SMTA International 2026: Full Schedule

arrow_back View All Dates

8:30am CDT

INS1: AI Infiltrates Inspection: Latest from the Coalface

Tuesday October 27, 2026 8:30am - 10:00am CDT

Session Chair:
Session Co-Chair:

8:30am-9:00am
Counterfeit Detection as an AI-Based AOI Software Add-On
Presenter: Eyal Weiss, Ph.D., Cybord

9:00am-9:30am
AI-Native Automated Optical Inspection: Sub-10-Minute Programming for New Boards with Low False-Call Rates
Presenter: Collin Stoner, Selene Photonics

9:30am-10:00am AI Applications in Inspection: Enhancing SMT Manufacturing Inspection
Presenter: David Chiu, Test Research Inc.
Co-Author: Roberto Yebra, Test Research, Inc.

Speakers

Eyal Weiss

Founder & CTO, Cybord

Dr. Eyal Weiss is the Founder and Chief Technology Officer (CTO) of Cybord, a company specializing in AI-driven solutions for electronic manufacturing that protect against counterfeit and tampered components, providing full transparency and resilience across the supply chain. With... Read More →

Collin Stoner

Consulting Engineer, Selene Photonics Inc.

Collin Stoner is an electronics and product design consultant and the Owner and Principal Consulting Engineer of Selene Photonics Inc. (DBA NVZN Labs), where he leads a team that designs custom electronics and manufactures PCBAs for clients across aerospace, defense, and emerging-technology... Read More →

David Chiu

Sales Manager, Test Research, Inc (TRI)

David Chiu, Sales Manager, Test Research, Inc. (TRI) David Chiu is a seasoned professional in the electronics manufacturing and test industry, currently serving as a Sales Manager at Test Research, Inc. (TRI). With over 15 years of dedicated service at TRI, David has built a comprehensive... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
INS

Conference Session, INS Track

8:30am CDT

MFX3: Solder Paste Printing & Reliability 1

Tuesday October 27, 2026 8:30am - 10:00am CDT

MFX

Session Chair:
Session Co-Chair:

8:30am-9:00am
Are Gaps Bad for Printing?
Presenter: Hong Kim Lee, Indium Corporation
Co-Authors:

9:00am-9:30am
Reliability Evaluation of Low-Silver Solder Alloy Solder Paste
Presenter: Shantanu Joshi, Koki Solder America Inc.
Co-Authors: Yuki Yamamoto, Kimiaki Mori, Satoshi Otani, Noriyoshi Uchida, Jasbir Bath, Jerome McIntyre, Koki Solder America Inc

9:30am-10:00am
Solder Powder Size Types and Their Associated Print Capabilities in Ultra High Density Applications
Presenter: Chrys Shea, Shea Engineering Services
Co-Authors: Shantanu Joshi, Michael Butler, Koki Solder America

Speakers

Hong Kim Lee

Area Technical Manager, Indium Corporation of America

Lee Hong Kim is an Area Technical Manager at Indium Corporation with over 20 years of experience in the semiconductor and Surface Mount Technology (SMT) industries. He specializes in solder materials and assembly process engineering, with a focus on process optimization and defect... Read More →

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.

Shantanu Joshi is the Head of Customer Solutions and Operational Excellence at KOKI Solder America and an Engineering Sales Manager at Koki Company Ltd., a global leader in soldering materials and solutions. With more than 10 years of experience in electronics manufacturing, he has... Read More →

Chrys Shea

Founder, SHEA Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction,” an SMTA “Distinguished Speaker” and four-time... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
MFX

Conference Session, MFX Track

8:30am CDT

RHE1: Microstruture and Reliability

Tuesday October 27, 2026 8:30am - 10:00am CDT

RHE

Session Chair:
Session Co-Chair:

8:30am-9:00am
The Effect of Component Construction and Microstructure on the Thermal Cycling Performance of Reverse Hybrid Ball Grid Array Assemblies
Presenter: Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full co-author listing

