About me
Richard Coyle is a Consulting Member of the Technical Staff in the Reliability Engineering organization at Nokia in Murray Hill, NJ. He is responsible for evaluating the reliability and quality of electronic assemblies in the Bell Labs Interconnection Failure Analysis Lab. Richard earned his Ph.D. in Metallurgical Engineering and Materials Science from the University of Notre Dame. He is a member of several professional organizations, including TMS, ASM International, the IEEE Electronics Packaging Society, IMAPS, SMTA, and AWS. Richard serves as Co-Conference Director of SMTA International and previously served on the SMTA Board of Directors as Vice President of Technical Programs. He is also a member of the Board of Directors of iNEMI and an iNEMI Fellow.
