SMTA International 2026: Full Schedule

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11:00am CDT

RHE5: Mechanical Testing and Interconnect Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

Session Chair:
Session Co-Chair:

11:00am-11:30am
Sinusoidal Vibration Testing of Wafer Level Chip Scale Packages
Presenter: Jayse McLean, John Deere Intelligent Solutions Group

11:30am-12:00pm
High Density Connector Solder Joint Producibility and Reliability Evaluation for Military & Aerospace Environments
Presenter: Jacob Weber & Daphne Gates, Collins Aerospace
Co-Authors: Kimera Cho, Colette Anctil, John Halverson, Tim Pearson, Ross Wilcoxon, Collins Aerospace

12:00pm-12:30pm
Improving the Mechanical Reliability of a SAC305 Solder Joint by Using Different SAC Solder Pastes and Additional Doping Elements
Presenter: George Winstead, Ph.D., Technology Service Corporation
Co-Authors: Sa’d Hamasha, Ph.D., John Evans, Ph.D., Auburn University

Speakers

Jayse McLean

Senior Engineer, John Deere Intelligent Solutions Group

Jayse is a senior engineer in the advanced engineering group as a part of the overall John Deere Intelligent Solutions Group. He has a Bachelor of Science and Master of Science in Mechanical Engineering from North Dakota State University. He has worked at Deere for 7 years and during... Read More →

Jacob Weber

Senior Mechanical Engineer, Collins Aerospace

Jacob is a Senior Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. He is involved with evaluating commercial off the shelf (COTS) and custom components for thermal cycle reliability and... Read More →

Daphne Gates

Mechanical Engineer, Collins Aerospace

Daphne Gates is a Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. She has a B.S. in Materials Engineering from Iowa State University and has been in her current position for 6 years... Read More →

George Winstead

Senior Systems Engineer, Technology Service Corporation

George K. Winstead serves as a Senior Systems Engineer at Leidos at Huntsville, AL. He spent the last 22+ years working in military defense as a mechanical engineer, systems engineer, IPT lead, and chief engineer for Leidos and Northrop Grumman. His work covers designing and developing... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
RHE

Conference Session, RHE Track

2:00pm CDT

RHE6: Predictive Modeling

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

RHE

Session Chair:
Session Co-Chair:

2:00pm-2:30pm
A Metamodel for Screening Solder Fatigue Life of BGA Joints with Voids
Presenter: Arvind Purushotaman, Synopsys
Co-Author: Josh Akman, Synopsys

2:30pm-3:00pm
Comparison of Analytical Thermomechanical Modeling and Finite Element Analysis for Lead-Free Wafer-Level Packages Subjected to Temperature Cycling
Presenter: Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

3:00pm-3:30pm
Simulating Reflow Deformation on Highly Complex Printed Circuit Board Designs
Presenter: Tyler Ferris, Ansys

3:30pm-4:00pm
Mission Planning and Digital Twin Workflow for Thermo-Mechanical Solder Fatigue Prediction of Electronics
Presenter: Josh Akman, Synopsis
Co-Authors: Mina Karimaghaei, Ian Pond, Synopsys

Speakers

Arvind Purushotaman

R&D Engineering, Staff Engineer, Synopsys

–R&D Engineer, Synopsys Inc.–Have been developing Ansys Sherlock™ since 2020.–Focus is on developing analytical and finite element models and workflows for predicting board level reliability for electronics.

Jean-Baptiste Libot

Electronic Assembly Expert, Hooke Electronics

Dr. Jean-Baptiste Libot is an Electronic Assembly Expert with over 12 years of experience in the aerospace and defense industry. He began his career at Airbus Group, where he worked as a visiting researcher at the Center for Advanced Life Cycle Engineering (CALCE). He then joined... Read More →

Tyler Ferris

Sr Staff Consultant, Ansys, Part of Synopsys

Tyler Ferris is a Senior Staff Consultant at Synopsys focusing on electronics reliability simulation. He is an expert in the use of reliability physics, finite element analysis and hands-on laboratory failure analysis. Tyler has consulted with customers in the aerospace, automotive... Read More →

Josh Akman

Senior Staff Engineer, Synopsys

Josh Akman is a Senior Application Engineer at Synopsys. His background is in electronics reliability with a focus on simulation and physics-of-failure methodologies. Josh also has experience with reliability testing and failure analysis of electronics. Josh holds a bachelor’s degree... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
RHE

Conference Session, RHE Track

4:30pm CDT

RHE7: Lead-Free Solder Evolution

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

RHE

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
RoHS: Twenty Years Later
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation

5:00pm-5:30pm
A Review on Impact of Isothermal Aging on Thermal Cycling Reliability of Ball Grid Array Packages Assembled Using SAC Lead-Free Solder Alloy
Presenter: Anto Raj, Ph.D., Medtronic
Co-Author: Richard Coyle, Ph.D., Nokia Bell Labs

5:30pm-6:00pm
Impact of Surface Finish on Voiding in Mixed Alloy Solder Paste Systems
Presenter: Thuy Nguyen, Indium Corporation
Co-Authors: Hongwen Zhang, Ph.D., Adam Murling, Ronald Lasky, Ph.D., P.E.,Indium Corporation

Speakers

Ronald Lasky

Senior Technologist, Indium Corporation

Ronald C. Lasky, Ph.D., P.E. Ron is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM. Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly... Read More →

Anto Raj

Sr Reliability Engineer, Medtronic

Anto Raj received the B.Eng. degree in electronics and communications engineering from Anna University, Chennai, India, in 2011, and the M.I.S.E. and Ph.D. degrees in industrial and systems engineering from Auburn University, Auburn, AL, USA, in 2015 and 2019, respectively. From 2020... Read More →

Thuy Nguyen

Technical Support Engineer II, Indium Corporation

Thuy Nguyen is a Technical Support Engineer II at Indium Corporation, where she provides advanced soldering process support to customers across the Southwest and Rocky Mountains region. With over a decade of experience spanning Quality, Research and Development, and Manufacturing... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
RHE

Conference Session, RHE Track

11:00am CDT

2:00pm CDT

4:30pm CDT

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