About me
Prof. Wu earned his Ph.D. from the University of California, Los Angeles. Since August 2012, he has served as a Professor in the Department of Chemical and Materials Engineering at National Central University. His research focuses on reliability challenges in advanced electronic packaging, functional thin-film materials, and thermoelectric modules. Prof. Wu’s early research centered on electromigration in solder materials and copper interconnects for electronic packaging applications. He has also developed significant expertise in the mechanisms of tin whisker growth. In recent years, his work has expanded to include the development of new low-temperature solder alloys and copper paste materials for high-power electronic devices. In addition to his teaching and research activities, Prof. Wu has held several key administrative positions at National Central University. He is an active contributor to the academic community, serving as a guest editor for journals including the Journal of Electronic Materials, JOM, and Microelectronics Reliability. He also plays a leading role in the materials science community through the organization of technical symposia for organizations such as TMS, MS&T, and IUMRS, furthering advancements in materials science and engineering.
