About me
Takamasa Takano received the M.E. degree in Electrical and electronic engineering from Hosei University, in 1999.He joined Dai Nippon Printing Corporation in 1999 and has been working on the development of
next-generation semiconductor packages for approximately 25 years, including organic substrates (FC-BGA), MEMS packages, silicon interposers (TSV), glass interposers (TGV), and RDL interposers. He currently serves as principal researcher for the Fine Packaging Division, focusing on the development of next-generation semiconductor packages using glass panels. Using RDL interposer technology and glass core technology as a foundation, he is achieving finer designs, higher frequencies, greater reliability, and larger panel sizes.
