics

Monday October 26, 2026 3:00pm - 4:30pm CDT

AME

Session Chair:
Session Co-Chair:

3:00pm-3:00pm
Thermal and Moisture Reliability of In-Mold Gravure Offset Additive Circuits for Automotive Applications
Presenter: Pradeep Lall, Ph.D., Auburn University
Co-Authors: Padma Choudhury, Auburn University; Scott Miller, NextFlex National Manufacturing Institute

3:30pm-4:00pm
Embedding Electronics into High-Volume CBAM Additive Process
Presenters: Nate Bode, Impossible Objects & Denis Cormier, Impossible Objects

4:00pm-4:30pm
Challenges of Low Temperature Component Attach
Presenter: Kalsi Kwan, Boeing Engineering & Technology Innovation
Co-Authors: Authors: John D. Williams, Timothy Messer, Kyle Barber, Adriana Jara, Ted Dabrowski, Boeing Engineering & Technology Innovation

Speakers

Pradeep Lall, Ph.D.

Professor, Auburn University

Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of Auburn University’s Electronics Packaging Research Institute. He holds Joint Courtesy Appointments in the Department of Electrical and... Read More →

Nate Bode

Director of Strategy and Growth, Impossible Objects

Dr. Nate Bode is the Director of Strategy and Growth at Impossible Objects, a high-speed additive manufacturing company. This role encompasses supporting core company initiatives including leading government grant work, new market entry, and fundraising. Dr. Bode brings to this... Read More →

Kalsi Kwan

Boeing Engineering & Technology Innovation

Kalsi Kwan is a principal investigator with the Additive Electronics Technology group within Engineering & Technology Innovation (E&TI) in Huntsville, AL. Kalsi specializes in novel process development for Flexible Hybrid Electronics for next-generation products. She has been with... Read More →

Monday October 26, 2026 3:00pm - 4:30pm CDT
AME

Conference Session, AME Track

3:00pm CDT

MFX2: AI & Smart Factory Evolution

Monday October 26, 2026 3:00pm - 5:00pm CDT

MFX

Session Chair:
Session Co-Chair:

3:00pm-3:30pm
Industrial AI in Electronics Manufacturing: A Comprehensive Review of State-of-the-Art Applications, Challenges, and Future Directions
Presenter: Sai Kolli, Foxconn Industrial Internet (FII)

3:30pm-4:00pm
Solving SMT Component Attrition at Scale Using LLM-Based Agentic Analysis
Presenter: Cameron Sobie, Ph.D., Arch Systems
Co-Authors: Andrew Scheuermann, Tim Burke, Arch Systems

4:00pm-4:30pm
Smart Factory Evolution 1.0 -4.0
Presenter: Chris Dayney, Fuji America
Co-Authors:

4:30pm-5:00pm
Human vs. AI-Collaborative PCB Design: Comparative Analysis of Routing Efficiency and Manufacturing Performance
Presenter: Athula Kulatunga, Purdue University Northwest
Co-Author: Jagadish Kirla, Purdue University Northwest

Speakers

Sai Kolli

Project Manager, Foxconn Industrial Internet (FII)

Sai Srikanth is a Project Manager at Foxconn Industrial Internet (FII) and a PhD candidate in Industrial and Systems Engineering at Binghamton University – State University of New York. His research focuses on manufacturing systems, advanced optimization approaches, Artificial Intelligence... Read More →

Cameron Sobie

Director of AI Strategy, Arch Systems, Arch Systems

Cameron Sobie is the Director of AI Strategy at Arch Systems, where he focuses on identifying where emerging AI capabilities can unlock value in manufacturing and leads the transformation of those ideas into deployed solutions. His work drives bottom line results by helping manufacturers... Read More →

Chris Dayney

Technical Marketing Manager, Fuji America Corporation

Technical Marketing Manager for Fuji America Corporation, headquartered in Vernon Hills, IL. Based in Crossville, TN, Chris brings 30 years of expertise in the SMT industry to his role. He spent 3 years as Regional Sales Manager and 25 years as an Instructor and Training Team Leader... Read More →

Athula Kulatunga

Professor of Electrical Engineering Technology, Purdue University Northwest

Prof. Dr. N. Athula Kulatunga is an Electrical Engineering Technology (EET) professor at Purdue University Northwest (PNW) and served as department head from 2015 to 2022. Previously, he taught and conducted research for 15 years at Purdue University in West Lafayette, where he was... Read More →

Monday October 26, 2026 3:00pm - 5:00pm CDT
MFX

Conference Session, MFX Track

8:30am CDT

INS1: AI Infiltrates Inspection: Latest from the Coalface

Tuesday October 27, 2026 8:30am - 10:00am CDT

INS

Session Chair:
Session Co-Chair:

8:30am-9:00am
Counterfeit Detection as an AI-Based AOI Software Add-On
Presenter: Eyal Weiss, Ph.D., Cybord

9:00am-9:30am
AI-Native Automated Optical Inspection: Sub-10-Minute Programming for New Boards with Low False-Call Rates
Presenter: Collin Stoner, Selene Photonics

9:30am-10:00am AI Applications in Inspection: Enhancing SMT Manufacturing Inspection
Presenter: David Chiu, Test Research Inc.
Co-Author: Roberto Yebra, Test Research, Inc.

Speakers

Eyal Weiss

Founder & CTO, Cybord

Dr. Eyal Weiss is the Founder and Chief Technology Officer (CTO) of Cybord, a company specializing in AI-driven solutions for electronic manufacturing that protect against counterfeit and tampered components, providing full transparency and resilience across the supply chain. With... Read More →

Collin Stoner

Consulting Engineer, Selene Photonics Inc.

Collin Stoner is an electronics and product design consultant and the Owner and Principal Consulting Engineer of Selene Photonics Inc. (DBA NVZN Labs), where he leads a team that designs custom electronics and manufactures PCBAs for clients across aerospace, defense, and emerging-technology... Read More →

David Chiu

Sales Manager, Test Research, Inc (TRI)

David Chiu, Sales Manager, Test Research, Inc. (TRI) David Chiu is a seasoned professional in the electronics manufacturing and test industry, currently serving as a Sales Manager at Test Research, Inc. (TRI). With over 15 years of dedicated service at TRI, David has built a comprehensive... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
INS

Conference Session, INS Track

8:30am CDT

MFX3: Solder Paste Printing & Reliability 1

Tuesday October 27, 2026 8:30am - 10:00am CDT

MFX

Session Chair:
Session Co-Chair:

8:30am-9:00am
Are Gaps Bad for Printing?
Presenter: Hong Kim Lee, Indium Corporation
Co-Authors:

9:00am-9:30am
Reliability Evaluation of Low-Silver Solder Alloy Solder Paste
Presenter: Shantanu Joshi, Koki Solder America Inc.
Co-Authors: Yuki Yamamoto, Kimiaki Mori, Satoshi Otani, Noriyoshi Uchida, Jasbir Bath, Jerome McIntyre, Koki Solder America Inc

