About me
This is Sai Kiran, an Industrial and systems engineering PhD student from Binghamton University. My research is focused on Electronics Packaging, reliability testing of interconnects. My work includes identifying and characterizing Sn-Bi-In based alloys for low temperature applications focused on fatigue resistance, and high-Sn alloys for high-reliability applications. Reliability of sintered nano-Cu and nanoporous Cu joints along with the effects of design and process parameters on the deformation and damage properties of the solders. Also worked on identifying the interactions between isothermal and thermal cycling on electromigration. I had a bachelor’s degree in mechanical engineering from JNTUK, India (2011-2015) and I did my master’s from Binghamton university before starting PhD. I’m a graduate research assistant in the school of system science and industrial engineering at BU from 2024. I worked as a mechanical design engineer for 5 years - at Sri chakra polyplast (India) from April 2019 to July 2022 and at Nani electro pvt. Ltd. (India) from February 2017 to January 2019.
