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Tuesday October 27, 2026 8:30am - 10:00am CDT
Session Chair:
Session Co-Chair:

8:30am-9:00am
Are Gaps Bad for Printing?
Presenter: Hong Kim Lee, Indium Corporation
Co-Authors:

9:00am-9:30am
Reliability Evaluation of Low-Silver Solder Alloy Solder Paste
Presenter: Shantanu Joshi, Koki Solder America Inc.
Co-Authors: Yuki Yamamoto, Kimiaki Mori, Satoshi Otani, Noriyoshi Uchida, Jasbir Bath, Jerome McIntyre, Koki Solder America Inc

9:30am-10:00am
Solder Powder Size Types and Their Associated Print Capabilities in Ultra High Density Applications
Presenter: Chrys Shea, Shea Engineering Services
Co-Authors: Shantanu Joshi, Michael Butler, Koki Solder America
Speakers
avatar for Hong Kim Lee

Hong Kim Lee

Area Technical Manager, Indium Corporation of America
Lee Hong Kim is an Area Technical Manager at Indium Corporation with over 20 years of experience in the semiconductor and Surface Mount Technology (SMT) industries. He specializes in solder materials and assembly process engineering, with a focus on process optimization and defect... Read More →
avatar for Shantanu Joshi

Shantanu Joshi

Head of Customer Solutions and Operational Excellence, Koki Solder America Inc.
Shantanu Joshi is the Head of Customer Solutions and Operational Excellence at KOKI Solder America and an Engineering Sales Manager at Koki Company Ltd., a global leader in soldering materials and solutions. With more than 10 years of experience in electronics manufacturing, he has... Read More →
avatar for Chrys Shea

Chrys Shea

Founder, SHEA Engineering Services
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.   Chrys is an SMTA “Member of Technical Distinction,” an SMTA “Distinguished Speaker” and four-time... Read More →
Tuesday October 27, 2026 8:30am - 10:00am CDT
MFX

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