About me
Lee Hong Kim is an Area Technical Manager at Indium Corporation with over 20 years of experience in the semiconductor and Surface Mount Technology (SMT) industries. He specializes in solder materials and assembly process engineering, with a focus on process optimization and defect reduction. He has led application development and technical programs across Asia, supporting customers in process characterization, implementation, and troubleshooting. His expertise spans end-to-end SMT and semiconductor assembly processes, leveraging design of experiments (DOE) and statistical analysis to improve transfer efficiency and yield. His recent work focuses on the impact of print parameters on solder paste behaviour and reliability in advanced packaging. He is also a recipient of the 2009 SMTA China East Best White Paper Award.
