BEGIN:VCALENDAR VERSION:2.0 X-WR-CALNAME:smtai2026 X-WR-CALDESC:Event Calendar METHOD:PUBLISH CALSCALE:GREGORIAN PRODID:-//Sched.com SMTA International 2026//EN X-WR-TIMEZONE:UTC BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T123000Z DTEND:20261026T220000Z SUMMARY:SMTA Registration DESCRIPTION:\n CATEGORIES:REGISTRATION LOCATION:LOBBY\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:f8a7f92dfe4e4cead238d67c439d4912 URL:http://smtai2026.sched.com/event/f8a7f92dfe4e4cead238d67c439d4912 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T133000Z DTEND:20261026T143000Z SUMMARY:AME Track Keynote Presentation: Hybrid Electronics - Accelerating Innovation and Adoption DESCRIPTION:Kick-Off SMTA International with the AME Track Keynote Presentation\n*This opening track keynote presentation is only available to paid conference participants \;\n\n\nHybrid Electronics: Accelerating Innovation and Adoption\nPresenter: Nick Morris\, Ph.D.\, Deputy Director of Technology\, NextFlex\n\nHybrid Electronics integrates additively manufactured electronic features including printed conductors\, antennas\, sensors\, dielectrics\, and passive components\, with conventional electronics\, semiconductor devices\, advanced packaging\, and surface mount technologies to enable electronic systems that cannot be realized through traditional manufacturing alone. By combining additive and conventional manufacturing approaches\, Hybrid Electronics enables lightweight\, conformal\, multifunctional\, and application-specific electronic systems for defense and commercial markets. As these technologies mature\, the challenge is no longer demonstrating individual capabilities\, but developing robust manufacturing processes that deliver the reliability\, scalability\, and cost needed for widespread adoption.\n\nThis keynote presents NextFlex's perspective on the current state and future direction of Hybrid Electronics manufacturing\, drawing upon more than a decade of collaborative manufacturing innovation across industry\, academia\, and government. Through representative NextFlex-funded development efforts\, the presentation will examine advances in printed and additive manufacturing processes\, functional materials\, hybrid integration\, embedded and conformal electronics\, and manufacturing approaches for sensors\, RF structures\, and advanced electronic assemblies. The discussion will highlight key manufacturing considerations including process characterization\, design-for-manufacturing\, inspection\, qualification methodologies\, reliability\, and production readiness\, illustrating how these technical elements influence successful technology transition.\n\nThe presentation will also explore how NextFlex's technology roadmaps identify the highest-priority manufacturing challenges facing the Hybrid Electronics community and guide collaborative investments that accelerate technology maturation. Case studies from both defense and commercial markets will demonstrate how ecosystem-driven development is reducing technical risk\, improving manufacturing readiness\, and enabling next-generation electronic systems. Lessons learned regarding manufacturing yield\, qualification\, cost-performance tradeoffs\, and pathways to production will be discussed throughout.\n\nAttendees will gain a strategic understanding of the Hybrid Electronics manufacturing landscape\, the critical technology gaps limiting broader adoption\, and the collaborative approaches being used to transition innovative technologies into qualified\, production-ready manufacturing solutions.\n\n\n\n CATEGORIES:CONFERENCE SESSION LOCATION:AME\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:efa357cf2f67ea4ac0a2d0096cf31a0c URL:http://smtai2026.sched.com/event/efa357cf2f67ea4ac0a2d0096cf31a0c END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T133000Z DTEND:20261026T170000Z SUMMARY:PDC1: Solder Joint Voids: Impact on Bottom Terminated Components (BTCs) and Ball Grid Arrays Solder Joint Reliability DESCRIPTION:Instructor:\n Dave Hillman\, Hillman Electronic Assembly Solutions LLC\n\nCourse Overview:\n This workshop explores the impact of solder joint voids on BTC and BGA component reliability\, covering materials\, design considerations\, and manufacturing processes. Topics include solder joint reliability for both tin/lead and lead-free soldering processes\, with an in-depth focus on the effects of voids on solder joint integrity and thermal performance.\n\nTopics Include:\n Classification and types of voids Solder joint void specifications\, including IPC-7093\, IPC J-STD-001\, and J-STD-001 Automotive Addendum requirements Manufacturing influences on void formation: Pad design Solder paste Stenciling\, reflow\, and cleaning processesSolder joint reliability considerations for: Ball Grid Arrays (BGAs) Bottom Terminated Components (BTCs) Other electronic components \nWho Should Attend:\n This course is designed for product design engineers\, process engineers and technicians\, and product reliability and safety engineers interested in understanding how solder joint voids impact BTC and BGA reliability. CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC1\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:2d7e6958c06cecb95c6d0b57e4d09ed6 URL:http://smtai2026.sched.com/event/2d7e6958c06cecb95c6d0b57e4d09ed6 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T133000Z DTEND:20261026T170000Z SUMMARY:PDC2: Mastering Intermetallics for Reliable Electronics DESCRIPTION:Instructor:\n Dr. Jennie S. Hwang\, Ph.D.