9:00am-9:30am
Microstructure Evolution and Failure Mechanisms in High Performance Solder Alloys During Harsh Thermal Cycling
Presenter: Chris Gourlay, Ph.D., Imperial College London

9:30am-10:00am
A New Approach to the Design of Lead-Free Solder Alloys
Presenter: Keith Sweatman, P.E., Nihon Superior Co., Ltd
Co-Authors: Kazuhiro Nogita, University of Queensland, Australia; Tetsuro Nishimura, Nihon Superior Co., Ltd

Speakers

Richard Coyle

Consulting Member of the Technical Staff, Nokia Bell Labs

Richard Coyle is a Consulting Member of the Technical Staff in the Reliability Engineering organization at Nokia in Murray Hill, NJ. He is responsible for evaluating the reliability and quality of electronic assemblies in the Bell Labs Interconnection Failure Analysis Lab. Richard... Read More →

Chris Gourlay

Professor of Physical Metallurgy, Imperial College London

Chris is a Professor of Physical Metallurgy in the Department of Materials at Imperial College London. His group studies the origins of microstructure in phase transformations and microstructure stability. In recent years, research in the group has targeted understanding and controlling... Read More →

Keith Sweatman

Senior Technical Advisor, Nihon Superior Co., Ltd

Australia-based Keith Sweatman is a graduate in metallurgical engineering who, in technical and management roles with the International Tin Research Institute, Multicore Solders, and most recently Nihon Superior Co. Ltd, has accumulated 50 years’ experience in the electronics manufacturing... Read More →

Tuesday October 27, 2026 8:30am - 10:00am CDT
RHE

Conference Session, RHE Track

10:30am CDT

INS2: Cautionary Tales from Imaging Analysis

Tuesday October 27, 2026 10:30am - 12:00pm CDT

INS

Session Chair:
Session Co-Chair:

10:30am-11:00am
AOI Should Not Be Used as a Pass/Fail Gate: Applying SPC Principles to Inspection Data for Earlier Root Cause Identification in SMT
Presenter: Jeremy Orbach, Omron Automation USA

11:00am-11:30am
Computed Tomography (CT) vs. Computed Laminography CL for Non-Destructive Inspection of Printed Circuit Boards and Electronic Packages
Presenter: Vineeth Bastin, Comet Technologies USA Inc.
Co-Author: David Kruidhof, Comet Technologies USA Inc

11:30am-12:00pm
Failure Mechanism Investigation of NVMe Link Degradation from PCIe Gen4 to Gen3 Due to PCB Dielectric Collapse
Presenter: Zhipeng Wang, IBM Corporation

Speakers

Jeremy Orbach

Application Engineer II, Omron Automation Americas

Jeremy Orbach is an Applications Engineer and technical leader in electronics manufacturing focused on AOI, SPI, AXI, machine vision, and data-driven process improvement. At Omron Automation Americas, he supports customers in applying inspection systems not only to detect defects... Read More →

Vineeth Bastin

Senior Applications Engineer, Comet Technologies USA inc

Vineeth Bastin is a Senior Applications Engineer at Comet Yxlon, with over 15 years of experience in advanced electronics inspection systems. He has a strong track record in driving the adoption of X-ray, CT, and bond testing technologies, enhancing customer training programs, and... Read More →

Zhipeng Wang

Project Manager, IBM Corporation

Zhipeng (Grady) WangTitle:Project Manager, Global Supplier Test EngineeringOrganization:System Supply Chain, IBM CorporationBio:Grady is currently a Supply Chain Engineering Professional at IBM, where he specializes in test solution delivery for medium- to high-complexity server applications... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
INS

Conference Session, INS Track

10:30am CDT

MFX4: Cleaning & Coating

Tuesday October 27, 2026 10:30am - 12:00pm CDT

MFX

Session Chair:
Session Co-Chair:

10:30am-11:00am
Assessing SMT Component Compatibility and Reliability in Assembly and Cleaning Processes
Presenter: Chelsea Jewell, KYZEN Corporation
Co-Author: Nicholas Ostrom, Lockheed Martin

11:00am-11:30am
What is a Sufficient Rinse?
Presenter: Vladimir Sitko, PBT Works

11:30am-12:00pm
Process Characterization for Determining Acceptable Levels of Flux Residue
Presenter: Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Matt Imburgia, Magnalytix, LLC

Speakers

Chelsea Jewell

Application Lab Manager, KYZEN Corporation

Chelsea Jewell is the Application Lab Manager at KYZEN, supporting electronics and advanced manufacturing customers with precision cleaning processes. She works closely with customers to evaluate cleaning challenges, develop data-driven process recommendations, and support implementation... Read More →

Vladimir Sitko

Founder / CEO, PBT Works

Vladimir Sitko is the founder and mentor of PBT Works s.r.o., a recognized manufacturer of cleaning equipment for electronic assemblies. After completing his studies at the Technical University, he began his career nearly 50 years ago as a designer of measuring instruments for silicon... Read More →

Mike Bixenman

SME Cleaning and Reliability, Magnalytix, LLC

Dr. Mike Bixenman is a Subject Matter Expert in Cleaning and Reliability. He has over 35 years of experience in designing electronic assembly cleaning materials and integrating processes. Sharing his research, knowledge, and expertise is Mike’s passion. He believes in the power... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
MFX

Conference Session, MFX Track

10:30am CDT

RHE2: Alloying Effects on Performance

Tuesday October 27, 2026 10:30am - 12:00pm CDT

RHE

Session Chair:
Session Co-Chair:

10:30am-11:00am
Revisiting Silver-Content in Lead-Free Alloys: Reliability of Low-Cost Alternatives to SAC305 in Modern Electronics Assembly
Presenter: Anna Lifton, MacDermid Alpha Electronics Solutions
Co-Authors: Kennedy Fox, Suraj Saifullah, Ebad Rehman, MacDermid Alpha Electronics Solutions

11:00am-11:30am
Effect of Bismuth and Antimony Additions on the Shear Properties of ENIG-Finished SAC Individual Solder Joints
Presenter: Waad Tarman, Auburn University
Co-Authors: John Evans, Ph.D., Auburn University; Sa'd Hamasha, Ph.D., Binghamton University

11:30am-12:00pm
A Comparative Study of Mechanical Behavior of Next Generation Lead-Free Solder Alloys
Presenter: Pritha Choudhury, Ph.D., MacDermid Alpha Electronics Solutions India Pvt. Ltd.
Co-Authors: Anil Kumar, Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, MacDermid Alpha Electronics Solutions

Speakers

Anna Lifton

Director R&D Application -Circuit Board Assembly, MacDermid Alpha Electronics Solutions

Anna Lifton is R&D Director at Macdermid Alpha Assembly Solutions, overseeing Application, Reliability, and Failure Analysis for the Circuit Board Assemblies business unit. With a Bachelor's degree from Moscow Steel and Alloys Institute, Russia, and a Master's degree in Material Science... Read More →

Waad Tarman

Ph.D. Candidate, Auburn University

Waad Tarman is a Ph.D. candidate in Industrial and Systems Engineering at Auburn University. Her research focuses on the mechanical and microstructural reliability of lead-free solder joints in electronic assemblies, with an emphasis on solder alloy composition, thermal aging, surface... Read More →

Pritha Choudhury

Principal R&D Scientist, MacDermid Alpha Electronics Solutions India Pvt. Ltd.

