SMTA International 2026: Full Schedule

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1:00pm CDT

AME1: Additive Processes for Circuit Manufacture

Monday October 26, 2026 1:00pm - 2:30pm CDT

Session Chair:
Session Co-Chair:

1:00pm-1:30pm
Next Generation Direct Metallization Processes are Adaptable to the Evolving Printed Circuit Board Material Landscape
Presenter: Lindsey Mercurio, MacDermid Alpha Electronics Solutions

1:30pm-2:00pm
High Resolution Copper Printed RF Devices
Presenter: Tom Rovere, Lockheed Martin
Co-Authors: Maya Chiesa, Emuobosan Enakerakpo, Eric Whiting, Lockheed Martin

2:00pm-2:30pm
Roll-to-Roll Additive Manufacturing of Copper Micro-Wires for SMT Circuit
Presenter: Carolyn Ellinger, Eastman Kodak Company

Speakers

Lindsey Mercurio

Primary Metallization Applications Specialist, MacDermid Alpha Electronics Solutions

Lindsey Mercurio is an Applications Specialist with MacDermid Alpha Electronics Solutions. In her role, Lindsey conducts the final stages of new product development including process parameter verification, customer site beta testing, and transition to full commercialization. She... Read More →

Tom Rovere

LM Fellow, Lockheed Martin

Tom Rovere is a Research Scientist for Lockheed Martin Rotary and Mission Systems division in Owego, NY. In this capacity, he is responsible for research and development related to flexible hybrid electronics (FHE), printed electronics, antenna manufacturing, circuit card assembly... Read More →

Carolyn Ellinger

VP, Printed Electronics, Eastman Kodak Company

Carolyn Ellinger is Vice President of Printed Electronics at Eastman Kodak Company. During her more than 30 years at Kodak, she has held a variety of technical and leadership roles spanning film systems, flexible displays, nanotechnology, semiconductor devices, MEMS-based devices... Read More →

Monday October 26, 2026 1:00pm - 2:30pm CDT
AME

Conference Session, AME Track

3:00pm CDT

AME2: Embedded and Conformal Electronics

Monday October 26, 2026 3:00pm - 4:30pm CDT

AME

Session Chair:
Session Co-Chair:

3:00pm-3:00pm
Thermal and Moisture Reliability of In-Mold Gravure Offset Additive Circuits for Automotive Applications
Presenter: Pradeep Lall, Ph.D., Auburn University
Co-Authors: Padma Choudhury, Auburn University; Scott Miller, NextFlex National Manufacturing Institute

3:30pm-4:00pm
Embedding Electronics into High-Volume CBAM Additive Process
Presenters: Nate Bode, Impossible Objects & Denis Cormier, Impossible Objects

4:00pm-4:30pm
Challenges of Low Temperature Component Attach
Presenter: Kalsi Kwan, Boeing Engineering & Technology Innovation
Co-Authors: Authors: John D. Williams, Timothy Messer, Kyle Barber, Adriana Jara, Ted Dabrowski, Boeing Engineering & Technology Innovation

Speakers

Pradeep Lall, Ph.D.

Professor, Auburn University

Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of Auburn University’s Electronics Packaging Research Institute. He holds Joint Courtesy Appointments in the Department of Electrical and... Read More →

Nate Bode

Director of Strategy and Growth, Impossible Objects

Dr. Nate Bode is the Director of Strategy and Growth at Impossible Objects, a high-speed additive manufacturing company. This role encompasses supporting core company initiatives including leading government grant work, new market entry, and fundraising. Dr. Bode brings to this... Read More →

Kalsi Kwan

Boeing Engineering & Technology Innovation

Kalsi Kwan is a principal investigator with the Additive Electronics Technology group within Engineering & Technology Innovation (E&TI) in Huntsville, AL. Kalsi specializes in novel process development for Flexible Hybrid Electronics for next-generation products. She has been with... Read More →

Monday October 26, 2026 3:00pm - 4:30pm CDT
AME