9:30am-10:00am
Solder Powder Size Types and Their Associated Print Capabilities in Ultra High Density Applications
Presenter: Chrys Shea, Shea Engineering Services
Co-Authors: Shantanu Joshi, Michael Butler, Koki Solder America

Speakers

Hong Kim Lee

Area Technical Manager, Indium Corporation of America

Lee Hong Kim is an Area Technical Manager at Indium Corporation with over 20 years of experience in the semiconductor and Surface Mount Technology (SMT) industries. He specializes in solder materials and assembly process engineering, with a focus on process optimization and defect... Read More →

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Shantanu Joshi is the Head of Customer Solutions and Operational Excellence at KOKI Solder America and an Engineering Sales Manager at Koki Company Ltd., a global leader in soldering materials and solutions. With more than 10 years of experience in electronics manufacturing, he has... Read More →

Chrys Shea

Founder, SHEA Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction,” an SMTA “Distinguished Speaker” and four-time... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
MFX

Conference Session, MFX Track

8:30am CDT

RHE1: Microstruture and Reliability

Tuesday October 27, 2026 8:30am - 10:00am CDT

RHE

Session Chair:
Session Co-Chair:

8:30am-9:00am
The Effect of Component Construction and Microstructure on the Thermal Cycling Performance of Reverse Hybrid Ball Grid Array Assemblies
Presenter: Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full co-author listing

9:00am-9:30am
Microstructure Evolution and Failure Mechanisms in High Performance Solder Alloys During Harsh Thermal Cycling
Presenter: Chris Gourlay, Ph.D., Imperial College London

9:30am-10:00am
A New Approach to the Design of Lead-Free Solder Alloys
Presenter: Keith Sweatman, P.E., Nihon Superior Co., Ltd
Co-Authors: Kazuhiro Nogita, University of Queensland, Australia; Tetsuro Nishimura, Nihon Superior Co., Ltd

Speakers

Richard Coyle

Consulting Member of the Technical Staff, Nokia Bell Labs

Richard Coyle is a Consulting Member of the Technical Staff in the Reliability Engineering organization at Nokia in Murray Hill, NJ. He is responsible for evaluating the reliability and quality of electronic assemblies in the Bell Labs Interconnection Failure Analysis Lab. Richard... Read More →

Chris Gourlay

Professor of Physical Metallurgy, Imperial College London

Chris is a Professor of Physical Metallurgy in the Department of Materials at Imperial College London. His group studies the origins of microstructure in phase transformations and microstructure stability. In recent years, research in the group has targeted understanding and controlling... Read More →

Keith Sweatman

Senior Technical Advisor, Nihon Superior Co., Ltd

Australia-based Keith Sweatman is a graduate in metallurgical engineering who, in technical and management roles with the International Tin Research Institute, Multicore Solders, and most recently Nihon Superior Co. Ltd, has accumulated 50 years’ experience in the electronics manufacturing... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
RHE

Conference Session, RHE Track

10:30am CDT

INS2: Cautionary Tales from Imaging Analysis

Tuesday October 27, 2026 10:30am - 12:00pm CDT

INS

Session Chair:
Session Co-Chair:

10:30am-11:00am
AOI Should Not Be Used as a Pass/Fail Gate: Applying SPC Principles to Inspection Data for Earlier Root Cause Identification in SMT
Presenter: Jeremy Orbach, Omron Automation USA

11:00am-11:30am
Computed Tomography (CT) vs. Computed Laminography CL for Non-Destructive Inspection of Printed Circuit Boards and Electronic Packages
Presenter: Vineeth Bastin, Comet Technologies USA Inc.
Co-Author: David Kruidhof, Comet Technologies USA Inc

11:30am-12:00pm
Failure Mechanism Investigation of NVMe Link Degradation from PCIe Gen4 to Gen3 Due to PCB Dielectric Collapse
Presenter: Zhipeng Wang, IBM Corporation

Speakers

Jeremy Orbach

Application Engineer II, Omron Automation Americas

Jeremy Orbach is an Applications Engineer and technical leader in electronics manufacturing focused on AOI, SPI, AXI, machine vision, and data-driven process improvement. At Omron Automation Americas, he supports customers in applying inspection systems not only to detect defects... Read More →

Vineeth Bastin

Senior Applications Engineer, Comet Technologies USA inc

Vineeth Bastin is a Senior Applications Engineer at Comet Yxlon, with over 15 years of experience in advanced electronics inspection systems. He has a strong track record in driving the adoption of X-ray, CT, and bond testing technologies, enhancing customer training programs, and... Read More →

Zhipeng Wang

Project Manager, IBM Corporation

Zhipeng (Grady) WangTitle:Project Manager, Global Supplier Test EngineeringOrganization:System Supply Chain, IBM CorporationBio:Grady is currently a Supply Chain Engineering Professional at IBM, where he specializes in test solution delivery for medium- to high-complexity server applications... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
INS

Conference Session, INS Track

10:30am CDT

MFX4: Cleaning & Coating

Tuesday October 27, 2026 10:30am - 12:00pm CDT

MFX

Session Chair:
Session Co-Chair:

10:30am-11:00am
Assessing SMT Component Compatibility and Reliability in Assembly and Cleaning Processes
Presenter: Chelsea Jewell, KYZEN Corporation
Co-Author: Nicholas Ostrom, Lockheed Martin

11:00am-11:30am
What is a Sufficient Rinse?
Presenter: Vladimir Sitko, PBT Works

11:30am-12:00pm
Process Characterization for Determining Acceptable Levels of Flux Residue
Presenter: Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Matt Imburgia, Magnalytix, LLC

Speakers

Chelsea Jewell

Application Lab Manager, KYZEN Corporation

Chelsea Jewell is the Application Lab Manager at KYZEN, supporting electronics and advanced manufacturing customers with precision cleaning processes. She works closely with customers to evaluate cleaning challenges, develop data-driven process recommendations, and support implementation... Read More →

Vladimir Sitko

Founder / CEO, PBT Works

Vladimir Sitko is the founder and mentor of PBT Works s.r.o., a recognized manufacturer of cleaning equipment for electronic assemblies. After completing his studies at the Technical University, he began his career nearly 50 years ago as a designer of measuring instruments for silicon... Read More →

Mike Bixenman

SME Cleaning and Reliability, Magnalytix, LLC

Dr. Mike Bixenman is a Subject Matter Expert in Cleaning and Reliability. He has over 35 years of experience in designing electronic assembly cleaning materials and integrating processes. Sharing his research, knowledge, and expertise is Mike’s passion. He believes in the power... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
MFX

Conference Session, MFX Track

10:30am CDT

RHE2: Alloying Effects on Performance

Tuesday October 27, 2026 10:30am - 12:00pm CDT

RHE

Session Chair:
Session Co-Chair:

