About me
Christine Taylor is an Interconnect Quality Engineer at IBM, supporting connector reliability for high‑performance computing system. She has experience spanning advanced packaging development, electronic materials characterization, and component qualification across research, development and supplier environments. Christine holds a PhD in Mechanical Engineering from the Georgia Institute of Technology, where her research focused on electronic packaging reliability and interfacial failure mechanisms. She is a member of EIA CE-2 Committee, holds 2 patents and has published mainly in IEEE and ASME affiliated publications.