Pritha Choudhury is a Principal R&D Scientist with MacDermid Alpha Electronics Solutions (MAES), Bangalore, India. She has a Ph.D. in Metallurgical and Materials Engineering from the Indian Institute of Technology, Kharagpur, India. She has been working for MAES since 2011. Her... Read More →

Tuesday October 27, 2026 10:30am - 12:00pm CDT
RHE

Conference Session, RHE Track

1:00pm CDT

RHE3: Conformal Coating and Reliability 1

Tuesday October 27, 2026 1:00pm - 3:00pm CDT

RHE

Session Chair:
Session Co-Chair:

1:00pm-1:30pm
Effect of Standoff Height, Pitch, and Component Type on Conformal Coating Ingress and Solder Joint Reliability in BGA and BTC Assemblies
Presenter: Suraj Saifullah, MacDermid Alpha Electronics Solutions
Co-Authors: Kennedy Fox, Anna Lifton, MacDermid Alpha Electronics Solutions

1:30pm-2:00pm
Conformal Coating Reliability for Harsh Environments
Presenter: Jayse McLean, John Deere Intelligent Solutions Group

2:00pm-2:30pm
Active Condensation Exposure and the Reliability of Solvent-Free Conformal Coatings
Presenter: Andrea Charif, Ph.D., Henkel Corporation
Co-Authors: Rita Mohanty, Alejandro Sanchez, Henkel Corporation

2:30pm-3:00pm
The Impact of Conformal Coating on the Reliability of Solder Interconnects
Presenter: Michael Osterman, Ph.D., CALCE/University of Maryland

Speakers

Jayse McLean

Senior Engineer, John Deere Intelligent Solutions Group

Jayse is a senior engineer in the advanced engineering group as a part of the overall John Deere Intelligent Solutions Group. He has a Bachelor of Science and Master of Science in Mechanical Engineering from North Dakota State University. He has worked at Deere for 7 years and during... Read More →

Suraj Saifullah

Application Engineer, MacDermid Alpha Electronics Solutions

Suraj Saifullah has worked at MacDermid Alpha Electronics Solutions for two years as an application engineer. He holds a master’s degree in chemical engineering from Columbia University and a bachelor’s in chemistry from Case Western Reserve University. His research focuses on... Read More →

Andrea Charif

Lead Application Engineer, Henkel Corporation

Andrea Charif, Ph.D., is a polymer scientist with over 10 years of experience delivering high-performance solutions in application development for materials across the automotive and electronics industries. Her expertise centers on material selection, testing, and implementation to... Read More →

Michael Osterman

Research Scientist, CALCE/University of Maryland

Michael Osterman is a Research Scientist and the Operations Director for the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland. In addition, he leads the development of the calceSARA software for printed-board assembly-level reliability assessment... Read More →

Tuesday October 27, 2026 1:00pm - 3:00pm CDT
RHE

Conference Session, RHE Track

1:30pm CDT

INS3: Eat Your Vegetables, Part I: Test Methods You Need to Know

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

INS

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Process Qualification to J-STD-001 Section 8 Cleanliness
Presenter: Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Zach Papiez, Magnalytix, LLC

2:30pm-3:00pm
Mitigation Strategies for Failures Resulting from Ionizing Radiation
Presenter: David Kruidhof, Comet Technologies USA, Inc.
Co-Author: Vineeth Bastin, Comet Technologies USA, Inc.

3:00pm-3:30pm
Mitigation Strategies for Failures Resulting from Ionizing Radiation
Presenter: Matt Turpin, Datest Corporation

Speakers

Mike Bixenman

SME Cleaning and Reliability, Magnalytix, LLC

David Kruidhof

Technical Sales Manager, Comet Technologies USA, Inc.