10:30am-11:00am
Revisiting Silver-Content in Lead-Free Alloys: Reliability of Low-Cost Alternatives to SAC305 in Modern Electronics Assembly
Presenter: Anna Lifton, MacDermid Alpha Electronics Solutions
Co-Authors: Kennedy Fox, Suraj Saifullah, Ebad Rehman, MacDermid Alpha Electronics Solutions

11:00am-11:30am
Effect of Bismuth and Antimony Additions on the Shear Properties of ENIG-Finished SAC Individual Solder Joints
Presenter: Waad Tarman, Auburn University
Co-Authors: John Evans, Ph.D., Auburn University; Sa'd Hamasha, Ph.D., Binghamton University

11:30am-12:00pm
A Comparative Study of Mechanical Behavior of Next Generation Lead-Free Solder Alloys
Presenter: Pritha Choudhury, Ph.D., MacDermid Alpha Electronics Solutions India Pvt. Ltd.
Co-Authors: Anil Kumar, Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, MacDermid Alpha Electronics Solutions

Speakers

Anna Lifton

Director R&D Application -Circuit Board Assembly, MacDermid Alpha Electronics Solutions

Anna Lifton is R&D Director at Macdermid Alpha Assembly Solutions, overseeing Application, Reliability, and Failure Analysis for the Circuit Board Assemblies business unit. With a Bachelor's degree from Moscow Steel and Alloys Institute, Russia, and a Master's degree in Material Science... Read More →

Waad Tarman

Ph.D. Candidate, Auburn University

Waad Tarman is a Ph.D. candidate in Industrial and Systems Engineering at Auburn University. Her research focuses on the mechanical and microstructural reliability of lead-free solder joints in electronic assemblies, with an emphasis on solder alloy composition, thermal aging, surface... Read More →

Pritha Choudhury

Principal R&D Scientist, MacDermid Alpha Electronics Solutions India Pvt. Ltd.

Pritha Choudhury is a Principal R&D Scientist with MacDermid Alpha Electronics Solutions (MAES), Bangalore, India. She has a Ph.D. in Metallurgical and Materials Engineering from the Indian Institute of Technology, Kharagpur, India. She has been working for MAES since 2011. Her... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
RHE

Conference Session, RHE Track

1:00pm CDT

RHE3: Conformal Coating and Reliability 1

Tuesday October 27, 2026 1:00pm - 3:00pm CDT

RHE

Session Chair:
Session Co-Chair:

1:00pm-1:30pm
Effect of Standoff Height, Pitch, and Component Type on Conformal Coating Ingress and Solder Joint Reliability in BGA and BTC Assemblies
Presenter: Suraj Saifullah, MacDermid Alpha Electronics Solutions
Co-Authors: Kennedy Fox, Anna Lifton, MacDermid Alpha Electronics Solutions

1:30pm-2:00pm
Conformal Coating Reliability for Harsh Environments
Presenter: Jayse McLean, John Deere Intelligent Solutions Group

2:00pm-2:30pm
Active Condensation Exposure and the Reliability of Solvent-Free Conformal Coatings
Presenter: Andrea Charif, Ph.D., Henkel Corporation
Co-Authors: Rita Mohanty, Alejandro Sanchez, Henkel Corporation

2:30pm-3:00pm
The Impact of Conformal Coating on the Reliability of Solder Interconnects
Presenter: Michael Osterman, Ph.D., CALCE/University of Maryland

Speakers

Jayse McLean

Senior Engineer, John Deere Intelligent Solutions Group

Jayse is a senior engineer in the advanced engineering group as a part of the overall John Deere Intelligent Solutions Group. He has a Bachelor of Science and Master of Science in Mechanical Engineering from North Dakota State University. He has worked at Deere for 7 years and during... Read More →

Suraj Saifullah

Application Engineer, MacDermid Alpha Electronics Solutions

Suraj Saifullah has worked at MacDermid Alpha Electronics Solutions for two years as an application engineer. He holds a master’s degree in chemical engineering from Columbia University and a bachelor’s in chemistry from Case Western Reserve University. His research focuses on... Read More →

Andrea Charif

Lead Application Engineer, Henkel Corporation

Andrea Charif, Ph.D., is a polymer scientist with over 10 years of experience delivering high-performance solutions in application development for materials across the automotive and electronics industries. Her expertise centers on material selection, testing, and implementation to... Read More →

Michael Osterman

Research Scientist, CALCE/University of Maryland

Michael Osterman is a Research Scientist and the Operations Director for the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland. In addition, he leads the development of the calceSARA software for printed-board assembly-level reliability assessment... Read More →

Tuesday October 27, 2026 1:00pm - 3:00pm CDT
RHE

Conference Session, RHE Track

1:30pm CDT

INS3: Eat Your Vegetables, Part I: Test Methods You Need to Know

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

INS

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Process Qualification to J-STD-001 Section 8 Cleanliness
Presenter: Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Zach Papiez, Magnalytix, LLC

2:30pm-3:00pm
Mitigation Strategies for Failures Resulting from Ionizing Radiation
Presenter: David Kruidhof, Comet Technologies USA, Inc.
Co-Author: Vineeth Bastin, Comet Technologies USA, Inc.

3:00pm-3:30pm
Mitigation Strategies for Failures Resulting from Ionizing Radiation
Presenter: Matt Turpin, Datest Corporation

Speakers

Mike Bixenman

SME Cleaning and Reliability, Magnalytix, LLC

David Kruidhof

Technical Sales Manager, Comet Technologies USA, Inc.

David Kruidhof is the Technical Sales Manager for Comet Yxlon, who provide X-ray, laminography, and CT inspection systems for R&D labs and production environments, especially for semiconductor manufacturers and PCB assemblers. In his role at Comet Yxlon, David is responsible for technical... Read More →

Matt Turpin

Sr. Test Engineer, Datest Corporation

Matt Turpin is Sr. Test Engineer at Datest, responsible for ICT program and fixture development, and pre-development mechanical and electrical DFT analysis. Matt has over 45 years’ experience in testing and test engineering, primarily with Zehntel, Teradyne, and HP/Agilent/Keysight... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
INS

Conference Session, INS Track

1:30pm CDT

LTS1: Low-Temperature Solder Materials

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

LTS

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Reliability performance and challenges of Bi-Sn based Homogeneous Low Temperature Solder Joint
Presenter: Choongpyo Jeon, Samsung Electronics
Co-Authors: Soojin Yoo, Seungjin Oh, Keunho Rhew, Yuchul Hwang, Kichul Chun, Samsung Electronics

2:00pm-2:30pm
Electrical Resistivity and Microstructure of Sn-Bi Solder
Presenters: Frances Holcomb, Binghamton University
Co-Author: Silas Wieland, Eric Cotts, Ph.D., Binghamton University

2:30pm-3:00pm
Lead-Free Flux-less Soldering Below 120°C
Presenter: Martijn Mulder, Mat-Tech BV
Co-Authors: Arthur Miles, Mo Biglari, Alexandre Kodentsov, Mat-Tech BV

