SMTA International 2026: Full Schedule

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11:00am CDT

APT1: Advanced Interconnect Materials and Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

Session Chair:
Session Co-Chair:

11:00am-11:30am
Improving Cu-to-Cu Bonding through Cu Nanoparticle Characteristics and Substrate Residual Stress Control
Presenter: Albert Wu, Ph.D., National Central University
Co-Authors: Li-Chen Wu; Shao-Chi Chen; En-Szu Chang; Chang-Meng Wang, National Central University

11:30am-12:00pm
CT-Based Analysis of Cu Loading and Particle Size Effects in Cu-Sn Particulate Systems
Presenter: Gilad Nave, SLB
Co-Authors: Md Asif Faisal Beg, Mark Kostinovsky, Mohamed El Hadachy, F. Patrick McCluskey, SLB

12:00pm-12:30pm
Metal Thermal Interface Materials (TIM) Portfolio Part 1: Indium-Based Solder TIMs
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation
Co-Authors: Miloš Lazić, Kyle Aserian, Ryan Mayberry, Carson Burt, Indium Corporation

Speakers

ALBERT TZU-CHIA WU

Professor, National Central University

Prof. Wu earned his Ph.D. from the University of California, Los Angeles. Since August 2012, he has served as a Professor in the Department of Chemical and Materials Engineering at National Central University. His research focuses on reliability challenges in advanced electronic packaging... Read More →

Ronald Lasky

Senior Technologist, Indium Corporation

Ronald C. Lasky, Ph.D., P.E. Ron is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM. Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly... Read More →

Gilad Nave

Material and Process Engineer, SLB

Gilad holds a PhD from the University of Maryland, with research conducted at the Center for Advanced Life Cycle Engineering (CALCE), where his work focused on high‑temperature Pb‑free solder systems and transient liquid phase sintering (TLPS) materials, including microstructural... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
APT

Conference Session, APT Track

11:00am CDT

RHE5: Mechanical Testing and Interconnect Reliability

Wednesday October 28, 2026 11:00am - 12:30pm CDT

RHE

Session Chair:
Session Co-Chair:

11:00am-11:30am
Sinusoidal Vibration Testing of Wafer Level Chip Scale Packages
Presenter: Jayse McLean, John Deere Intelligent Solutions Group

11:30am-12:00pm
High Density Connector Solder Joint Producibility and Reliability Evaluation for Military & Aerospace Environments
Presenter: Jacob Weber & Daphne Gates, Collins Aerospace
Co-Authors: Kimera Cho, Colette Anctil, John Halverson, Tim Pearson, Ross Wilcoxon, Collins Aerospace

12:00pm-12:30pm
Improving the Mechanical Reliability of a SAC305 Solder Joint by Using Different SAC Solder Pastes and Additional Doping Elements
Presenter: George Winstead, Ph.D., Technology Service Corporation
Co-Authors: Sa’d Hamasha, Ph.D., John Evans, Ph.D., Auburn University

Speakers

Jayse McLean

Senior Engineer, John Deere Intelligent Solutions Group

Jayse is a senior engineer in the advanced engineering group as a part of the overall John Deere Intelligent Solutions Group. He has a Bachelor of Science and Master of Science in Mechanical Engineering from North Dakota State University. He has worked at Deere for 7 years and during... Read More →

Jacob Weber

Senior Mechanical Engineer, Collins Aerospace

Jacob is a Senior Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. He is involved with evaluating commercial off the shelf (COTS) and custom components for thermal cycle reliability and... Read More →

Daphne Gates

Mechanical Engineer, Collins Aerospace

Daphne Gates is a Mechanical Engineer in the Microelectronics Department of Applied Research & Technology at Collins Aerospace (An RTX Company) in Cedar Rapids, IA. She has a B.S. in Materials Engineering from Iowa State University and has been in her current position for 6 years... Read More →

George Winstead

Senior Systems Engineer, Technology Service Corporation

George K. Winstead serves as a Senior Systems Engineer at Leidos at Huntsville, AL. He spent the last 22+ years working in military defense as a mechanical engineer, systems engineer, IPT lead, and chief engineer for Leidos and Northrop Grumman. His work covers designing and developing... Read More →

Wednesday October 28, 2026 11:00am - 12:30pm CDT
RHE

Conference Session, RHE Track

11:30am CDT

MFX7: Conformal Coating

Wednesday October 28, 2026 11:30am - 12:30pm CDT

MFX

Session Chair:
Session Co-Chair:

11:30am-12:00pm
Conformal Coating - Between De-wetting and Crystalline Growth. The Quality Problem Identification by FT-IR Spectroscopy
Presenter: Viktoria Rawinski, Rawinski GMBH

12:00pm-12:30pm
The Dirty Dozen - 12 Common Mistakes Made When Cleaning Circuit Assemblies
Presenter: Michael Konrad, Aqueous Technologies

Speakers

Viktoria Rawinski

CEO, Rawinski GmbH

Viktoria Rawinski graduated in Plastics and Rubber Engineering from the University of Applied Science in Wuerzburg. After her thesis on "Development and Design of a Temperature Controlled Electromechanic Test Rig for the Analysis of Piezo-fibre Sensors" she has been called to the... Read More →

Mike Konrad

Founder / CEO, Aqueous Technologies

Mike began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents. Mike is an internationally known speaker... Read More →

Wednesday October 28, 2026 11:30am - 12:30pm CDT
MFX

Conference Session, MFX Track

2:00pm CDT

APT2: Advanced Packaging and Reliability

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

APT

Session Chair: Marie Cole, Retired (Formerly with IBM Corporation)
Session Co-Chair:

2:00pm-2:30pm
Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration
Presenter: Charles Woychik, NHanced Semiconductors

2:30pm-3:00pm
Failure Modes in Flip Chip and Wire Bonded Packages
Presenter: Mumtaz Bora, pSemi

3:00pm-3:30pm
Finite Difference Based Model to Estimate Eutectic SnPb Solder Joint Fatigue Life
Presenter: Robert Darveaux, Ph.D., TMBS, LLC
Co-Authors: Andrew Mawer, NXP Semiconductors; Jean-Paul Clech, Ph.D., EPSI; Pradeep Lall, Ph.D., Auburn University

3:30pm-4:00pm
Copper Core Solder Columns Transfer Heat from Semiconductor Chip Packages More Efficiently than Solder Balls at Cryogenic Temperatures for Quantum, Aerospace, Data Centers and Harsh Environments
Presenter: Martin Hart, Topline Corporation

Speakers

Mumtaz Bora

Principal Packaging Engineer, pSemi

Mumtaz Y. Bora is a Principal packaging Engineer supporting development and outsource assembly of RF -IC packages at pSemi. She directs qualification of fcLGAs, WLCSPs and wire-bonded packages and supportsboard level reliability testing of RF packages. She has worked in advanced PCB... Read More →

Charles Woychik

VP Business Development, NHanced Semiconductors

Charles Woychik is currently the VP of Business Development at NHanced Semiconductor, Inc. Previously he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research... Read More →

Robert Darveaux

President, TMBS, LLC

Robert Darveaux is currently President of TMBS, LLC providing expert witness and engineering consulting services in electronic packaging and related fields. He was previously with Skyworks Solutions, Amkor Technology, Motorola, and Microelectronics Center of North Carolina. Robert... Read More →

Martin Hart

CEO, Topline Corporation

Marty Hart is the founder and CEO of TopLine Corporation. He earned his degree in electrical engineering from California State University, Long Beach, and holds 17 patents related to Column Grid Arrays and vibration dampers. Marty is passionate about advancing the art and science... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
APT

Conference Session, APT Track

2:00pm CDT

MFX8: OPS Excellence

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

MFX

Session Chair:
Session Co-Chair:

2:00pm-2:30pm
Manufacturing Readiness: The Six Pillars of Operational Excellence
Presenter: Mark Dydyk, Dydyk Consulting LLC

2:30pm-3:00pm
The Lost Art of Auditing PCB and SMT Suppliers
Presenter: Albert Block, Better Boards

3:00pm-3:30pm
Don't Change It Yet: A Data-Driven Framework for Extending Cleaning Agent Bath Life
Presenter: Ram Wissel, KYZEN Corporation

3:30pm-4:00pm
Evaluation of Solder Paste Printability with Solder Paste Inspection Equipment After Extended Stencil Cleaning Cycle Intervals
Presenter: Shantanu Joshi, Koki Solder America
Co-Authors: Takeshi Yahagi, Jasbir Bath, Koki Solder America Inc; Ray Welch, Joel Scutchfield, Brent Fischthal, Koh Young Technology