David Kruidhof is the Technical Sales Manager for Comet Yxlon, who provide X-ray, laminography, and CT inspection systems for R&D labs and production environments, especially for semiconductor manufacturers and PCB assemblers. In his role at Comet Yxlon, David is responsible for technical... Read More →

Matt Turpin

Sr. Test Engineer, Datest Corporation

Matt Turpin is Sr. Test Engineer at Datest, responsible for ICT program and fixture development, and pre-development mechanical and electrical DFT analysis. Matt has over 45 years’ experience in testing and test engineering, primarily with Zehntel, Teradyne, and HP/Agilent/Keysight... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
INS

Conference Session, INS Track

1:30pm CDT

LTS1: Low-Temperature Solder Materials

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

LTS

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Reliability performance and challenges of Bi-Sn based Homogeneous Low Temperature Solder Joint
Presenter: Choongpyo Jeon, Samsung Electronics
Co-Authors: Soojin Yoo, Seungjin Oh, Keunho Rhew, Yuchul Hwang, Kichul Chun, Samsung Electronics

2:00pm-2:30pm
Electrical Resistivity and Microstructure of Sn-Bi Solder
Presenters: Frances Holcomb, Binghamton University
Co-Author: Silas Wieland, Eric Cotts, Ph.D., Binghamton University

2:30pm-3:00pm
Lead-Free Flux-less Soldering Below 120°C
Presenter: Martijn Mulder, Mat-Tech BV
Co-Authors: Arthur Miles, Mo Biglari, Alexandre Kodentsov, Mat-Tech BV

Speakers

Choongpyo Jeon

Reliability Engineer, Samsung Electronics

Choongpyo Jeon has been a reliability engineer at Samsung Electronics for more than 15 years. He has studied package reliability assessment and modelling. Over the course of his career, he published three papers as a 1st author, and he is currently the board-level reliability lead... Read More →

Frances Holcomb

Research Assistant, Binghamton University

Frances Holcomb is a student at Binghamton university in physics and mathematics. She conducts materials science research in Dr. Eric Cotts laboratory. She is investigating the factors which influence the resistivity of alloys such as tin bismuth, as well as models which describe... Read More →

Martijn Mulder

Process & Quality Engineering Lead, Mat-Tech BV

Martijn Mulder is at present affiliated at the Development & Testing department of Mat-Tech BV (TheNetherlands) in the role of Process & Quality Engineering Lead. His tasks consist of addressing quality issues andresearching new ways to join similar and dissimilar materials.His primary... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
LTS

Conference Session, LTS Track

1:30pm CDT

MFX5: OPS Excellence & Box Level Assembly

Tuesday October 27, 2026 1:30pm - 3:00pm CDT

MFX

Session Chair:
Session Co-Chair:

1:30pm-2:00pm
Factors in Maximizing the Return on an Investment in Automation
Presenter: Troy Gueller, Rockwell Automation

2:00pm-2:30pm
Enhanced Design Rules and Optimization for Laser Depaneling
Presenter: Jake Benz, LPKF Laser & Electronics SE
Co-Author: Patrick Stockbruegger, M.Sc., LPKF Laser & Electronics SE

2:30pm-3:00pm
The Science of Bonding
Presenter: Dave Dworak, Dymax Corporation

Speakers

Troy Gueller

Senior Project Engineer, Rockwell Automation

Troy Gueller is a Senior Project Engineer at Rockwell Automation, where he leads Automation initiatives across the company’s global footprint. With a career of over 30+ years, Troy brings a unique blend of hands-on technical expertise and overall process vision. He has a strong... Read More →

Jake Benz

Sales Manager, LPKF Laser & Electronics SE

Jake Benz is the Production Laser Systems Sales Manager at LPKF Laser and Electronics, where he leads sales efforts for LPKF’s Laser Induced Deep Etching (LIDE) technology, PCB Laser Depaneling, and SMT Stencil Laser equipment in North America. Based in Portland, OR, Jake plays... Read More →

Dave Dworak

Material Scientist, Dymax Corporation

Dave has over 20 years of adhesive chemistry and formulation experience. He has worked as a polymer chemistspecializing in polyurethane synthesis and formulations as well as living radical polymerization of novel polyacrylates.Dave received his chemistry degree from the University... Read More →