Speakers

Choongpyo Jeon

Reliability Engineer, Samsung Electronics

Choongpyo Jeon has been a reliability engineer at Samsung Electronics for more than 15 years. He has studied package reliability assessment and modelling. Over the course of his career, he published three papers as a 1st author, and he is currently the board-level reliability lead... Read More →

Frances Holcomb

Research Assistant, Binghamton University

Frances Holcomb is a student at Binghamton university in physics and mathematics. She conducts materials science research in Dr. Eric Cotts laboratory. She is investigating the factors which influence the resistivity of alloys such as tin bismuth, as well as models which describe... Read More →

Martijn Mulder

Process & Quality Engineering Lead, Mat-Tech BV

Martijn Mulder is at present affiliated at the Development & Testing department of Mat-Tech BV (TheNetherlands) in the role of Process & Quality Engineering Lead. His tasks consist of addressing quality issues andresearching new ways to join similar and dissimilar materials.His primary... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
LTS

Conference Session, LTS Track

1:30pm CDT

MFX5: OPS Excellence & Box Level Assembly

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

MFX

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Factors in Maximizing the Return on an Investment in Automation
Presenter: Troy Gueller, Rockwell Automation

2:00pm-2:30pm
Enhanced Design Rules and Optimization for Laser Depaneling
Presenter: Jake Benz, LPKF Laser & Electronics SE
Co-Author: Patrick Stockbruegger, M.Sc., LPKF Laser & Electronics SE

2:30pm-3:00pm
The Science of Bonding
Presenter: Dave Dworak, Dymax Corporation

Speakers

Troy Gueller

Senior Project Engineer, Rockwell Automation

Troy Gueller is a Senior Project Engineer at Rockwell Automation, where he leads Automation initiatives across the company’s global footprint. With a career of over 30+ years, Troy brings a unique blend of hands-on technical expertise and overall process vision. He has a strong... Read More →

Jake Benz

Sales Manager, LPKF Laser & Electronics SE

Jake Benz is the Production Laser Systems Sales Manager at LPKF Laser and Electronics, where he leads sales efforts for LPKF’s Laser Induced Deep Etching (LIDE) technology, PCB Laser Depaneling, and SMT Stencil Laser equipment in North America. Based in Portland, OR, Jake plays... Read More →

Dave Dworak

Material Scientist, Dymax Corporation

Dave has over 20 years of adhesive chemistry and formulation experience. He has worked as a polymer chemistspecializing in polyurethane synthesis and formulations as well as living radical polymerization of novel polyacrylates.Dave received his chemistry degree from the University... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
MFX

Conference Session, MFX Track

3:30pm CDT

LTS2: Low-Temperature Soldering Advances

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

LTS

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and TCT Reliability
Presenter: Hongwen Zhang, Ph.D., Indium Corporation
Co-Authors: Danyang Zheng, Ph.D., Cassandra Goppert, Mengyao Wen, Yifan Wu Ph.D., Francis Mutuku Ph.D., Indium Corporation

4:00pm-4:30pm
Deformation and Damage Properties of Solder Joints Reflowed at Temperatures Between 80C and 140C
Presenter: Sai Reddy Munnangi, Ph.D., Binghamton University
Co-Authors: Anola Semndili, Ronit Das, Shantanu Joshi, Peter Borgesen, Binghamton University

Speakers

Hongwen Zhang

Principal Research Metallurgist & RnD Director, Indium Corporation

Dr. Hongwen Zhang is the Principal Research Metallurgist and Research & Development Director at Indium Corporation, with over eighteen years of experience in developing lead-free solder materials. He holds a Ph.D. in Materials Science and Engineering, along with master’s degrees... Read More →

Sai Reddy Munnangi

Student, Binghamton University

This is Sai Kiran, an Industrial and systems engineering PhD student from Binghamton University. My research is focused on Electronics Packaging, reliability testing of interconnects. My work includes identifying and characterizing Sn-Bi-In based alloys for low temperature applications... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
LTS

Conference Session, LTS Track

3:30pm CDT

MFX6: Solder Paste Printing 2

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

MFX

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
The Effect of Viscosity on Solder Paste Performance
Presenter: Gayle Towell, AIM Solder

4:00pm-4:30pm
A Mixed Powder Strategy to Improve Printing and Eliminate Nitrogen in Reflow
Presenter: Mathilde Buret, Inventec Performance Chemicals
Co-Authors: Yvan Bouyou, Mélanie Mathon, Emmanuelle Guene, Inventec Performance Chemicals

Speakers

Gayle Towell

Technical Marketing Lead, AIM Solder

As Technical Marketing Lead for AIM Solder, Gayle Towell serves as a critical bridge between the company’s technical, commercial, and industry engagement functions. She combines deep technical expertise with strategic communication and public-facing research initiatives to align... Read More →

Mathilde BURET

R&D Soldering Engineer, Inventec Performance Chemicals

Mathilde has a master's degree in Chemistry within a chemical engineering school in France, specialized in Formulation Chemistry. She's been part of Inventec Performance Chemicals since 2018. She's working as an R&D soldering engineer with expertise in soldering fluxes and pastes... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
MFX

Conference Session, MFX Track

3:30pm CDT

INS4: Eat Your Vegetables, Part II: Test Methods You Need to Know

Tuesday October 27, 2026 3:30pm - 5:00pm CDT

INS

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
FCT for RF/High Speed Applications with Test Probes. Strategies, Pitfalls and How to Avoid Those
Presenter: Matthias Zapatka, Ingun USA

4:00pm-4:30pm
A Three-Camera based Digital Image Correlation System for Warpage Measurement and CTE Distribution Analysis
Presenters: Liam Crosbie, Dantec Dynamics
Co-Author: LiKang Luan, Dantec Dynamics

4:30pm-5:00pm
Need for speed: Boosting X-Ray Inspection Speed in Advanced Electronics
Presenter: Chris Nicholson, Ph.D., Comet X-Ray
Co-Author: Anthony Williams, Comet X-Ray

Speakers

Matthias Zapatka

Senior FAE, INGUN USA, Inc.

Matthias is the co-founder and Sr. FAE at INGUN USA, Inc. the North American subsidiary of the INGUN group. He has been in the PCBA test industry for over 18 years. Matthias is a frequent speaker at industry related events. Matthias' academic background is RF&Wireless technologies... Read More →

Liam Crosbie

R&D Manager, Dantec Dynamics

Liam Crosbie works as the Research, Development & Product Manager for the Solids Division at Dantec Dynamics in Ulm, Germany. He has over 15 years worth of professional work experience in the materials testing industry, focusing on the application, product & streategic development... Read More →

Chris Nicholson

Product Manager, Comet X-ray

Originally from Scotland, Chris Nicholson completed his PhD in 2018 at the Max Planck Institute in Berlin focusing on laser-induced phase transitions at metal-semiconductor interfaces. Following postdoctoral research he transitioned to industry as an application scientist for electron... Read More →

Tuesday October 27, 2026 3:30pm - 5:00pm CDT
INS

Conference Session, INS Track

3:30pm CDT

RHE4: Conformal Coating and Reliability 2

Tuesday October 27, 2026 3:30pm - 5:00pm CDT

RHE

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
How to Know If Your Conformal Coating Process is Good or Not
Presenter: Jason Keeping, P.E., Celestica

4:00pm-4:30pm
Defects in Conformal Coating
Presenter: Doug Pauls, ItDepends Electronics LLC
Co-Author: Deb Vorwald, Collins Aerospace

4:30pm-5:00pm
BGA Solder Joint Solder Joint Reliability Degradation From Incorrect Conformal Coating Processes
Presenter: David Hillman, Hillman EAS LLC
Co-Author: Ross Wilcoxon, Collins Aerospace

Speakers

Jason Keeping

Staff Engineer, Celestica Inc.