\, D.Sc.\n H-Technologies Group\n\n Course Overview:\n Intermetallic compounds (IMCs) play a critical role in electronic interconnection reliability\, influencing solder joint integrity and overall product performance at the chip\, package\, and board levels. This course provides a comprehensive understanding of IMC formation\, evolution\, and control throughout the entire lifecycle of an electronic assembly\, from reflow and storage to field service. Participants will explore the relationship between IMCs\, solder alloys\, surface finishes\, component metallization\, and long-term reliability\, with practical insights connecting materials science fundamentals to real-world manufacturing challenges.\n\n Topics Include:\n • Fundamentals\, characteristics\, and behavior of intermetallic compounds\n • Role of phase diagrams in SnPb and lead-free solder systems\n • IMC formation and growth during assembly\, storage\, and service life\n • Interfacial vs. bulk intermetallics\n • Impact of IMCs on solder joint failure mechanisms and reliability\n • Effects of PCB surface finishes and component metallization\n • Gold embrittlement: causes\, factors\, and considerations\n • Influence of different IMC systems (Ni/Au\, Ni/Pd/Au\, Ni/Pd\, Cu) on solder reliability\n • SAC alloys with doping elements and their performance characteristics\n • Reliability considerations for low-temperature solder alloys\n • Case studies and practical recommendations\n\n Who Should Attend:\n This course is designed for engineers\, researchers\, managers\, and professionals involved in electronics design\, manufacturing\, quality\, and reliability. Attendees will gain practical knowledge to better understand solder joint behavior\, evaluate reliability risks\, and make informed decisions regarding materials selection and process optimization.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC2\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:118fbb187f2dd13748341c343087821d URL:http://smtai2026.sched.com/event/118fbb187f2dd13748341c343087821d END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T133000Z DTEND:20261026T170000Z SUMMARY:PDC3: Data-Driven Solder Paste Qualification DESCRIPTION:Instructor:\n Chrys Shea\n Shea Engineering Services\n\n Course Overview:\n Selecting a new solder paste can be a complex process with many factors to consider\, including printability\, reflow performance\, reliability\, and supplier support. This course introduces a data-driven approach to solder paste qualification using a structured scorecard methodology to evaluate candidate materials based on assembler-specific requirements. Participants will learn how to compare solder paste options\, identify tradeoffs\, optimize testing efficiency\, and confidently select the best material for their manufacturing needs.\n\n Topics Include:\n • Reasons to evaluate new solder paste formulations\, including:\n Fine-feature printing and Type 5 solder powders High-reliability alloys Low-temperature alloys Defect reduction and customer requirements\n • Solder paste selection scorecard methodology\n • PCB design strategies for solder paste testing\n • Maximizing test efficiency through optimized test plans and data collection\n • Step-by-step solder paste evaluation procedures\n • BOM and sample size calculations\n • Key solder paste characteristics and performance metrics\n • Data collection\, analysis\, and decision-making\n • Candidate disqualifiers and risk identification \nWho Should Attend:\n This course is designed for process and quality engineers evaluating solder paste performance\, manufacturing and production professionals considering material upgrades\, technicians involved in printing and reflow processes\, and suppliers interested in understanding solder paste qualification methods.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC3\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:a2675388d39ae5186c315234bebed357 URL:http://smtai2026.sched.com/event/a2675388d39ae5186c315234bebed357 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T133000Z DTEND:20261026T170000Z SUMMARY:PDC4: Principles and Practice of Developing Soldering Profiles DESCRIPTION:Instructor:\n Ray Prasad\n SMT Consultant and Author\, SMT Principles and Practice\n\n Course Overview:\n Based on IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes\, this course provides practical guidance on developing\, measuring\, and controlling thermal profiles to reduce soldering defects and improve product quality and reliability. Participants will learn best practices for creating profiles across various soldering processes\, including reflow\, wave\, vapor phase\, laser\, and selective soldering. The course addresses challenges such as mixed alloy assemblies\, varying component thermal masses\, and balancing profile requirements to achieve reliable solder joints.\n\n Topics Include:\n • Overview of soldering processes and thermal profiling methods\n Reflow\, wave\, vapor phase\, laser\, and selective soldering\n • Soldering zones and profile development Preheat\, soak\, reflow\, cooling\, peak temperature\, TAL\, and True TAL\n • Thermal profile requirements for tin-lead\, lead-free\, and low-temperature solder alloys\n • Proper thermocouple placement for accurate measurements\, including BGA applications\n • Oven performance monitoring and control\n • Managing profile tradeoffs to reduce defects such as voiding and head-in-pillow\n • Mixed alloy and backward/forward compatibility considerations\n • Examples of effective and ineffective profiles and associated defects \nWho Should Attend:\n This course is designed for managers\, design engineers\, process engineers\, quality engineers\, operators\, and technicians involved in soldering processes and thermal profile development. Professionals in manufacturing\, purchasing\, and management who want a stronger understanding of soldering reliability for BGAs\, BTCs\, and other SMT components will also benefit.