About me
William Fox is a materials engineer specializing in failure analysis and laboratory operations. He earned a B.S. in Materials Science & Engineering from Purdue University and an M.S. in Materials Engineering from the University of Dayton. He has published papers in Journal of Nanomaterials on carbon‑nanofiber‑reinforced polymer nanocomposites and presented multiple conference papers on conformal coatings, tin‑whisker mitigation, and lead‑free soldering. At Lockheed Martin, William oversees rapid‑turn failure‑analysis projects, leads troubleshooting of component and test failures, and directs materials‑shelf‑life and construction‑analysis testing for electronic assemblies. His work routinely improves materials and processes used in circuit‑card assembly and printed‑wiring‑board manufacturing. William actively contributes to several industry standards‑development committees.