Jason Keeping is the Global Process Subject Matter Expert for Ruggedized Electronics at Celestica. He holds a B.A.Sc. in Electrical Engineering, is a Six Sigma/Lean Professional, and a licensed professional engineer. With more than 15 years of experience, Jason specializes in conformal... Read More →

Doug Pauls

Sr. Technical Fellow, ItDepends Electronics LLC

Doug is a Material Scientist with degrees in Chemistry, Physics and Electrical Engineering.He worked 9 years for the Navy, 8 years as Technical Director of Contamination Studies Labs, and 24 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering... Read More →

David Hillman

Founder / CEO, Hillman EAS LLC

David D. Hillman was a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins/Collins Aerospace in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his... Read More →

Tuesday October 27, 2026 3:30pm - 5:00pm CDT
RHE

Conference Session, RHE Track

5:00pm CDT

RHE Town Hall: The Impact of Conformal Coating on Reliability

Tuesday October 27, 2026 5:00pm - 6:00pm CDT

RHE

Join SMTA for a Town Hall open to all attendees, featuring an engaging and interactive discussion on conformal coating and its impact on solder joint reliability.

The Town Hall will immediately follow the Reliability, Harsh Environment (RHE) technical session on conformal coating, which provides important background and context for the discussion.

This attendee-driven forum welcomes a wide range of perspectives, experiences, and opinions. Audience questions and comments will shape the discussion, creating a dynamic exchange of ideas on one of the industry's most relevant and debated topics.

Please submit questions in advance to: [email protected]

Speakers

Richard Coyle

Consulting Member of the Technical Staff, Nokia Bell Labs

David Hillman

Founder / CEO, Hillman EAS LLC

Tuesday October 27, 2026 5:00pm - 6:00pm CDT
RHE

Conference Session, RHE Track

11:00am CDT

APT1: Advanced Interconnect Materials and Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

APT

Session Chair:
Session Co-Chair:

11:00am-11:30am
Improving Cu-to-Cu Bonding through Cu Nanoparticle Characteristics and Substrate Residual Stress Control
Presenter: Albert Wu, Ph.D., National Central University
Co-Authors: Li-Chen Wu; Shao-Chi Chen; En-Szu Chang; Chang-Meng Wang, National Central University

11:30am-12:00pm
CT-Based Analysis of Cu Loading and Particle Size Effects in Cu-Sn Particulate Systems
Presenter: Gilad Nave, SLB
Co-Authors: Md Asif Faisal Beg, Mark Kostinovsky, Mohamed El Hadachy, F. Patrick McCluskey, SLB

12:00pm-12:30pm
Metal Thermal Interface Materials (TIM) Portfolio Part 1: Indium-Based Solder TIMs
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation
Co-Authors: Miloš Lazić, Kyle Aserian, Ryan Mayberry, Carson Burt, Indium Corporation

Speakers

ALBERT TZU-CHIA WU

Professor, National Central University

Prof. Wu earned his Ph.D. from the University of California, Los Angeles. Since August 2012, he has served as a Professor in the Department of Chemical and Materials Engineering at National Central University. His research focuses on reliability challenges in advanced electronic packaging... Read More →

Ronald Lasky

Senior Technologist, Indium Corporation

Ronald C. Lasky, Ph.D., P.E. Ron is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM. Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly... Read More →

Gilad Nave

Material and Process Engineer, SLB

Gilad holds a PhD from the University of Maryland, with research conducted at the Center for Advanced Life Cycle Engineering (CALCE), where his work focused on high‑temperature Pb‑free solder systems and transient liquid phase sintering (TLPS) materials, including microstructural... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
APT

Conference Session, APT Track

11:00am CDT

RHE5: Mechanical Testing and Interconnect Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

RHE

Session Chair:
Session Co-Chair:

11:00am-11:30am
Sinusoidal Vibration Testing of Wafer Level Chip Scale Packages
Presenter: Jayse McLean, John Deere Intelligent Solutions Group

11:30am-12:00pm
High Density Connector Solder Joint Producibility and Reliability Evaluation for Military & Aerospace Environments
Presenter: Jacob Weber & Daphne Gates, Collins Aerospace
Co-Authors: Kimera Cho, Colette Anctil, John Halverson, Tim Pearson, Ross Wilcoxon, Collins Aerospace

12:00pm-12:30pm
Improving the Mechanical Reliability of a SAC305 Solder Joint by Using Different SAC Solder Pastes and Additional Doping Elements
Presenter: George Winstead, Ph.D., Technology Service Corporation
Co-Authors: Sa’d Hamasha, Ph.D., John Evans, Ph.D., Auburn University

Speakers

Jayse McLean

Senior Engineer, John Deere Intelligent Solutions Group

Jacob Weber

Senior Mechanical Engineer, Collins Aerospace

Jacob is a Senior Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. He is involved with evaluating commercial off the shelf (COTS) and custom components for thermal cycle reliability and... Read More →

Daphne Gates

Mechanical Engineer, Collins Aerospace

Daphne Gates is a Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. She has a B.S. in Materials Engineering from Iowa State University and has been in her current position for 6 years... Read More →

George Winstead

Senior Systems Engineer, Technology Service Corporation

George K. Winstead serves as a Senior Systems Engineer at Leidos at Huntsville, AL. He spent the last 22+ years working in military defense as a mechanical engineer, systems engineer, IPT lead, and chief engineer for Leidos and Northrop Grumman. His work covers designing and developing... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
RHE

Conference Session, RHE Track

11:30am CDT

MFX7: Conformal Coating

Wednesday October 28, 2026 11:30am - 12:30pm CDT

MFX

Session Chair:
Session Co-Chair:

11:30am-12:00pm
Conformal Coating - Between De-wetting and Crystalline Growth. The Quality Problem Identification by FT-IR Spectroscopy
Presenter: Viktoria Rawinski, Rawinski GMBH

12:00pm-12:30pm
The Dirty Dozen - 12 Common Mistakes Made When Cleaning Circuit Assemblies
Presenter: Michael Konrad, Aqueous Technologies