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC4\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:43c24c499dbb4f39c4ef03d9632440ea URL:http://smtai2026.sched.com/event/43c24c499dbb4f39c4ef03d9632440ea END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T150000Z DTEND:20261026T163000Z SUMMARY:AME1: Additive Processes for Circuit Manufacture DESCRIPTION:Session Chair: \;​Prathiksha Ramprasad Dhanpal\, Westcliff University​​​\nSession Co-Chair:\n \n10:00am-10:30am\nNext Generation Direct Metallization Processes are Adaptable to the Evolving Printed Circuit Board Material LandscapePresenter: Lindsey Mercurio\, MacDermid Alpha Electronics Solutions \n \;\n10:30am-11:00am\nHigh Resolution Copper Printed RF DevicesPresenter: Tom Rovere\, Lockheed MartinCo-Authors: Maya Chiesa\, Emuobosan Enakerakpo\, Eric Whiting\, Lockheed Martin \n \n 11:00am-11:30am\nRoll-to-Roll Additive Manufacturing of Copper Micro-Wires for SMT CircuitPresenter: Carolyn Ellinger\, Eastman Kodak Company CATEGORIES:CONFERENCE SESSION LOCATION:AME\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:12cb46d301cda38e69eae6431bfbb989 URL:http://smtai2026.sched.com/event/12cb46d301cda38e69eae6431bfbb989 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T173000Z DTEND:20261026T190000Z SUMMARY:AME2: Embedded and Conformal Electronics DESCRIPTION:Session Chair: \;Karen Ebner\, Raytheon Technologies\nSession Co-Chair: \;Audrey Lee\, Collins Aerospace\n----------------------------------------- \n\n 12:30pm-1:00pm\nThermal and Moisture Reliability of In-Mold Gravure Offset Additive Circuits for Automotive ApplicationsPresenter: Pradeep Lall\, Ph.D.\, Auburn UniversityCo-Authors: Padma Choudhury\, Auburn University\; Scott Miller\, NextFlex National Manufacturing Institute\n\n 1:00pm-1:30pm\nEmbedding Electronics into High-Volume CBAM Additive ProcessPresenters: Nate Bode\, Impossible Objects & Denis Cormier\, Impossible Objects \n\n1:30pm-2:00pm\nGravure offset: engineered for today\, designed for tomorrow\nPresenter: Douglas Schardt\, Komori America Corporation CATEGORIES:CONFERENCE SESSION LOCATION:AME\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:9cbc71b9e8951ced8846cab8fc2db8d4 URL:http://smtai2026.sched.com/event/9cbc71b9e8951ced8846cab8fc2db8d4 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T180000Z DTEND:20261026T193000Z SUMMARY:MFX1: Reflow Technology DESCRIPTION:Session Chair: \;Ram Wissel\, KYZEN Corporation \nSession Co-Chair: Colette Anctil\, Collins Aerospace\n\n1:00pm-2:30pm\n Impact of Fixture Material on Thermal Stability and Process Performance in Reflow Soldering \nPresenter: Ricardo Chuma\, 2B Automacao \n\n2:30pm-3:00pm \n Impact of Operation Environment and Flux Residues on the Electrochemical Reliability of In Bi SAC Solder Paste \nPresenter: Sirine Bayram\, Ph.D.\, AIM Solder\n\n3:00pm-3:30pm\nA Mixed Powder Strategy to Improve Printing and Eliminate Nitrogen in ReflowPresenter: Mathilde Buret\, Inventec Performance ChemicalsCo-Authors: Yvan Bouyou\, Mélanie Mathon\, Emmanuelle Guene\, Inventec Performance Chemicals CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:2abeefad482931522b30ca9c32ad1664 URL:http://smtai2026.sched.com/event/2abeefad482931522b30ca9c32ad1664 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T183000Z DTEND:20261026T203000Z SUMMARY:WLP: Invited Keynote Presentations & Panel Discussion DESCRIPTION: CATEGORIES:WOMEN'S LEADERSHIP PROGRAM LOCATION:WLP\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:66206777bb60bc62bfc9253b6025cc73 URL:http://smtai2026.sched.com/event/66206777bb60bc62bfc9253b6025cc73 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T193000Z DTEND:20261026T210000Z SUMMARY:AME3: Interconnection and Ablation Processes for Additive Circuits DESCRIPTION:Session Chair:Session Co-Chair:\n2:30pm-3:00pmChallenges of Low Temperature Component Attach\nPresenter: Kalsi Kwan\, Boeing Engineering & Technology Innovation3:00pm-3:30pmEnhanced Design Rules and Optimization for Laser DepanelingPresenter: Jake Benz\, LPKF Laser & Electronics SECo-Author: Patrick Stockbruegger\, M.Sc.\, LPKF Laser & Electronics SE \;\n3:30pm-4:00pm\nJunction Formation Through Photonic Soldering under Ambient and Flux-less ConditionsPresenter: Vahid Akhavan\, Ph.D.\, PulseForgeCo-Authors: \;Nick Snyder\, Ara Parsekian\, PulseForge CATEGORIES:CONFERENCE SESSION LOCATION:AME\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:590dd62cecf56576a2eee2fbc45fb64b URL:http://smtai2026.sched.com/event/590dd62cecf56576a2eee2fbc45fb64b END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T200000Z DTEND:20261026T220000Z SUMMARY:MFX2: AI & Smart Factory Evolution DESCRIPTION:Session Chair: \;James Elliott Fowler\, Sandia National Labs\nSession Co-Chair:\n\n3:00pm-3:30pm \nIndustrial AI in Electronics Manufacturing: A Comprehensive Review of State-of-the-Art Applications\, Challenges\, and Future Directions \nPresenter: Sai Kolli\, Foxconn Industrial Internet (FII)\nCo-Authors: Edward Wong\, Fii\;  \;Daryl Santos\, Ph.D.