SMTA International 2026: Full Schedule

arrow_back View All Dates

11:00am CDT

APT1: Advanced Interconnect Materials and Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

Session Chair: Andrew Mawer, NXP Semiconductors
Session Co-Chair: Prathiksha Ramprasad Dhanpal, Westcliff University

11:00am-11:30am
Improving Cu-to-Cu Bonding through Cu Nanoparticle Characteristics and Substrate Residual Stress Control
Presenter: Albert Wu, Ph.D., National Central University
Co-Authors: Li-Chen Wu; Shao-Chi Chen; En-Szu Chang; Chang-Meng Wang, National Central University

11:30am-12:00pm
CT-Based Analysis of Cu Loading and Particle Size Effects in Cu-Sn Particulate Systems
Presenter: Gilad Nave, SLB
Co-Authors: Md Asif Faisal Beg, Mark Kostinovsky, Mohamed El Hadachy, F. Patrick McCluskey, SLB

12:00pm-12:30pm
Metal Thermal Interface Materials (TIM) Portfolio Part 1: Indium-Based Solder TIMs
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation
Co-Authors: Miloš Lazić, Kyle Aserian, Ryan Mayberry, Carson Burt, Indium Corporation

Speakers

ALBERT TZU-CHIA WU

Professor, National Central University

Prof. Wu earned his Ph.D. from the University of California, Los Angeles. Since August 2012, he has served as a Professor in the Department of Chemical and Materials Engineering at National Central University. His research focuses on reliability challenges in advanced electronic packaging... Read More →

Ronald Lasky

Senior Technologist, Indium Corporation

Ronald C. Lasky, Ph.D., P.E. Ron is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM. Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly... Read More →

Gilad Nave

Material and Process Engineer, SLB

Gilad holds a PhD from the University of Maryland, with research conducted at the Center for Advanced Life Cycle Engineering (CALCE), where his work focused on high‑temperature Pb‑free solder systems and transient liquid phase sintering (TLPS) materials, including microstructural... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
APT

Conference Session, APT Track

2:00pm CDT

APT2: Advanced Packaging and Reliability

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

APT

Session Chair: Marie Cole, Retired (Formerly with IBM Corporation)
Session Co-Chair:

2:00pm-2:30pm
Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration
Presenter: Charles Woychik, NHanced Semiconductors

2:30pm-3:00pm
Failure Modes in Flip Chip and Wire Bonded Packages
Presenter: Mumtaz Bora, pSemi

3:00pm-3:30pm
Finite Difference Based Model to Estimate Eutectic SnPb Solder Joint Fatigue Life
Presenter: Robert Darveaux, Ph.D., TMBS, LLC
Co-Authors: Andrew Mawer, NXP Semiconductors; Jean-Paul Clech, Ph.D., EPSI; Pradeep Lall, Ph.D., Auburn University

3:30pm-4:00pm
Copper Core Solder Columns Transfer Heat from Semiconductor Chip Packages More Efficiently than Solder Balls at Cryogenic Temperatures for Quantum, Aerospace, Data Centers and Harsh Environments
Presenter: Martin Hart, Topline Corporation

Speakers

Mumtaz Bora

Principal Packaging Engineer, pSemi

Mumtaz Y. Bora is a Principal packaging Engineer supporting development and outsource assembly of RF -IC packages at pSemi. She directs qualification of fcLGAs, WLCSPs and wire-bonded packages and supportsboard level reliability testing of RF packages. She has worked in advanced PCB... Read More →

Charles Woychik

VP Business Development, NHanced Semiconductors

Charles Woychik is currently the VP of Business Development at NHanced Semiconductor, Inc. Previously he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research... Read More →

Robert Darveaux

President, TMBS, LLC

Robert Darveaux is currently President of TMBS, LLC providing expert witness and engineering consulting services in electronic packaging and related fields. He was previously with Skyworks Solutions, Amkor Technology, Motorola, and Microelectronics Center of North Carolina. Robert... Read More →

Martin Hart

CEO, Topline Corporation

Marty Hart is the founder and CEO of TopLine Corporation. He earned his degree in electrical engineering from California State University, Long Beach, and holds 17 patents related to Column Grid Arrays and vibration dampers. Marty is passionate about advancing the art and science... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
APT

Conference Session, APT Track

4:30pm CDT

APT3: Korean Packaging Integration Association

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

APT

Session Chair: Sung-Jin Kim, Chungbuk National University
Session Co-Chair: HyunHo Kim, Korea Packaging Integration Association

4:30pm-5:00pm
AI and HPC Advanced Packaging Technology
Presenter: YoungDo Kweon, AMKOR Technology

5:00pm-5:30pm
Metal- Oxide Sphere-Structured Thermal Interface Material for Efficient Heat Dissipation
Presenter: Jinsub Park, Ph.D., Hanyang University

5:30pm-6:00pm
Comprehensive review on Artificial Synaptic Devices with Amorphous Oxide Semiconductor Thin Film Transistors for Neuromorphic Computing: Materials, Devices, and Emerging Applications
Presenters: Sang Yeol Lee, PhD., Gachon University
Co-Authors: Sandeep Kumar, Hyeonji Kim, Gachon University

Speakers

Jinsub Park

Professor, Hanyang University

Jinsub Park is a Professor in the Department of Electronic Engineering at Hanyang University, Seoul, Korea, where he also serves as the Head of the Department of Semiconductor Engineering and the Department of Electronic Engineering. He is the Director of the Advanced Convergence... Read More →

Sang Yeol Lee

Professor, Cheongju University

Sang Yeol Lee is a Professor in the Department of Semiconductor Engineering at Cheongju University and Director of the Research Institute of Advanced Semiconductor Convergence Technology. He also serves as Director of the Gachon Advanced Institute of Semiconductor Technology (GAIST... Read More →

YoungDo Kweon

AMKOR Technology

YoungDo Kweon joined Amkor Technology in 2015 and currently serves as Senior Director of
Development Program Management, focusing on advanced chiplet-based flip chip packaging
technologies for AI and high-performance computing applications. Since 1988, he has built extensive
exp... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
APT

Conference Session, APT Track

11:00am CDT

2:00pm CDT

4:30pm CDT

Get help with the event