SMTA International 2026: Full Schedule

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1:00pm CDT

AME1: Additive Processes for Circuit Manufacture

Monday October 26, 2026 1:00pm - 2:30pm CDT

Session Chair:
Session Co-Chair:

1:00pm-1:30pm
Next Generation Direct Metallization Processes are Adaptable to the Evolving Printed Circuit Board Material Landscape
Presenter: Lindsey Mercurio, MacDermid Alpha Electronics Solutions

1:30pm-2:00pm
High Resolution Copper Printed RF Devices
Presenter: Tom Rovere, Lockheed Martin
Co-Authors: Maya Chiesa, Emuobosan Enakerakpo, Eric Whiting, Lockheed Martin

2:00pm-2:30pm
Roll-to-Roll Additive Manufacturing of Copper Micro-Wires for SMT Circuit
Presenter: Carolyn Ellinger, Eastman Kodak Company

Speakers

Lindsey Mercurio

Primary Metallization Applications Specialist, MacDermid Alpha Electronics Solutions

Lindsey Mercurio is an Applications Specialist with MacDermid Alpha Electronics Solutions. In her role, Lindsey conducts the final stages of new product development including process parameter verification, customer site beta testing, and transition to full commercialization. She... Read More →

Tom Rovere

LM Fellow, Lockheed Martin

Tom Rovere is a Research Scientist for Lockheed Martin Rotary and Mission Systems division in Owego, NY. In this capacity, he is responsible for research and development related to flexible hybrid electronics (FHE), printed electronics, antenna manufacturing, circuit card assembly... Read More →

Carolyn Ellinger

VP, Printed Electronics, Eastman Kodak Company

Carolyn Ellinger is Vice President of Printed Electronics at Eastman Kodak Company. During her more than 30 years at Kodak, she has held a variety of technical and leadership roles spanning film systems, flexible displays, nanotechnology, semiconductor devices, MEMS-based devices... Read More →

Monday October 26, 2026 1:00pm - 2:30pm CDT
AME

Conference Session, AME Track

1:00pm CDT

MFX1: Reflow Technology

Monday October 26, 2026 1:00pm - 2:30pm CDT

MFX

Session Chair:
Session Co-Chair:

1:00pm-2:30pm
Impact of Fixture Material on Thermal Stability and Process Performance in Reflow Soldering
Presenter: Ricardo Chuma, 2B Automacao

2:30pm-3:00pm
Impact of Operation Environment and Flux Residues on the Electrochemical Reliability of In Bi SAC Solder Paste
Presenter: Sirine Bayram, Ph.D., AIM Solder

3:00pm-3:30pm
Junction Formation Through Photonic Soldering under Ambient and Flux-less Conditions
Presenter: Vahid Akhavan, Ph.D., PulseForge
Co-Authors: Nick Snyder, Ara Parsekian, PulseForge

Speakers

Vahid Akhavan

Director of Transitional Technologies, PulseForge

Dr. Vahid Akhavan is the Director of Transitional Technologies at PulseForge. Enabling the next generation of electronic devices by drawing on his expertise in colloidal synthesis, additive manufacturing and kinetic thermal processing. He has over 20 peer-reviewed publications, several... Read More →

Sirine Bayram

Senior Research Scientist, AIM Solder

Sirine Bayram is a Senior Research Scientist at AIM Solder specializing in solder paste product development and innovation. She holds a Master's degree in Chemistry from the American University of Beirut and a Ph.D. in Chemistry from McGill University. Dr. Bayram has published in... Read More →

Ricardo Chuma

Co-Owner and Engineering Director, 2B AUTOMACAO E USINAGEM

Ricardo Chuma is Co-Owner and Engineering Director at 2B Automacao e Usinagem, a Brazilian company specializing in tooling and fixtures for the electronics manufacturing industry. He leads engineering initiatives focused on SMT and PTH process optimization, including the development... Read More →

Monday October 26, 2026 1:00pm - 2:30pm CDT
MFX

Conference Session, MFX Track

3:00pm CDT

AME2: Embedded and Conformal Electronics

Monday October 26, 2026 3:00pm - 4:30pm CDT

AME

Session Chair:
Session Co-Chair:

3:00pm-3:00pm
Thermal and Moisture Reliability of In-Mold Gravure Offset Additive Circuits for Automotive Applications
Presenter: Pradeep Lall, Ph.D., Auburn University
Co-Authors: Padma Choudhury, Auburn University; Scott Miller, NextFlex National Manufacturing Institute