\, Binghamton University\n\n3:30pm-4:00pm \n Solving SMT Component Attrition at Scale Using LLM-Based Agentic Analysis \nPresenter: Cameron Sobie\, Ph.D.\, Arch Systems\nCo-Authors: Andrew Scheuermann\, Tim Burke\, Arch Systems \n\n4:00pm-4:30pm \n Real-World AI and Smart Factory Implementations in SMT Manufacturing\nPresenter: Chris Dayney\, Fuji America \nCo-Authors: \n\n4:30pm-5:00pm \n Human vs. AI-Collaborative PCB Design: Comparative Analysis of Routing Efficiency and Manufacturing Performance \n Presenter: Athula Kulatunga\, Purdue University Northwest \nCo-Author: Jagadish Kirla\, Purdue University Northwest CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:7bf9257972b9e09337c0bd44e53838c9 URL:http://smtai2026.sched.com/event/7bf9257972b9e09337c0bd44e53838c9 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T210000Z DTEND:20261026T220000Z SUMMARY:WLP: Round Table Discussions DESCRIPTION: CATEGORIES:WOMEN'S LEADERSHIP PROGRAM LOCATION:WLP\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:04eac4470759859c17dc086cc0dd9fde URL:http://smtai2026.sched.com/event/04eac4470759859c17dc086cc0dd9fde END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T211500Z DTEND:20261026T220000Z SUMMARY:AME4: Panel Discussion DESCRIPTION:Challenges with the Integration of Additive Circuits into Traditional SMT Process Workflows\n\nPanelists:\nTom\, Rovere\, Lockheed Martin\nJohn Williams\, Boeing\nCarolyn Ellinger\, Eastman Kodak\nLindsey Mercurio\, MacDermid Alpha CATEGORIES:CONFERENCE SESSION LOCATION:AME\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:46e9c404e803ee79ab968e90bc935073 URL:http://smtai2026.sched.com/event/46e9c404e803ee79ab968e90bc935073 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261026T220000Z DTEND:20261026T230000Z SUMMARY:WLP: Connection Reception DESCRIPTION: CATEGORIES:WOMEN'S LEADERSHIP PROGRAM LOCATION:WLP\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:4d644f978e12b3039d6a6d71755ff44f URL:http://smtai2026.sched.com/event/4d644f978e12b3039d6a6d71755ff44f END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T123000Z DTEND:20261028T000000Z SUMMARY:SMTA Registration DESCRIPTION:\n CATEGORIES:REGISTRATION LOCATION:LOBBY\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:4e3be808c648758ee0caf7998fe06fa5 URL:http://smtai2026.sched.com/event/4e3be808c648758ee0caf7998fe06fa5 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T133000Z DTEND:20261027T150000Z SUMMARY:RHE1: Microstructure and Reliability DESCRIPTION:Session Chair: Thomas Zanatta\, ITM Consulting\nSession Co-Chair: Jia-Xin Ooi\, Keysight Technologies\n \n8:30am-9:00am \nThe Effect of Component Construction and Microstructure on the Thermal Cycling Performance of Reverse Hybrid Ball Grid Array Assemblies \nPresenter: Richard Coyle\, Ph.D.\, Nokia Bell Labs \nCo-Authors: See paper for full co-author listing\n\n9:00am-9:30am \n Microstructure Evolution and Failure Mechanisms in High Performance Solder Alloys During Harsh Thermal Cycling \nPresenter: Chris Gourlay\, Ph.D.\, Imperial College London \n\n9:30am-10:00am \n A New Approach to the Design of Lead-Free Solder Alloys\nPresenter: \;Keith Sweatman\, P.E.\, Nihon Superior Co.\, Ltd\nCo-Authors: Kazuhiro Nogita\, University of Queensland\, Australia\; Tetsuro Nishimura\, Nihon Superior Co.\, Ltd CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:ed44fef93e81a13af950cd833fac319c URL:http://smtai2026.sched.com/event/ed44fef93e81a13af950cd833fac319c END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T133000Z DTEND:20261027T170000Z SUMMARY:PDC5: AI-Powered Manufacturing: From Fundamentals to Factory Impact DESCRIPTION:Instructor:\n Dr. Jennie S. Hwang\, Ph.D.\, D.Sc.\n H-Technologies Group\n\n Course Overview:\n Artificial Intelligence is transforming modern manufacturing\, creating new opportunities to improve quality\, productivity\, supply chain performance\, and decision-making. This course provides an accessible introduction to AI fundamentals and explores how these technologies are being applied on the manufacturing floor. Attendees will gain practical insights into AI concepts\, real-world applications\, and strategies for evaluating opportunities and challenges in implementing AI-powered manufacturing solutions.\n\n Topics Include:\n • AI fundamentals and key concepts\n Machine learning\, deep learning\, neural networks\, digital twins\, IoT\, generative AI\, and AI agents\n • Understanding AI capabilities\, trust\, and practical applications\n • Prompt engineering techniques and recommendations\n • AI’s impact on the workforce and future roles\n • Data quality\, management\, and its importance in AI implementation\n • AI-powered manufacturing concepts and use cases\n • Applications of AI in electronics manufacturing\n • Benefits\, challenges\, and implementation considerations\n • Future trends\, including enterprise opportunities and artificial general intelligence (AGI) \nWho Should Attend:\n This course is designed for professionals at all levels\, including engineers\, researchers\, managers\, production\, quality\, and reliability professionals\, executives\, and business leaders interested in understanding AI’s impact on manufacturing. No prior AI experience is required. Participants will gain a practical foundation for evaluating AI opportunities and applying AI concepts within electronics manufacturing and beyond.