Speakers

Mark Dydyk

President, Mark Dydyk Consulting LLC

Mark Dydyk is a manufacturing executive and consultant with four decades of leadership experience spanning the semiconductor, specialty chemical, and medical device industries.
He has held roles including Plant Director, VP of Engineering, Director of Engineering and Operations, R&D Manager, Process Engineering Manager, and consultant supporting organizations ranging from emerging growth companies to global manufacturers... Read More →

Albert Block

Chief Manufacturing Strategist, Better Board Buying- DirectPCB

ALBERT (AL) BLOCK is a seasoned PCB Manufacturing Strategist, bringing to DirectPCB over 45 years of expertise in the SMTA/PCB industry. Throughout his 22-year tenure at National Instruments (NI), Al evaluated new designs for product reliability and led supplier audits to ensure... Read More →

Ram Wissel

Vice President, KYZEN Corporation

Ram is a process-driven engineer with a passion for developing “greener” cleaning solutions that enhance wash process efficiency while reducing environmental impact. His work focuses on advancing technologies that control, contain, and recycle materials, helping customers operate... Read More →

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Shantanu Joshi is the Head of Customer Solutions and Operational Excellence at KOKI Solder America and an Engineering Sales Manager at Koki Company Ltd., a global leader in soldering materials and solutions. With more than 10 years of experience in electronics manufacturing, he has... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
MFX

Conference Session, MFX Track

2:00pm CDT

RHE6: Predictive Modeling

Wednesday October 28, 2026 2:00pm - 4:00pm CDT

RHE

Session Chair:
Session Co-Chair:

2:00pm-2:30pm
A Metamodel for Screening Solder Fatigue Life of BGA Joints with Voids
Presenter: Arvind Purushotaman, Synopsys
Co-Author: Josh Akman, Synopsys

2:30pm-3:00pm
Comparison of Analytical Thermomechanical Modeling and Finite Element Analysis for Lead-Free Wafer-Level Packages Subjected to Temperature Cycling
Presenter: Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

3:00pm-3:30pm
Simulating Reflow Deformation on Highly Complex Printed Circuit Board Designs
Presenter: Tyler Ferris, Ansys

3:30pm-4:00pm
Mission Planning and Digital Twin Workflow for Thermo-Mechanical Solder Fatigue Prediction of Electronics
Presenter: Josh Akman, Synopsis
Co-Authors: Mina Karimaghaei, Ian Pond, Synopsys

Speakers

Arvind Purushotaman

R&D Engineering, Staff Engineer, Synopsys

–R&D Engineer, Synopsys Inc.–Have been developing Ansys Sherlock™ since 2020.–Focus is on developing analytical and finite element models and workflows for predicting board level reliability for electronics.

Jean-Baptiste Libot

Electronic Assembly Expert, Hooke Electronics

Dr. Jean-Baptiste Libot is an Electronic Assembly Expert with over 12 years of experience in the aerospace and defense industry. He began his career at Airbus Group, where he worked as a visiting researcher at the Center for Advanced Life Cycle Engineering (CALCE). He then joined... Read More →

Tyler Ferris

Sr Staff Consultant, Ansys, Part of Synopsys

Tyler Ferris is a Senior Staff Consultant at Synopsys focusing on electronics reliability simulation. He is an expert in the use of reliability physics, finite element analysis and hands-on laboratory failure analysis. Tyler has consulted with customers in the aerospace, automotive... Read More →

Josh Akman

Senior Staff Engineer, Synopsys

Josh Akman is a Senior Application Engineer at Synopsys. His background is in electronics reliability with a focus on simulation and physics-of-failure methodologies. Josh also has experience with reliability testing and failure analysis of electronics. Josh holds a bachelor’s degree... Read More →

Wednesday October 28, 2026 2:00pm - 4:00pm CDT
RHE

Conference Session, RHE Track

4:30pm CDT

MFX9: AI-Driven Optimization & Resilience

Wednesday October 28, 2026 4:30pm - 5:30pm CDT

MFX

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
Line SPOCK: A Holistic Approach to Statistical Process Optimization, Control, and Kinematics in High-Frequency SMT Performance Validation
Presenter: Michael Sivigny, CeTaQ Americas
Co-Authors:

5:00pm-5:30pm
No Parts, No Boards: A Risk-Based Framework for Mitigating Supply Chain Volatility
Presenter: Ed Dodd, Cofactr
Co-Authors:

Speakers

Michael Sivigny

Owner/General Manager, CeTaQ Americas

Michael Sivigny, now in his 25th year as owner and General Manager of CeTaQ Americas, built the company from the ground up after recognizing an opportunity in February 2001. The parent company, CeTaQ GmbH, based in Dresden, Germany, pioneered a mobile measurement solution in 1996... Read More →

