SMTA International 2026: Full Schedule

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1:30pm CDT

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Reliability performance and challenges of Bi-Sn based Homogeneous Low Temperature Solder Joint
Presenter: Choongpyo Jeon, Samsung Electronics
Co-Authors: Soojin Yoo, Seungjin Oh, Keunho Rhew, Yuchul Hwang, Kichul Chun, Samsung Electronics

2:00pm-2:30pm
Electrical Resistivity and Microstructure of Sn-Bi Solder
Presenters: Frances Holcomb, Binghamton University
Co-Author: Silas Wieland, Eric Cotts, Ph.D., Binghamton University

2:30pm-3:00pm
Lead-Free Flux-less Soldering Below 120°C
Presenter: Martijn Mulder, Mat-Tech BV
Co-Authors: Arthur Miles, Mo Biglari, Alexandre Kodentsov, Mat-Tech BV

Speakers

Choongpyo Jeon

Reliability Engineer, Samsung Electronics

Choongpyo Jeon has been a reliability engineer at Samsung Electronics for more than 15 years. He has studied package reliability assessment and modelling. Over the course of his career, he published three papers as a 1st author, and he is currently the board-level reliability lead... Read More →

Frances Holcomb

Research Assistant, Binghamton University

Frances Holcomb is a student at Binghamton university in physics and mathematics. She conducts materials science research in Dr. Eric Cotts laboratory. She is investigating the factors which influence the resistivity of alloys such as tin bismuth, as well as models which describe... Read More →

Martijn Mulder

Process & Quality Engineering Lead, Mat-Tech BV

Martijn Mulder is at present affiliated at the Development & Testing department of Mat-Tech BV (TheNetherlands) in the role of Process & Quality Engineering Lead. His tasks consist of addressing quality issues andresearching new ways to join similar and dissimilar materials.His primary... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
LTS

Conference Session, LTS Track

3:30pm CDT

LTS2: Low-Temperature Soldering Advances

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

LTS

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and TCT Reliability
Presenter: Hongwen Zhang, Ph.D., Indium Corporation
Co-Authors: Danyang Zheng, Ph.D., Cassandra Goppert, Mengyao Wen, Yifan Wu Ph.D., Francis Mutuku Ph.D., Indium Corporation

4:00pm-4:30pm
Deformation and Damage Properties of Solder Joints Reflowed at Temperatures Between 80C and 140C
Presenter: Sai Reddy Munnangi, Ph.D., Binghamton University
Co-Authors: Anola Semndili, Ronit Das, Shantanu Joshi, Peter Borgesen, Binghamton University

Speakers

Hongwen Zhang

Principal Research Metallurgist & RnD Director, Indium Corporation

Dr. Hongwen Zhang is the Principal Research Metallurgist and Research & Development Director at Indium Corporation, with over eighteen years of experience in developing lead-free solder materials. He holds a Ph.D. in Materials Science and Engineering, along with master’s degrees... Read More →

Sai Reddy Munnangi

Student, Binghamton University

This is Sai Kiran, an Industrial and systems engineering PhD student from Binghamton University. My research is focused on Electronics Packaging, reliability testing of interconnects. My work includes identifying and characterizing Sn-Bi-In based alloys for low temperature applications... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
LTS