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC5\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:cbbcb53cfe341e559b7ee0fb5b3f6a76 URL:http://smtai2026.sched.com/event/cbbcb53cfe341e559b7ee0fb5b3f6a76 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T133000Z DTEND:20261027T170000Z SUMMARY:PDC6: Assembly: Best Practices for Improving Manufacturing Productivity DESCRIPTION:Instructors:\n Jim Hall & Phil Zarrow\n ITM Consulting\n\n Course Overview:\n This course provides practical strategies for improving productivity\, quality\, and yield in electronic assembly operations. Participants will explore how non-optimal processes\, materials\, equipment\, and procedures can impact manufacturing performance and financial success. The course identifies common assembly challenges and provides actionable solutions to optimize existing production lines and improve overall efficiency.\n\n Topics Include:\n • Manufacturing optimization and maximizing productivity from existing lines\n • Defining and implementing assembly best practices\n • Solder paste printing process best practices\n • Reflow soldering best practices\n • Low-temperature soldering considerations\n • Wave and selective soldering best practices\n • Best practices for challenging technologies\, including BTCs and ultra-fine pitch components\n • Q&A and practical discussion\n \nWho Should Attend:\n This course is designed for manufacturing\, process\, design\, test\, and quality engineering professionals\, as well as managers and supervisors involved in surface mount and mixed technology assembly operations. Participants responsible for improving production efficiency\, quality\, and reliability will benefit from this course.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC6\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:36171bae8bac294d31f9b08006fdbb5b URL:http://smtai2026.sched.com/event/36171bae8bac294d31f9b08006fdbb5b END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T133000Z DTEND:20261027T170000Z SUMMARY:PDC7: Design and Assembly Process Challenges for Bottom Termination Components (BTCs) in Tin-Lead and Lead-Free Applications DESCRIPTION:Instructor:\n Ray Prasad\n SMT Consultant and Author\, SMT Principles and Practice\n\n Course Overview:\n Bottom Termination Components (BTCs)\, including QFN\, DFN\, SON\, LGA\, and MLF packages\, present unique design\, assembly\, inspection\, and reliability challenges due to their hidden solder connections and sensitivity to process variation. This course provides practical guidance for successfully implementing robust BTC assembly processes in both tin-lead and lead-free environments. Participants will learn how to address common design and manufacturing challenges\, optimize solder paste printing and rework processes\, and reduce the risk of field failures.\n\n Topics Include:\n • Overview of BTC package types and characteristics\n • Advantages and challenges of BTC technology\n • BTC package construction and manufacturing considerations\n • Design considerations\, including:\n PCB laminates and surface finishes Land pattern and stencil design Component considerations\n • Assembly process guidelines: Solder paste printing optimization Reflow process requirements Solder joint quality considerations BTC rework processes\n • Inspection challenges and reliability considerations\n • Strategies to prevent field failures and improve manufacturing success \nWho Should Attend:\n This course is designed for managers\, design engineers\, process engineers\, quality engineers\, operators\, and technicians involved in electronic design\, assembly\, inspection\, and repair processes. Professionals working with tin-lead or lead-free BTC assemblies\, including QFN\, DFN\, and similar packages\, will benefit from learning practical approaches to improving design and manufacturing reliability.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC7\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:ba3c740eff250262a8431ac90589b35c URL:http://smtai2026.sched.com/event/ba3c740eff250262a8431ac90589b35c END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T133000Z DTEND:20261027T150000Z SUMMARY:Back 2 Basics Session 1: From Design to Fab DESCRIPTION:Back to Basics\nWhether you’re new to electronics manufacturing or strengthening your foundational knowledge\, Back to Basics provides a practical introduction to the PCB ecosystem. This full-day track at SMTA International features ten sessions led by industry practitioners covering the processes\, equipment\, and decisions that drive quality on the manufacturing floor.\n\nSession Presentations\n"PCB Design:  \;Where It All Begins" - Shawn McCutcheon\, Go Technology Corporation\n"Behind the Scenes: PCB Fabrication" -  \;Kevin Dial\, American Standard Circuits\n"Bridging the Design-to-Fab Gap" - John Johnson\, American Standard Circuits CATEGORIES:SPECIAL EVENT LOCATION:WFD\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:afc7b73247a7d9ca8fe0647204cb976b URL:http://smtai2026.sched.com/event/afc7b73247a7d9ca8fe0647204cb976b END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T140000Z DTEND:20261027T150000Z SUMMARY:INS1: AI Infiltrates Inspection: Latest from the Coalface DESCRIPTION:Session Chair: Robert Boguski\, Datest Corporation\nSession Co-Chair:\n\n 9:00am-9:30am \n Counterfeit Detection as an AI-Based AOI Software Add-On \;\nPresenter: Eyal Weiss\, Ph.D.