SMTA International 2026: Full Schedule

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11:00am CDT

APT1: Advanced Interconnect Materials and Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

Session Chair:
Session Co-Chair:

11:00am-11:30am
Improving Cu-to-Cu Bonding through Cu Nanoparticle Characteristics and Substrate Residual Stress Control
Presenter: Albert Wu, Ph.D., National Central University
Co-Authors: Li-Chen Wu; Shao-Chi Chen; En-Szu Chang; Chang-Meng Wang, National Central University

11:30am-12:00pm
CT-Based Analysis of Cu Loading and Particle Size Effects in Cu-Sn Particulate Systems
Presenter: Gilad Nave, SLB
Co-Authors: Md Asif Faisal Beg, Mark Kostinovsky, Mohamed El Hadachy, F. Patrick McCluskey, SLB

12:00pm-12:30pm
Metal Thermal Interface Materials (TIM) Portfolio Part 1: Indium-Based Solder TIMs
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation
Co-Authors: Miloš Lazić, Kyle Aserian, Ryan Mayberry, Carson Burt, Indium Corporation

Speakers

ALBERT TZU-CHIA WU

Professor, National Central University

Prof. Wu earned his Ph.D. from the University of California, Los Angeles. Since August 2012, he has served as a Professor in the Department of Chemical and Materials Engineering at National Central University. His research focuses on reliability challenges in advanced electronic packaging... Read More →

Ronald Lasky

Senior Technologist, Indium Corporation

Ronald C. Lasky, Ph.D., P.E. Ron is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM. Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly... Read More →

Gilad Nave

Material and Process Engineer, SLB

Gilad holds a PhD from the University of Maryland, with research conducted at the Center for Advanced Life Cycle Engineering (CALCE), where his work focused on high‑temperature Pb‑free solder systems and transient liquid phase sintering (TLPS) materials, including microstructural... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
APT

Conference Session, APT Track

2:00pm CDT

APT2: Advanced Packaging and Reliability

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

APT

Session Chair: Marie Cole, Retired (Formerly with IBM Corporation)
Session Co-Chair:

2:00pm-2:30pm
Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration
Presenter: Charles Woychik, NHanced Semiconductors

2:30pm-3:00pm
Failure Modes in Flip Chip and Wire Bonded Packages
Presenter: Mumtaz Bora, pSemi

3:00pm-3:30pm
Finite Difference Based Model to Estimate Eutectic SnPb Solder Joint Fatigue Life
Presenter: Robert Darveaux, Ph.D., TMBS, LLC
Co-Authors: Andrew Mawer, NXP Semiconductors; Jean-Paul Clech, Ph.D., EPSI; Pradeep Lall, Ph.D., Auburn University

3:30pm-4:00pm
Copper Core Solder Columns Transfer Heat from Semiconductor Chip Packages More Efficiently than Solder Balls at Cryogenic Temperatures for Quantum, Aerospace, Data Centers and Harsh Environments
Presenter: Martin Hart, Topline Corporation

Speakers

Mumtaz Bora

Principal Packaging Engineer, pSemi

Mumtaz Y. Bora is a Principal packaging Engineer supporting development and outsource assembly of RF -IC packages at pSemi. She directs qualification of fcLGAs, WLCSPs and wire-bonded packages and supportsboard level reliability testing of RF packages. She has worked in advanced PCB... Read More →

Charles Woychik

VP Business Development, NHanced Semiconductors

Charles Woychik is currently the VP of Business Development at NHanced Semiconductor, Inc. Previously he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research... Read More →

Robert Darveaux

President, TMBS, LLC

Robert Darveaux is currently President of TMBS, LLC providing expert witness and engineering consulting services in electronic packaging and related fields. He was previously with Skyworks Solutions, Amkor Technology, Motorola, and Microelectronics Center of North Carolina. Robert... Read More →

Martin Hart

CEO, Topline Corporation

Marty Hart is the founder and CEO of TopLine Corporation. He earned his degree in electrical engineering from California State University, Long Beach, and holds 17 patents related to Column Grid Arrays and vibration dampers. Marty is passionate about advancing the art and science... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
APT

Conference Session, APT Track

4:30pm CDT

APT3: Substrates

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

APT

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
Sintered Cu Paste as a Via-Filling Material for Through-Glass Via -Investigation of Via Planarization using CMP Process
Presenter: Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

5:00pm-5:30pm
Thermal-Mismatch Stress Analysis and Suppression of SEWARE in Glass Core Substrates with Multilayer ABF Build-Up Layers
Presenter: Satoru Kuramochi, Dai Nippon Printing Co. Ltd.
Co-Author: Takamasa Takano, Dai Nippon Printing Co. Ltd.

5:30pm-6:00pm
Epoxy Adhesives with Precision Beads to Control the Air-Gaps for SMT Planar Inductor Applications
Presenter: Yiliang Wu, CollTech Materials Corporation
Co-Authors: Fen Zhang, Jack Chen, CollTech Materials Corporation

Speakers

Yoshinori Eijiri

Chief Researcher, Resonac Co., Ltd.

Yoshinori Ejiri is a chief researcher at the R and D center of Resonac in Japan. He received a B. S. and a M. S. from Tokyo University of Science. He joined Hitachi Chemical in 2000, where he did research and development on Electrolytic plating, Electroless plating and surface finishing... Read More →

Satoru Kuramochi

Fellow, Dai Nippon Printing Co. Ltd.,

Satoru Kuramochi received the B.E. degrees and M.E. degrees in image science engineering from Chiba University Japan, in 1987 and 1989, respectively.He joined Research and Development Center, Dai Nippon Printing Corporation, Japan in 1989. He specializes in the fine pattern processes... Read More →

Yiliang Wu

VP Technology, CollTech Materials Corporation

Dr. Yiliang Wu is the Vice President of Technology and Innovation at CollTech Materials Corporation that specialized in adhesives and thermal interface materials (TIM). His research interests are in advanced materials and their applications for electronics integration. Before joining... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
APT

Conference Session, APT Track

11:00am CDT

2:00pm CDT

4:30pm CDT

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