About me
Anna Lifton is R&D Director at Macdermid Alpha Assembly Solutions, overseeing Application, Reliability, and Failure Analysis for the Circuit Board Assemblies business unit. With a Bachelor's degree from Moscow Steel and Alloys Institute, Russia, and a Master's degree in Material Science from Poly NYU, Anna brings over two decades of expertise to her role. Her extensive experience encompasses reliability assessment, failure analysis, high-reliability alloy development, electronic soldering, and applications in power electronics and automotive sectors. Anna is also credited with authoring/co-authoring several patents and numerous publications.In recent years, Anna has directed her focus towards enhancing SMT products for high-reliability applications and low-temperature materials for communication and computing markets. Her current endeavors involve advancing board-level reliability through the integration of leading soldering products with reinforcement materials (Edgebond and Underfill) as well as protection materials (conformal coatings and encapsulants)