\, Cybord \n\n9:30am-10:00am \n AI-Native Automated Optical Inspection: Sub-10-Minute Programming for New Boards with Low False-Call Rates \nPresenter: Collin Stoner\, Selene Photonics \n \; CATEGORIES:CONFERENCE SESSION LOCATION:INS\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:8be938cdf3fcf483e51bdedc8969539d URL:http://smtai2026.sched.com/event/8be938cdf3fcf483e51bdedc8969539d END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T140000Z DTEND:20261027T150000Z SUMMARY:MFX Track Keynote Presentation: AI Infrastructure Technology: Driving Forces\, Challenges & Key Directions DESCRIPTION:Join the Manufacturing for Excellence (MFX) track keynote on Tuesday morning!\n*This opening track keynote presentation is only available to paid conference participants \;\n\n\nAI Infrastructure Technology Driving Forces\, Challenges & Key Directions\nAI infrastructure growth is driven by surging computational demand from increasingly large & complex generative AI models as companies shift to massive\, energy‑intensive AI Infrastructure buildouts. Advanced Silicon & packaging technologies are becoming essential drivers of AI infrastructure growth as increasingly complex AI accelerators demand higher performance\, thermal efficiency\, bandwidth density and needs for AI driven advanced manufacturing.  \;This talk will provide key insights into AI driven advanced manufacturing directions focused on real time automation\, big data enabled high \;precision quality\, and AI enabled predictive capabilities. \;\n\nMeet Dr. Yoon\n\nJung is a Distinguished Engineer & CTO of IBM Supply Chain. He is a recognized industry leading expert in DRAM\, Flash\, SSDs\, and semiconductor devices\, and drives technology convergence between industry capabilities and IBM’s strategic product offerings across IBM’s server infrastructure.  \;Jung has over 30 years of experience in the field of Semiconductor R&D\, technology enablement and quality. Jung earned his PhD in Solid State Physics from Columbia University\, MS from University of California Berkeley\, and a BS from Seoul National University.\n\n\n\n\n \;\n\n\n CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:63d33f17a4ef7cb1d282d26194315328 URL:http://smtai2026.sched.com/event/63d33f17a4ef7cb1d282d26194315328 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T153000Z DTEND:20261027T170000Z SUMMARY:INS2: Cautionary Tales from Imaging Analysis DESCRIPTION:Session Chair: David Dworak\, Dymax Corporation\nSession Co-Chair:\n\n10:30am-11:00am \nAOI Should Not Be Used as a Pass/Fail Gate: Applying SPC Principles to Inspection Data for Earlier Root Cause Identification in SMT \nPresenter: Jeremy Orbach\, Omron Automation USA \n\n11:00am-11:30am \nComputed Tomography (CT) vs. Computed Laminography CL for Non-Destructive Inspection of Printed Circuit Boards and Electronic Packages \nPresenter: Vineeth Bastin\, Comet Technologies USA Inc.\nCo-Author: David Kruidhof\, Comet Technologies USA Inc\n\n11:30am-12:00pm \nFailure Mechanism Investigation of NVMe Link Degradation from PCIe Gen4 to Gen3 Due to PCB Dielectric Collapse \n Presenter: Emmanuel Opata\, IBM Corporation\nCo-Author: Zhipeng Wang\, IBM Corporation CATEGORIES:CONFERENCE SESSION LOCATION:INS\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:4bb36df901af04c80465ad61888bd4b0 URL:http://smtai2026.sched.com/event/4bb36df901af04c80465ad61888bd4b0 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T153000Z DTEND:20261027T170000Z SUMMARY:MFX3: Cleaning & Coating DESCRIPTION:Session Chair: Kristen Eckart\, Lockheed Martin\nSession Co-Chair: Ram Wissel\, KYZEN Corporation\n \n10:30am-11:00am \n Assessing SMT Component Compatibility and Reliability in Assembly and Cleaning Processes\n Presenter: Chelsea Jewell\, KYZEN Corporation\nCo-Author: Nicholas Ostrom\, Lockheed Martin \n\n11:00am-11:30am \n What is a Sufficient Rinse? \n Presenter: Vladimir Sitko\, PBT Works \n \n11:30am-12:00pm \n Process Characterization for Determining Acceptable Levels of Flux Residue \nPresenter: Mike Bixenman\, Ph.D.\, Magnalytix\, LLC\nCo-Author: Matt Imburgia\, Magnalytix\, LLC CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:6e95094af345c272b77feb4fa152c4b9 URL:http://smtai2026.sched.com/event/6e95094af345c272b77feb4fa152c4b9 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T153000Z DTEND:20261027T170000Z SUMMARY:RHE2: Alloying Effects on Performance DESCRIPTION:Session Chair: \;Francis Mutuku\, Indium Corporation\nSession Co-Chair:\n \n10:30am-11:00am \n Revisiting Silver-Content in Lead-Free Alloys: Reliability of Low-Cost Alternatives to SAC305 in Modern Electronics Assembly \n Presenter: Anna Lifton\, MacDermid Alpha Electronics Solutions\nCo-Authors: Kennedy Fox\, Suraj Saifullah\, Ebad Rehman\, MacDermid Alpha Electronics Solutions \n\n11:00am-11:30am \n Effect of Bismuth and Antimony Additions on the Shear Properties of ENIG-Finished SAC Individual Solder Joints \nPresenter: Waad Tarman\, Auburn University\nCo-Authors: John Evans\, Ph.D.\, Auburn University\; Sa'd Hamasha\, Ph.D.\, Binghamton University \n\n11:30am-12:00pm \n A Comparative Study of Mechanical Behavior of Next Generation Lead-Free Solder Alloys \n Presenter: Pritha Choudhury\, Ph.D.\, MacDermid Alpha Electronics Solutions India Pvt. Ltd.