Ed Dodd

VP of Government and Defense, Cofactr

A Navy veteran with twenty years of experience in electronics assurance for critical applications, Ed Dodd is currently working on improving parts management and industry supply chain processes. He currently serves as the Vice President, Government and Defense for Cofactr, a leading... Read More →

Wednesday October 28, 2026 4:30pm - 5:30pm CDT
MFX

Conference Session, MFX Track

4:30pm CDT

APT3: Substrates

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

APT

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
Sintered Cu Paste as a Via-Filling Material for Through-Glass Via -Investigation of Via Planarization using CMP Process
Presenter: Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

5:00pm-5:30pm
Thermal-Mismatch Stress Analysis and Suppression of SEWARE in Glass Core Substrates with Multilayer ABF Build-Up Layers
Presenter: Satoru Kuramochi, Dai Nippon Printing Co. Ltd.
Co-Author: Takamasa Takano, Dai Nippon Printing Co. Ltd.

5:30pm-6:00pm
Epoxy Adhesives with Precision Beads to Control the Air-Gaps for SMT Planar Inductor Applications
Presenter: Yiliang Wu, CollTech Materials Corporation
Co-Authors: Fen Zhang, Jack Chen, CollTech Materials Corporation

Speakers

Yoshinori Eijiri

Chief Researcher, Resonac Co., Ltd.

Yoshinori Ejiri is a chief researcher at the R and D center of Resonac in Japan. He received a B. S. and a M. S. from Tokyo University of Science. He joined Hitachi Chemical in 2000, where he did research and development on Electrolytic plating, Electroless plating and surface finishing... Read More →

Satoru Kuramochi

Fellow, Dai Nippon Printing Co. Ltd.,

Satoru Kuramochi received the B.E. degrees and M.E. degrees in image science engineering from Chiba University Japan, in 1987 and 1989, respectively.He joined Research and Development Center, Dai Nippon Printing Corporation, Japan in 1989. He specializes in the fine pattern processes... Read More →

Yiliang Wu

VP Technology, CollTech Materials Corporation

Dr. Yiliang Wu is the Vice President of Technology and Innovation at CollTech Materials Corporation that specialized in adhesives and thermal interface materials (TIM). His research interests are in advanced materials and their applications for electronics integration. Before joining... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
APT

Conference Session, APT Track

4:30pm CDT

RHE7: Lead-Free Solder Evolution

Wednesday October 28, 2026 4:30pm - 6:00pm CDT

RHE

Session Chair:
Session Co-Chair:

4:30pm-5:00pm
RoHS: Twenty Years Later
Presenter: Ronald Lasky, Ph.D., P.E., Indium Corporation

5:00pm-5:30pm
A Review on Impact of Isothermal Aging on Thermal Cycling Reliability of Ball Grid Array Packages Assembled Using SAC Lead-Free Solder Alloy
Presenter: Anto Raj, Ph.D., Medtronic
Co-Author: Richard Coyle, Ph.D., Nokia Bell Labs

5:30pm-6:00pm
Impact of Surface Finish on Voiding in Mixed Alloy Solder Paste Systems
Presenter: Thuy Nguyen, Indium Corporation
Co-Authors: Hongwen Zhang, Ph.D., Adam Murling, Ronald Lasky, Ph.D., P.E.,Indium Corporation

Speakers

Ronald Lasky

Senior Technologist, Indium Corporation

Anto Raj

Sr Reliability Engineer, Medtronic

Anto Raj received the B.Eng. degree in electronics and communications engineering from Anna University, Chennai, India, in 2011, and the M.I.S.E. and Ph.D. degrees in industrial and systems engineering from Auburn University, Auburn, AL, USA, in 2015 and 2019, respectively. From 2020... Read More →

Thuy Nguyen

Technical Support Engineer II, Indium Corporation

Thuy Nguyen is a Technical Support Engineer II at Indium Corporation, where she provides advanced soldering process support to customers across the Southwest and Rocky Mountains region. With over a decade of experience spanning Quality, Research and Development, and Manufacturing... Read More →

Wednesday October 28, 2026 4:30pm - 6:00pm CDT
RHE

Conference Session, RHE Track

11:00am CDT

11:00am CDT

11:30am CDT

2:00pm CDT

2:00pm CDT

2:00pm CDT

4:30pm CDT

4:30pm CDT

4:30pm CDT

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