About me
YoungDo Kweon joined Amkor Technology in 2015 and currently serves as Senior Director of
Development Program Management, focusing on advanced chiplet-based flip chip packaging
technologies for AI and high-performance computing applications. Since 1988, he has built extensive
experience across a broad range of semiconductor packaging platforms, including memory TSOP, BGA,
WLP, RF SiP, AP fcCSP, CPU/GPU fcBGA, and PCB-based PLP. Prior to joining Amkor, YoungDo held
positions at Samsung Electronics Semiconductor Division, Micron Technology Assembly R&D, and
Samsung Electro-Mechanics Central Research Institute. In 2023, he received Amkor’s Einstein Top
Invention Award for a chiplet-based FCBGA structure. He has also published multiple patents and
technical papers. YoungDo holds a B.S. in Metallurgical Engineering from Hanyang University, an
M.S.E.E. from Samsung Semiconductor Institute of Technology, and an M.S.M.E. from the University of
Maryland at College Park.