\nCo-Authors: Anil Kumar\, Prathap Augustine\, Lijia Xie\, Sean Yenyu Lai\, Ching-Chien Chen\, Ganesh Subbarayan\, John Blendell\, MacDermid Alpha Electronics Solutions CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:b520da948dc4624edc14660d6ef102ee URL:http://smtai2026.sched.com/event/b520da948dc4624edc14660d6ef102ee END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T153000Z DTEND:20261027T170000Z SUMMARY:Back 2 Basics Session 2: SMT Assembly Essentials DESCRIPTION:Back to Basics\nWhether you’re new to electronics manufacturing or strengthening your foundational knowledge\, Back to Basics provides a practical introduction to the PCB ecosystem. This full-day track at SMTA International features ten sessions led by industry practitioners covering the processes\, equipment\, and decisions that drive quality on the manufacturing floor.\n\nSession Presentations\n"Mastering the First Step: Stencil Printing" - Adam Murling\, Indium Corporation\n"Component Placement: Right Part\, Right Place" - Daniel Stanphill\, Aurora Boardworks\n\n CATEGORIES:SPECIAL EVENT LOCATION:WFD\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:23854b484426009c07cba1bf7ac44af8 URL:http://smtai2026.sched.com/event/23854b484426009c07cba1bf7ac44af8 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T153000Z DTEND:20261027T210000Z SUMMARY:Workforce Development & Student Technical Session DESCRIPTION:The Workforce Development and Student Technical Sessions are designed to engage both students and industry professionals through keynote presentations\, interactive tables\, and focused technical content on emerging technologies in electronics manufacturing.\n\nRegistration\nFree and open to the public. RSVP for this session when registering for SMTA International.\n\nWorkforce Development Session\nThe session opens with a 30–45 minute keynote on emerging technologies intended to appeal to a broad audience — from students to experienced industry professionals. The keynote will incorporate real workforce data and statistics from recent SMTA events\, including the Arizona session\, and set the stage for the interactive table activities.\n\nEMAC Update\nFollowing the keynote\, a 15–30 minute EMAC (Electronics Manufacturing Advisory Council) update will cover recent accomplishments\, acknowledge academic and business partners\, and preview upcoming initiatives. Back to Basics sessions will be incorporated into this segment.\n\nStudent Technical Sessions\nThe technical sessions run 90 minutes total\, structured as three 30-minute presentations. Topics are focused on emerging technologies that connect directly to the keynote.\n\nTopics:\n• \;  \; \;AI in Electronics Manufacturing\n• \;  \; \;3D Printing for Electronics Tooling\n• \;  \; \;Emerging Nanotechnology\n\n\n CATEGORIES:SPECIAL EVENT LOCATION:EMAC\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:88395b99578961c780faf0cb4140e994 URL:http://smtai2026.sched.com/event/88395b99578961c780faf0cb4140e994 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T170000Z DTEND:20261027T183000Z SUMMARY:Next Gen Connect: Pizza and Perspectives DESCRIPTION:Next Gen Connect: Pizza and Perspectives \;brings students\, young professionals\, and experienced industry leaders together for an informal lunch focused on career guidance\, shared knowledge\, and meaningful connections.Held over pizza at Slyce\, this event is designed to help the next generation of electronics manufacturing professionals meet longtime SMTA members\, chapter leaders\, committee members\, and industry veterans who can offer perspective from years in the field. Attendees will have the chance to ask questions\, hear practical advice\, and build relationships that can extend beyond SMTA International.\nWhether you are attending your first SMTAI or looking to grow your professional network\, this lunch is an easy way to connect with people who have navigated the industry and want to help newer professionals find their path.\nWhy attend?\nMeet experienced industry professionals\, hear real-world career advice\, learn how to get more involved in SMTA\, and make connections that can support your next steps.Who should attend?\nStudents\, young professionals\, first-time attendees\, and anyone looking to build relationships with SMTA leaders and longtime industry members.What to expect\nPizza\, informal conversation\, practical guidance\, and a welcoming space to connect with peers and experienced professionals.How to attend? \nRSVP when registering for SMTA International by selecting the free add-on ticket\, Pizza & Perspectives.\n CATEGORIES:SPECIAL EVENT LOCATION:SLYCE Restaurant @ Embassy Suites Rosemont\, 5500 N River Rd\, Rosemont\, IL 60018\, United States SEQUENCE:0 UID:48fa9a4c8ab93867c463db6ce3d5ee19 URL:http://smtai2026.sched.com/event/48fa9a4c8ab93867c463db6ce3d5ee19 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T180000Z DTEND:20261027T200000Z SUMMARY:MFX4: OPS Excellence & Box Level Assembly DESCRIPTION:Session Chair: Gregory Vance\, Rockwell Automation\nSession Co-Chair: \;Colette Anctil\, Collins Aerospace\n \n1:00pm-1:30pmLine SPOCK: A Holistic Approach to Statistical Process Optimization\, Control\, and Kinematics in High-Frequency SMT Performance ValidationPresenter: Michael Sivigny\, CeTaQ Americas \n\n1:30pm-2:00pm Factors in Maximizing the Return on an Investment in Automation\nPresenter: Troy Gueller\, Rockwell Automation \n \n2:00pm-2:30pm\nNo Parts\, No Boards: A Risk-Based Framework for Mitigating Supply Chain VolatilityPresenter: Ed Dodd\, Cofactr \n\n2:30pm-3:00pm \nThe Science of BondingPresenter: Dave Dworak\, Dymax Corporation CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:ddfb0e39657737dc8c3626a32281a177 URL:http://smtai2026.sched.com/event/ddfb0e39657737dc8c3626a32281a177 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T180000Z DTEND:20261027T200000Z SUMMARY:RHE3: Conformal Coating and Reliability 1 DESCRIPTION:Session Chair: Sal Sparacino\, ZESTRON Corporation\nSession Co-Chair: \;Carol Doscher\, MDI Power\n \n1:00pm-1:30pm \n Effect of Standoff Height\, Pitch\, and Component Type on Conformal Coating Ingress and Solder Joint Reliability in BGA and BTC Assemblies\n Presenter: Suraj Saifullah\, MacDermid Alpha Electronics Solutions\nCo-Authors: Kennedy Fox\, Anna Lifton\, MacDermid Alpha Electronics Solutions \n\n1:30pm-2:00pm \n Conformal Coating Reliability for Harsh Environments\n Presenter: Jayse McLean\, John Deere Intelligent Solutions Group \n\n 2:00pm-2:30pm \n Active Condensation Exposure and the Reliability of Solvent-Free Conformal Coatings \n Presenter: Andrea Charif\, Ph.D.