About me
Choongpyo Jeon has been a reliability engineer at Samsung Electronics for more than 15 years. He has studied package reliability assessment and modelling. Over the course of his career, he published three papers as a 1st author, and he is currently the board-level reliability lead for the project.[Publications]Choongpyo Jeon et al. “A New Method of Component-level ESD Test to Assess System-level ESD Risk for ICs” AP EMC 2019.Choongpyo Jeon et al. “A Systematic Study and Lifetime Modeling on the Board Level Reliability of SSD after Temperature Cycling Test” ECTC 2021.Choongpyo Jeon et al. “Investigation of Acceleration factors for SnAgCu-Bi Solder Joints under various temperature cycling test conditions” ECTC 2023.