Speakers

Viktoria Rawinski

CEO, Rawinski GmbH

Viktoria Rawinski graduated in Plastics and Rubber Engineering from the University of Applied Science in Wuerzburg. After her thesis on "Development and Design of a Temperature Controlled Electromechanic Test Rig for the Analysis of Piezo-fibre Sensors" she has been called to the... Read More →

Mike Konrad

Founder / CEO, Aqueous Technologies

Mike began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents. Mike is an internationally known speaker... Read More →

Wednesday October 28, 2026 11:30am - 12:30pm CDT
MFX

Conference Session, MFX Track

2:00pm CDT

APT2: Advanced Packaging and Reliability

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

APT

Session Chair: Marie Cole, Retired (Formerly with IBM Corporation)
Session Co-Chair:

2:00pm-2:30pm
Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration
Presenter: Charles Woychik, NHanced Semiconductors

2:30pm-3:00pm
Failure Modes in Flip Chip and Wire Bonded Packages
Presenter: Mumtaz Bora, pSemi

3:00pm-3:30pm
Finite Difference Based Model to Estimate Eutectic SnPb Solder Joint Fatigue Life
Presenter: Robert Darveaux, Ph.D., TMBS, LLC
Co-Authors: Andrew Mawer, NXP Semiconductors; Jean-Paul Clech, Ph.D., EPSI; Pradeep Lall, Ph.D., Auburn University

3:30pm-4:00pm
Copper Core Solder Columns Transfer Heat from Semiconductor Chip Packages More Efficiently than Solder Balls at Cryogenic Temperatures for Quantum, Aerospace, Data Centers and Harsh Environments
Presenter: Martin Hart, Topline Corporation

Speakers

Mumtaz Bora

Principal Packaging Engineer, pSemi

Mumtaz Y. Bora is a Principal packaging Engineer supporting development and outsource assembly of RF -IC packages at pSemi. She directs qualification of fcLGAs, WLCSPs and wire-bonded packages and supportsboard level reliability testing of RF packages. She has worked in advanced PCB... Read More →

Charles Woychik

VP Business Development, NHanced Semiconductors

Charles Woychik is currently the VP of Business Development at NHanced Semiconductor, Inc. Previously he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research... Read More →

Robert Darveaux

President, TMBS, LLC

Robert Darveaux is currently President of TMBS, LLC providing expert witness and engineering consulting services in electronic packaging and related fields. He was previously with Skyworks Solutions, Amkor Technology, Motorola, and Microelectronics Center of North Carolina. Robert... Read More →

Martin Hart

CEO, Topline Corporation

Marty Hart is the founder and CEO of TopLine Corporation. He earned his degree in electrical engineering from California State University, Long Beach, and holds 17 patents related to Column Grid Arrays and vibration dampers. Marty is passionate about advancing the art and science... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
APT

Conference Session, APT Track

2:00pm CDT

MFX8: OPS Excellence

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

MFX

Session Chair:
Session Co-Chair:

2:00pm-2:30pm
Manufacturing Readiness: The Six Pillars of Operational Excellence
Presenter: Mark Dydyk, Dydyk Consulting LLC

2:30pm-3:00pm
The Lost Art of Auditing PCB and SMT Suppliers
Presenter: Albert Block, Better Boards

3:00pm-3:30pm
Don't Change It Yet: A Data-Driven Framework for Extending Cleaning Agent Bath Life
Presenter: Ram Wissel, KYZEN Corporation

3:30pm-4:00pm
Evaluation of Solder Paste Printability with Solder Paste Inspection Equipment After Extended Stencil Cleaning Cycle Intervals
Presenter: Shantanu Joshi, Koki Solder America
Co-Authors: Takeshi Yahagi, Jasbir Bath, Koki Solder America Inc; Ray Welch, Joel Scutchfield, Brent Fischthal, Koh Young Technology

Speakers

Mark Dydyk

President, Mark Dydyk Consulting LLC

Mark Dydyk is a manufacturing executive and consultant with four decades of leadership experience spanning the semiconductor, specialty chemical, and medical device industries.
He has held roles including Plant Director, VP of Engineering, Director of Engineering and Operations, R&D Manager, Process Engineering Manager, and consultant supporting organizations ranging from emerging growth companies to global manufacturers... Read More →

Albert Block

Chief Manufacturing Strategist, Better Board Buying- DirectPCB

ALBERT (AL) BLOCK is a seasoned PCB Manufacturing Strategist, bringing to DirectPCB over 45 years of expertise in the SMTA/PCB industry. Throughout his 22-year tenure at National Instruments (NI), Al evaluated new designs for product reliability and led supplier audits to ensure... Read More →

Ram Wissel

Vice President, KYZEN Corporation

Ram is a process-driven engineer with a passion for developing “greener” cleaning solutions that enhance wash process efficiency while reducing environmental impact. His work focuses on advancing technologies that control, contain, and recycle materials, helping customers operate... Read More →

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
MFX

Conference Session, MFX Track

2:00pm CDT

RHE6: Predictive Modeling

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

RHE

Session Chair:
Session Co-Chair:

2:00pm-2:30pm
A Metamodel for Screening Solder Fatigue Life of BGA Joints with Voids
Presenter: Arvind Purushotaman, Synopsys
Co-Author: Josh Akman, Synopsys

2:30pm-3:00pm
Comparison of Analytical Thermomechanical Modeling and Finite Element Analysis for Lead-Free Wafer-Level Packages Subjected to Temperature Cycling
Presenter: Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

3:00pm-3:30pm
Simulating Reflow Deformation on Highly Complex Printed Circuit Board Designs
Presenter: Tyler Ferris, Ansys

3:30pm-4:00pm
Mission Planning and Digital Twin Workflow for Thermo-Mechanical Solder Fatigue Prediction of Electronics
Presenter: Josh Akman, Synopsis
Co-Authors: Mina Karimaghaei, Ian Pond, Synopsys

Speakers

Arvind Purushotaman

R&D Engineering, Staff Engineer, Synopsys

–R&D Engineer, Synopsys Inc.–Have been developing Ansys Sherlock™ since 2020.–Focus is on developing analytical and finite element models and workflows for predicting board level reliability for electronics.