3:30pm-4:00pm
Embedding Electronics into High-Volume CBAM Additive Process
Presenters: Nate Bode, Impossible Objects & Denis Cormier, Impossible Objects

4:00pm-4:30pm
Challenges of Low Temperature Component Attach
Presenter: Kalsi Kwan, Boeing Engineering & Technology Innovation
Co-Authors: Authors: John D. Williams, Timothy Messer, Kyle Barber, Adriana Jara, Ted Dabrowski, Boeing Engineering & Technology Innovation

Speakers

Pradeep Lall, Ph.D.

Professor, Auburn University

Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of Auburn University’s Electronics Packaging Research Institute. He holds Joint Courtesy Appointments in the Department of Electrical and... Read More →

Nate Bode

Director of Strategy and Growth, Impossible Objects

Dr. Nate Bode is the Director of Strategy and Growth at Impossible Objects, a high-speed additive manufacturing company. This role encompasses supporting core company initiatives including leading government grant work, new market entry, and fundraising. Dr. Bode brings to this... Read More →

Kalsi Kwan

Boeing Engineering & Technology Innovation

Kalsi Kwan is a principal investigator with the Additive Electronics Technology group within Engineering & Technology Innovation (E&TI) in Huntsville, AL. Kalsi specializes in novel process development for Flexible Hybrid Electronics for next-generation products. She has been with... Read More →

Monday October 26, 2026 3:00pm - 4:30pm CDT
AME

Conference Session, AME Track

3:00pm CDT

MFX2: AI & Smart Factory Evolution

Monday October 26, 2026 3:00pm - 5:00pm CDT

MFX

Session Chair:
Session Co-Chair:

3:00pm-3:30pm
Industrial AI in Electronics Manufacturing: A Comprehensive Review of State-of-the-Art Applications, Challenges, and Future Directions
Presenter: Sai Kolli, Foxconn Industrial Internet (FII)

3:30pm-4:00pm
Solving SMT Component Attrition at Scale Using LLM-Based Agentic Analysis
Presenter: Cameron Sobie, Ph.D., Arch Systems
Co-Authors: Andrew Scheuermann, Tim Burke, Arch Systems

4:00pm-4:30pm
Smart Factory Evolution 1.0 -4.0
Presenter: Chris Dayney, Fuji America
Co-Authors:

4:30pm-5:00pm
Human vs. AI-Collaborative PCB Design: Comparative Analysis of Routing Efficiency and Manufacturing Performance
Presenter: Athula Kulatunga, Purdue University Northwest
Co-Author: Jagadish Kirla, Purdue University Northwest

Speakers

Sai Kolli

Project Manager, Foxconn Industrial Internet (FII)

Sai Srikanth is a Project Manager at Foxconn Industrial Internet (FII) and a PhD candidate in Industrial and Systems Engineering at Binghamton University – State University of New York. His research focuses on manufacturing systems, advanced optimization approaches, Artificial Intelligence... Read More →

Cameron Sobie

Director of AI Strategy, Arch Systems, Arch Systems

Cameron Sobie is the Director of AI Strategy at Arch Systems, where he focuses on identifying where emerging AI capabilities can unlock value in manufacturing and leads the transformation of those ideas into deployed solutions. His work drives bottom line results by helping manufacturers... Read More →

Chris Dayney

Technical Marketing Manager, Fuji America Corporation

Technical Marketing Manager for Fuji America Corporation, headquartered in Vernon Hills, IL. Based in Crossville, TN, Chris brings 30 years of expertise in the SMT industry to his role. He spent 3 years as Regional Sales Manager and 25 years as an Instructor and Training Team Leader... Read More →

Athula Kulatunga

Professor of Electrical Engineering Technology, Purdue University Northwest

Prof. Dr. N. Athula Kulatunga is an Electrical Engineering Technology (EET) professor at Purdue University Northwest (PNW) and served as department head from 2015 to 2022. Previously, he taught and conducted research for 15 years at Purdue University in West Lafayette, where he was... Read More →

Monday October 26, 2026 3:00pm - 5:00pm CDT
MFX

Conference Session, MFX Track

1:00pm CDT

1:00pm CDT

3:00pm CDT

3:00pm CDT

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