About me
Mumtaz Y. Bora is a Principal packaging Engineer supporting development and outsource assembly of RF -IC packages at pSemi. She directs qualification of fcLGAs, WLCSPs and wire-bonded packages and supportsboard level reliability testing of RF packages. She has worked in advanced PCB manufacturing at IBM andcell-phone assembly and test at Qualcomm and Kyocera-Wireless. She has supported supplier qualificationfor Hi-Rel/Space, automotive, power products and mobile wireless packages. She has worked extensivelywith overseas suppliers in yield improvement, process optimization and defect prevention.She has contributed to the Standards development at IPC in plating and embedded substrates. She is the PastPresident of the SMTA San Diego chapter and IMAPS San Diego chapter. She is Co-chair of the SMTAMoisture Sensitive Devices Council. She has a B.S in Material Science and M.S. in InteractiveTelecommunications. She is currently on the Board of Directors for SMTA supporting globalization efforts,workforce development and future assembly roadmaps