Jean-Baptiste Libot

Electronic Assembly Expert, Hooke Electronics

Dr. Jean-Baptiste Libot is an Electronic Assembly Expert with over 12 years of experience in the aerospace and defense industry. He began his career at Airbus Group, where he worked as a visiting researcher at the Center for Advanced Life Cycle Engineering (CALCE). He then joined... Read More →

Tyler Ferris

Sr Staff Consultant, Ansys, Part of Synopsys

Tyler Ferris is a Senior Staff Consultant at Synopsys focusing on electronics reliability simulation. He is an expert in the use of reliability physics, finite element analysis and hands-on laboratory failure analysis. Tyler has consulted with customers in the aerospace, automotive... Read More →

Josh Akman

Senior Staff Engineer, Synopsys

Josh Akman is a Senior Application Engineer at Synopsys. His background is in electronics reliability with a focus on simulation and physics-of-failure methodologies. Josh also has experience with reliability testing and failure analysis of electronics. Josh holds a bachelor’s degree... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
RHE

Conference Session, RHE Track

4:30pm CDT

MFX9: AI-Driven Optimization & Resilience

Wednesday October 28, 2026 4:30pm - 5:30pm CDT

MFX

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
Line SPOCK: A Holistic Approach to Statistical Process Optimization, Control, and Kinematics in High-Frequency SMT Performance Validation
Presenter: Michael Sivigny, CeTaQ Americas
Co-Authors:

5:00pm-5:30pm
No Parts, No Boards: A Risk-Based Framework for Mitigating Supply Chain Volatility
Presenter: Ed Dodd, Cofactr
Co-Authors:

Speakers

Michael Sivigny

Owner/General Manager, CeTaQ Americas

Michael Sivigny, now in his 25th year as owner and General Manager of CeTaQ Americas, built the company from the ground up after recognizing an opportunity in February 2001. The parent company, CeTaQ GmbH, based in Dresden, Germany, pioneered a mobile measurement solution in 1996... Read More →

Ed Dodd

VP of Government and Defense, Cofactr

A Navy veteran with twenty years of experience in electronics assurance for critical applications, Ed Dodd is currently working on improving parts management and industry supply chain processes. He currently serves as the Vice President, Government and Defense for Cofactr, a leading... Read More →

Wednesday October 28, 2026 4:30pm - 5:30pm CDT
MFX

Conference Session, MFX Track

4:30pm CDT

APT3: Substrates

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

APT

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
Sintered Cu Paste as a Via-Filling Material for Through-Glass Via -Investigation of Via Planarization using CMP Process
Presenter: Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

5:00pm-5:30pm
Thermal-Mismatch Stress Analysis and Suppression of SEWARE in Glass Core Substrates with Multilayer ABF Build-Up Layers
Presenter: Satoru Kuramochi, Dai Nippon Printing Co. Ltd.
Co-Author: Takamasa Takano, Dai Nippon Printing Co. Ltd.

5:30pm-6:00pm
Epoxy Adhesives with Precision Beads to Control the Air-Gaps for SMT Planar Inductor Applications
Presenter: Yiliang Wu, CollTech Materials Corporation
Co-Authors: Fen Zhang, Jack Chen, CollTech Materials Corporation

Speakers

Yoshinori Eijiri

Chief Researcher, Resonac Co., Ltd.

Yoshinori Ejiri is a chief researcher at the R and D center of Resonac in Japan. He received a B. S. and a M. S. from Tokyo University of Science. He joined Hitachi Chemical in 2000, where he did research and development on Electrolytic plating, Electroless plating and surface finishing... Read More →

Satoru Kuramochi

Fellow, Dai Nippon Printing Co. Ltd.,

Satoru Kuramochi received the B.E. degrees and M.E. degrees in image science engineering from Chiba University Japan, in 1987 and 1989, respectively.He joined Research and Development Center, Dai Nippon Printing Corporation, Japan in 1989. He specializes in the fine pattern processes... Read More →

Yiliang Wu

VP Technology, CollTech Materials Corporation

Dr. Yiliang Wu is the Vice President of Technology and Innovation at CollTech Materials Corporation that specialized in adhesives and thermal interface materials (TIM). His research interests are in advanced materials and their applications for electronics integration. Before joining... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
APT

Conference Session, APT Track

4:30pm CDT

RHE7: Lead-Free Solder Evolution

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

RHE

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
RoHS: Twenty Years Later
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation

5:00pm-5:30pm
A Review on Impact of Isothermal Aging on Thermal Cycling Reliability of Ball Grid Array Packages Assembled Using SAC Lead-Free Solder Alloy
Presenter: Anto Raj, Ph.D., Medtronic
Co-Author: Richard Coyle, Ph.D., Nokia Bell Labs

5:30pm-6:00pm
Impact of Surface Finish on Voiding in Mixed Alloy Solder Paste Systems
Presenter: Thuy Nguyen, Indium Corporation
Co-Authors: Hongwen Zhang, Ph.D., Adam Murling, Ronald Lasky, Ph.D., P.E.,Indium Corporation

Speakers

Ronald Lasky

Senior Technologist, Indium Corporation

Anto Raj

Sr Reliability Engineer, Medtronic

Anto Raj received the B.Eng. degree in electronics and communications engineering from Anna University, Chennai, India, in 2011, and the M.I.S.E. and Ph.D. degrees in industrial and systems engineering from Auburn University, Auburn, AL, USA, in 2015 and 2019, respectively. From 2020... Read More →

Thuy Nguyen

Technical Support Engineer II, Indium Corporation

Thuy Nguyen is a Technical Support Engineer II at Indium Corporation, where she provides advanced soldering process support to customers across the Southwest and Rocky Mountains region. With over a decade of experience spanning Quality, Research and Development, and Manufacturing... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
RHE

Conference Session, RHE Track

8:30am CDT

MFX10: Unique Processes for Assembly 1

Thursday October 29, 2026 8:30am - 10:30am CDT

MFX

Session Chair:
Session Co-Chair:

8:30am-9:00am
A Study of How Nozzle Tip Diameter and PCB Copper Mass Impact the Transfer of Thermal Energy during Mini-Wave Selective Soldering
Presenter: Joseph Clure, KurtzERSA Inc
Co-Authors: Thomas Shoaf, David Miller, KurtzERSA Inc

9:00am-9:30am
Comparative Evaluation of Eutectic and Non-Eutectic Lead-Free Alloy Behavior in Hand Soldering Applications
Presenter: Gayle Towell, AIM Solder
Co-Authors: Kevin Pigeon, Lauren Porto, Leo Lambert, Marcia McLaughlin

9:30am-10:00am
Shelf-Life Study of Near-Chip Connectors on PCB and in Tape and Reel
Presenters: Christine Taylor, Ph.D., IBM Corporation & Tony Sass, IBM Corporation

10:00am-10:30am
Meeting the Challenges of Proper Tinning Today
Presenter: Brian Watson, Ph.D., HyRel Technologies
Co-Authors: John Kerr, Scott Baker, HyRel Technologies

Speakers

Joseph Clure

Head of Application and Demo Centers, KurtzERSA Inc

Joseph Clure is currently the Head of the Applications and Demo Center at KurtzERSA Inc. based at the company’s North American Head Quarters in Plymouth, Wisconsin. He has worked in the Soldering Industry for over 25 years holding the positions of Site Process Engineer, Regional... Read More →

Christine Taylor

Quality Engineer, IBM Corporation

Christine Taylor is an Interconnect Quality Engineer at IBM, supporting connector reliability for high‑performance computing system. She has experience spanning advanced packaging development, electronic materials characterization, and component qualification across research, development... Read More →

