SMTA International 2026

SMTA International 2026

1:00pm CDT

AME1: Additive Processes for Circuit Manufacture AMELindsey Mercurio • Tom Rovere • Carolyn Ellinger MFX1: Reflow Technology MFXVahid Akhavan • Sirine Bayram • Ricardo Chuma

3:00pm CDT

AME2: Embedded and Conformal Electronics AMEPradeep Lall, Ph.D. • Nate Bode • Kalsi Kwan MFX2: AI & Smart Factory Evolution MFXSai Kolli • Cameron Sobie • Chris Dayney • Athula Kulatunga

8:30am CDT

INS1: AI Infiltrates Inspection: Latest from the Coalface INSEyal Weiss • Collin Stoner • David Chiu MFX3: Solder Paste Printing & Reliability 1 MFXHong Kim Lee • Shantanu Joshi • Chrys Shea RHE1: Microstruture and Reliability RHERichard Coyle • Chris Gourlay • Keith Sweatman

10:30am CDT

INS2: Cautionary Tales from Imaging Analysis INSJeremy Orbach • Vineeth Bastin • Zhipeng Wang MFX4: Cleaning & Coating MFXChelsea Jewell • Vladimir Sitko • Mike Bixenman RHE2: Alloying Effects on Performance RHEAnna Lifton • Waad Tarman • Pritha Choudhury

1:00pm CDT

RHE3: Conformal Coating and Reliability 1 RHEJayse McLean • Suraj Saifullah • Andrea Charif • Michael Osterman

1:30pm CDT

INS3: Eat Your Vegetables, Part I: Test Methods You Need to Know INSMike Bixenman • David Kruidhof • Matt Turpin LTS1: Low-Temperature Solder Materials LTSChoongpyo Jeon • Frances Holcomb • Martijn Mulder MFX5: OPS Excellence & Box Level Assembly MFXTroy Gueller • Jake Benz • Dave Dworak

3:30pm CDT

LTS2: Low-Temperature Soldering Advances LTSHongwen Zhang • Sai Reddy Munnangi MFX6: Solder Paste Printing 2 MFXGayle Towell • Mathilde BURET INS4: Eat Your Vegetables, Part II: Test Methods You Need to Know INSMatthias Zapatka • Liam Crosbie • Chris Nicholson RHE4: Conformal Coating and Reliability 2 RHEJason Keeping • Doug Pauls • David Hillman

5:00pm CDT

RHE Town Hall: The Impact of Conformal Coating on Reliability RHERichard Coyle • David Hillman

11:00am CDT

APT1: Advanced Interconnect Materials and Reliability APTALBERT TZU-CHIA WU • Ronald Lasky • Gilad Nave RHE5: Mechanical Testing and Interconnect Reliability RHEJayse McLean • Jacob Weber • Daphne Gates • George Winstead

11:30am CDT

MFX7: Conformal Coating MFXViktoria Rawinski • Mike Konrad

2:00pm CDT

APT2: Advanced Packaging and Reliability APTMumtaz Bora • Charles Woychik • Robert Darveaux • Martin Hart MFX8: OPS Excellence MFXMark Dydyk • Albert Block • Ram Wissel • Shantanu Joshi RHE6: Predictive Modeling RHEArvind Purushotaman • Jean-Baptiste Libot • Tyler Ferris • Josh Akman

4:30pm CDT

MFX9: AI-Driven Optimization & Resilience MFXMichael Sivigny • Ed Dodd APT3: Substrates APTYoshinori Eijiri • Satoru Kuramochi • Yiliang Wu RHE7: Lead-Free Solder Evolution RHERonald Lasky • Anto Raj • Thuy Nguyen

8:30am CDT

MFX10: Unique Processes for Assembly 1 MFXJoseph Clure • Christine Taylor • Tony Sass • Gayle Towell • Brian Watson

9:00am CDT

RHE8: Harsh Use Conditions RHENithin Lakshminarayan • Gilad Nave • Rakesh Kumar

11:00am CDT

RHE9: Factors Affected Thermal Cycling Performance RHEWilliam Fox • Anola Semndili MFX11: Unique Processes for Assembly 2 MFXTony Lentz • Greg Smith • Wayne Zhang • Mei Ming Khaw