Tuesday October 27, 2026 1:30pm - 3:00pm CDT
MFX

Conference Session, MFX Track

3:30pm CDT

LTS2: Low-Temperature Soldering Advances

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

LTS

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and TCT Reliability
Presenter: Hongwen Zhang, Ph.D., Indium Corporation
Co-Authors: Danyang Zheng, Ph.D., Cassandra Goppert, Mengyao Wen, Yifan Wu Ph.D., Francis Mutuku Ph.D., Indium Corporation

4:00pm-4:30pm
Deformation and Damage Properties of Solder Joints Reflowed at Temperatures Between 80C and 140C
Presenter: Sai Reddy Munnangi, Ph.D., Binghamton University
Co-Authors: Anola Semndili, Ronit Das, Shantanu Joshi, Peter Borgesen, Binghamton University

Speakers

Hongwen Zhang

Principal Research Metallurgist & RnD Director, Indium Corporation

Dr. Hongwen Zhang is the Principal Research Metallurgist and Research & Development Director at Indium Corporation, with over eighteen years of experience in developing lead-free solder materials. He holds a Ph.D. in Materials Science and Engineering, along with master’s degrees... Read More →

Sai Reddy Munnangi

Student, Binghamton University

This is Sai Kiran, an Industrial and systems engineering PhD student from Binghamton University. My research is focused on Electronics Packaging, reliability testing of interconnects. My work includes identifying and characterizing Sn-Bi-In based alloys for low temperature applications... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
LTS

Conference Session, LTS Track

3:30pm CDT

MFX6: Solder Paste Printing 2

Tuesday October 27, 2026 3:30pm - 4:30pm CDT

MFX

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
The Effect of Viscosity on Solder Paste Performance
Presenter: Gayle Towell, AIM Solder

4:00pm-4:30pm
A Mixed Powder Strategy to Improve Printing and Eliminate Nitrogen in Reflow
Presenter: Mathilde Buret, Inventec Performance Chemicals
Co-Authors: Yvan Bouyou, Mélanie Mathon, Emmanuelle Guene, Inventec Performance Chemicals

Speakers

Gayle Towell

Technical Marketing Lead, AIM Solder

As Technical Marketing Lead for AIM Solder, Gayle Towell serves as a critical bridge between the company’s technical, commercial, and industry engagement functions. She combines deep technical expertise with strategic communication and public-facing research initiatives to align... Read More →

Mathilde BURET

R&D Soldering Engineer, Inventec Performance Chemicals

Mathilde has a master's degree in Chemistry within a chemical engineering school in France, specialized in Formulation Chemistry. She's been part of Inventec Performance Chemicals since 2018. She's working as an R&D soldering engineer with expertise in soldering fluxes and pastes... Read More →

Tuesday October 27, 2026 3:30pm - 4:30pm CDT
MFX

Conference Session, MFX Track

3:30pm CDT

INS4: Eat Your Vegetables, Part II: Test Methods You Need to Know

Tuesday October 27, 2026 3:30pm - 5:00pm CDT

INS

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
FCT for RF/High Speed Applications with Test Probes. Strategies, Pitfalls and How to Avoid Those
Presenter: Matthias Zapatka, Ingun USA

4:00pm-4:30pm
A Three-Camera based Digital Image Correlation System for Warpage Measurement and CTE Distribution Analysis
Presenters: Liam Crosbie, Dantec Dynamics
Co-Author: LiKang Luan, Dantec Dynamics

4:30pm-5:00pm
Need for speed: Boosting X-Ray Inspection Speed in Advanced Electronics
Presenter: Chris Nicholson, Ph.D., Comet X-Ray
Co-Author: Anthony Williams, Comet X-Ray

Speakers

Matthias Zapatka

Senior FAE, INGUN USA, Inc.