Tony Sass

Senior Technical Staff Member, IBM Corporation

Tony Sass is a Senior Technical Staff Member and interconnect qualification engineer based in North Carolina, with over two decades of experience in hardware engineering and product development. He has built a career specializing in interconnect technologies, reliability, and qualification... Read More →

Gayle Towell

Technical Marketing Lead, AIM Solder

Brian Watson

Managing Parter, HyRel Technologies

Brian has been involved in the Industry for over 30 years. He started MRB in 1998 as an electronic packaging recycler for all of Motorola Chicagoland facilities, selling that to ITW Electronics in 1999. He then founded TSR, doing Tape & Reel packaging for AVX. In 2001, he founded... Read More →

Thursday October 29, 2026 8:30am - 10:30am CDT
MFX

Conference Session, MFX Track

9:00am CDT

RHE8: Harsh Use Conditions

Thursday October 29, 2026 9:00am - 10:30am CDT

RHE

Session Chair:
Session Co-Chair:

9:00am-9:30am
Electromigration Behavior of Solder Joints as a Function of Current Density and Joint Temperature
Presenter: Nithin Lakshminarayan, Universal Instruments Corporation
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)

9:30am-10:00am
Advanced Packaging Qualification for Harsh Environments
Presenter: Gilad Nave, Ph.D., SLB
Co-Authors: Masahiro, Tsuriya, iNEMI; David Locker, US Army

10:00am-10:30am
Atomic Layer Deposition/Parylene Conformal Nanocoatings
Presenter: Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.

Speakers

Nithin Lakshminarayan

SMT Lab Engineer, Universal Instruments Corporation

Nithin Lakshminarayan is an SMT Lab Engineer II at Universal Instruments’ Advanced Process Lab, where he specializes in the process optimization, thermomechanical reliability, and failure analysis of advanced electronic interconnects. He holds an M.S. in Manufacturing and Mechanical... Read More →

Gilad Nave

Material and Process Engineer, SLB

Rakesh Kumar

Vice President of Technology, Specialty Coating Systems, Inc.

Dr. Rakesh Kumar is currently the V.P. of Technology for Specialty Coating Systems, Inc., where he leads the R&D group and manages Parylene, Plasma CVD and ALD coatings R&D activities worldwide. He has more than 34 years of extensive experience in advanced polymeric materials and... Read More →

Thursday October 29, 2026 9:00am - 10:30am CDT
RHE

Conference Session, RHE Track

11:00am CDT

RHE9: Factors Affected Thermal Cycling Performance

Thursday October 29, 2026 11:00am - 12:00pm CDT

RHE

Session Chair:
Session Co-Chair:

11:00am-11:30am
Ball Grid Array Footprint Impacts on Reliability
Presenter: William Fox, Lockheed Martin
Co-Author: Ben Gumpert, Lockheed Martin

11:30am-12:00pm
Effects of Thermal Cycling on Electromigration Life of SnAgCu Solder Joints
Presenter: Anola Semndili, Binghamton University
Co-Authors: Sai Kiran Reddy Munnangi, Sitaram Panta, Eric Cotts, Ph.D., Peter Borgesen, Binghamton University

Speakers

William Fox

LM Fellow, Lockheed Martin

William Fox is a materials engineer specializing in failure analysis and laboratory operations. He earned a B.S. in Materials Science & Engineering from Purdue University and an M.S. in Materials Engineering from the University of Dayton. He has published papers in Journal of Nanomaterials... Read More →

Anola Semndili

Research Aide, Binghamton University

Anola Semndili is a third year Ph.D. student in Materials Science and Engineering at Binghamton University., Hher current research is on solder joint reliability including regular, high reliability and low temperature alloys under accelerated testing conditions of electromigration... Read More →

Thursday October 29, 2026 11:00am - 12:00pm CDT
RHE

Conference Session, RHE Track

11:00am CDT

MFX11: Unique Processes for Assembly 2

Thursday October 29, 2026 11:00am - 12:30pm CDT

MFX

Session Chair:
Session Co-Chair:

11:00am-11:30am
SMT Defects Bringing you Down? We’ve Got Solution
Presenters: Tony Lentz, FCT Solder & Greg Smith, StenTech, Inc

11:30am-12:00pm
The challenge and solution for Automation of Straddle Mount Connector Assembly in Card Assembly
Presenter: Wayne Zhang, IBM Corporation
Co-Authors: Theron Lewis, Robin Hou, Andrew Chong, Alex Chan, Kenny Chew, Venothraaj Rajandran, Ridwan Muhamad, Chin Kar Heng, William Chong Sook Kean, Mustaza Abdul Malik, Muhammad Syahmi Shafidin, Mohd Nasrul Ismail, Thinagaran Selvan, Vijia Nant, IBM Corporation

12:00pm-12:30pm
How Heavy Copper Designs Influence Through‑Hole Barrel Fill
Presenter: Mei Ming Khaw, Keysight Technologies
Co-Author: Xi Lin, Por, Keysight Technologies

Speakers

Tony Lentz

Chemist & Field Application, FCT Solder

Tony Lentz worked as a PCB manufacturing engineer from 1994-1999, and a lab manager from 1999-2012. Since 2013, he has worked in R&D and field application for FCT Solder. Tony is the vice-chair of the IPC JSTD-005 task group and chair-emeritus of the IPC J-STD-004 task group. Tony... Read More →

Greg Smith

Technology Director, StenTech, Inc

Greg Smith has worked in the electronics industry since 1989. He owned a stencil manufacturing company for 23 years prior to joining BlueRing Stencils which has now merged with Stentech. He is currently the Technology Director for Stentech. Greg writes and presents white papers, works... Read More →

Wayne Zhang

Supply Chain Engineer, IBM Corporation

Wayne Zhang is a Supply Chain Engineer with ECAT Interconnect Technology at IBM Corporation. He currently works as a Qualification Engineer, focusing on reliability assessments for medium- to high-complexity server applications. In this role, Wayne ensures that server technologies... Read More →

Mei Ming Khaw

Material Reliability Program Manager, Keysight Technologies

Khaw Mei Ming holds a bachelor’s degree in Electronics and Computer Engineering and has 29 years of experience in the EMS and OEM industries. She has presented several technical papers at international conferences on topics ranging from PCB materials to PCA manufacturing processes... Read More →

Thursday October 29, 2026 11:00am - 12:30pm CDT
MFX

Conference Session, MFX Track

1:00pm CDT

1:00pm CDT

3:00pm CDT

3:00pm CDT

8:30am CDT

8:30am CDT

8:30am CDT

10:30am CDT

10:30am CDT

10:30am CDT

1:00pm CDT

1:30pm CDT

1:30pm CDT

1:30pm CDT

3:30pm CDT

3:30pm CDT

3:30pm CDT

3:30pm CDT

5:00pm CDT

11:00am CDT

11:00am CDT

11:30am CDT

2:00pm CDT

2:00pm CDT

2:00pm CDT

4:30pm CDT

4:30pm CDT

4:30pm CDT

8:30am CDT

9:00am CDT

11:00am CDT

11:00am CDT

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