Matthias is the co-founder and Sr. FAE at INGUN USA, Inc. the North American subsidiary of the INGUN group. He has been in the PCBA test industry for over 18 years. Matthias is a frequent speaker at industry related events. Matthias' academic background is RF&Wireless technologies... Read More →

Liam Crosbie

R&D Manager, Dantec Dynamics

Liam Crosbie works as the Research, Development & Product Manager for the Solids Division at Dantec Dynamics in Ulm, Germany. He has over 15 years worth of professional work experience in the materials testing industry, focusing on the application, product & streategic development... Read More →

Chris Nicholson

Product Manager, Comet X-ray

Originally from Scotland, Chris Nicholson completed his PhD in 2018 at the Max Planck Institute in Berlin focusing on laser-induced phase transitions at metal-semiconductor interfaces. Following postdoctoral research he transitioned to industry as an application scientist for electron... Read More →

Tuesday October 27, 2026 3:30pm - 5:00pm CDT
INS

Conference Session, INS Track

3:30pm CDT

RHE4: Conformal Coating and Reliability 2

Tuesday October 27, 2026 3:30pm - 5:00pm CDT

RHE

Session Chair:
Session Co-Chair:

3:30pm-4:00pm
How to Know If Your Conformal Coating Process is Good or Not
Presenter: Jason Keeping, P.E., Celestica

4:00pm-4:30pm
Defects in Conformal Coating
Presenter: Doug Pauls, ItDepends Electronics LLC
Co-Author: Deb Vorwald, Collins Aerospace

4:30pm-5:00pm
BGA Solder Joint Solder Joint Reliability Degradation From Incorrect Conformal Coating Processes
Presenter: David Hillman, Hillman EAS LLC
Co-Author: Ross Wilcoxon, Collins Aerospace

Speakers

Jason Keeping

Staff Engineer, Celestica Inc.

Jason Keeping is the Global Process Subject Matter Expert for Ruggedized Electronics at Celestica. He holds a B.A.Sc. in Electrical Engineering, is a Six Sigma/Lean Professional, and a licensed professional engineer. With more than 15 years of experience, Jason specializes in conformal... Read More →

Doug Pauls

Sr. Technical Fellow, ItDepends Electronics LLC

Doug is a Material Scientist with degrees in Chemistry, Physics and Electrical Engineering.He worked 9 years for the Navy, 8 years as Technical Director of Contamination Studies Labs, and 24 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering... Read More →

David Hillman

Founder / CEO, Hillman EAS LLC

David D. Hillman was a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins/Collins Aerospace in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his... Read More →

Tuesday October 27, 2026 3:30pm - 5:00pm CDT
RHE

Conference Session, RHE Track

5:00pm CDT

RHE Town Hall: The Impact of Conformal Coating on Reliability

Tuesday October 27, 2026 5:00pm - 6:00pm CDT

RHE

Join SMTA for a Town Hall open to all attendees, featuring an engaging and interactive discussion on conformal coating and its impact on solder joint reliability.

The Town Hall will immediately follow the Reliability, Harsh Environment (RHE) technical session on conformal coating, which provides important background and context for the discussion.

This attendee-driven forum welcomes a wide range of perspectives, experiences, and opinions. Audience questions and comments will shape the discussion, creating a dynamic exchange of ideas on one of the industry's most relevant and debated topics.

Please submit questions in advance to: [email protected]

Speakers

Richard Coyle

Consulting Member of the Technical Staff, Nokia Bell Labs

David Hillman

Founder / CEO, Hillman EAS LLC

Tuesday October 27, 2026 5:00pm - 6:00pm CDT
RHE

Conference Session, RHE Track

8:30am CDT

8:30am CDT

8:30am CDT

10:30am CDT

10:30am CDT

10:30am CDT

1:00pm CDT

1:30pm CDT

1:30pm CDT

1:30pm CDT

3:30pm CDT

3:30pm CDT

3:30pm CDT

3:30pm CDT

5:00pm CDT

Get help with the event