\, Henkel Corporation\nCo-Authors: Rita Mohanty\, Alejandro Sanchez\, \;Henkel Corporation \n \n2:30pm-3:00pm \n The Impact of Conformal Coating on the Reliability of Solder Interconnects \nPresenter: Michael Osterman\, Ph.D.\, CALCE/University of Maryland CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:a3f7c4894e2f7c41b8f14e85f763966a URL:http://smtai2026.sched.com/event/a3f7c4894e2f7c41b8f14e85f763966a END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T180000Z DTEND:20261027T200000Z SUMMARY:Back 2 Basics Session 3: Solder\, Repair & Protect DESCRIPTION:Back to Basics\nWhether you’re new to electronics manufacturing or strengthening your foundational knowledge\, Back to Basics provides a practical introduction to the PCB ecosystem. This full-day track at SMTA International features ten sessions led by industry practitioners covering the processes\, equipment\, and decisions that drive quality on the manufacturing floor.\n\nSession Presentations\n"Reflow Soldering:  \;What Really Happens" -  \;Miles Moreau\, KIC\n"Wave & Selective: When and Why" - Gayle Towell\, AIM Solder\n"Rework Strategies That Work" - Nash Bell\, BEST Inc. \;\n\n CATEGORIES:SPECIAL EVENT LOCATION:WFD\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:2c1693f6592f36734d824be10bd1fd3a URL:http://smtai2026.sched.com/event/2c1693f6592f36734d824be10bd1fd3a END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T183000Z DTEND:20261027T200000Z SUMMARY:INS3: Eat Your Vegetables\, Part I: Test Methods You Need to Know DESCRIPTION:Session Chair: Gary Tanel\nSession Co-Chair:\n \n1:30pm-2:00pm\n Process Qualification to J-STD-001 Section 8 Cleanliness\nPresenter: Mike Bixenman\, Ph.D.\, Magnalytix\, LLC\nCo-Author: Zach Papiez\, Magnalytix\, LLC \n\n2:30pm-3:00pm \n Mitigation Strategies for Failures Resulting from Ionizing Radiation \n Presenter: David Kruidhof\, Comet Technologies USA\, Inc.\nCo-Author: Vineeth Bastin\, Comet Technologies USA\, Inc. \n\n3:00pm-3:30pm\n Mitigation Strategies for Failures Resulting from Ionizing Radiation \n Presenter: Matt Turpin\, Datest Corporation CATEGORIES:CONFERENCE SESSION LOCATION:INS\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:5052d0a3e55d6ec651d433d086ea2251 URL:http://smtai2026.sched.com/event/5052d0a3e55d6ec651d433d086ea2251 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T183000Z DTEND:20261027T200000Z SUMMARY:LTS1: Low-Temperature Solder Materials DESCRIPTION:Session Chair: Ronald Lasky\, Ph.D.\, P.E.\, Dartmouth College\nSession Co-Chair: Paul E. Wang Ph.D.\, Mitac Corporation\n\n 1:30pm-2:00pm \n Reliability performance and challenges of Bi-Sn based Homogeneous Low Temperature Solder Joint \nPresenter: Choongpyo Jeon\, Samsung Electronics\n Co-Authors: Soojin Yoo\, Seungjin Oh\, Keunho Rhew\, Yuchul Hwang\, Kichul Chun\, Samsung Electronics\n\n2:00pm-2:30pm \n Electrical Resistivity and Microstructure of Sn-Bi Solder \n Presenters: Frances Holcomb\, Binghamton University\nCo-Author: Silas Wieland\, Eric Cotts\, Ph.D.\, Binghamton University \n\n2:30pm-3:00pm \n Lead-Free Flux-less Soldering Below 120°C \n Presenter: Martijn Mulder\, Mat-Tech BV \nCo-Authors: Arthur Miles\, Mo Biglari\, Alexandre Kodentsov\, Mat-Tech BV CATEGORIES:CONFERENCE SESSION LOCATION:LTS\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:651c8c4c8b4004bbdd9b7fd976106f64 URL:http://smtai2026.sched.com/event/651c8c4c8b4004bbdd9b7fd976106f64 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T203000Z DTEND:20261027T220000Z SUMMARY:INS4: Eat Your Vegetables\, Part II: Test Methods You Need to Know DESCRIPTION:Session Chair:\n Session Co-Chair:\n \n3:30pm-4:00pm\n FCT for RF/High Speed Applications with Test Probes. Strategies\, Pitfalls and How to Avoid Those \n Presenter: Matthias Zapatka\, Ingun USA \n\n4:00pm-4:30pm \n A Three-Camera based Digital Image Correlation System for Warpage Measurement and CTE Distribution Analysis \n Presenters: Liam Crosbie\, Dantec Dynamics \nCo-Author: LiKang Luan\, Dantec Dynamics \n\n4:30pm-5:00pm \n Need for speed: Boosting X-Ray Inspection Speed in Advanced Electronics \n Presenter: Chris Nicholson\, Ph.D.\, Comet X-Ray\nCo-Author: Anthony Williams\, Comet X-Ray CATEGORIES:CONFERENCE SESSION LOCATION:INS\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:b1bca3f8dee31770fd50fa4943278e88 URL:http://smtai2026.sched.com/event/b1bca3f8dee31770fd50fa4943278e88 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T203000Z DTEND:20261027T213000Z SUMMARY:LTS2: Low-Temperature Soldering Advances DESCRIPTION:Session Chair: \;Kristen Eckart\, Lockheed Martin\nSession Co-Chair: Anthony Rafanelli\n\n3:30pm-4:00pm \n Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and TCT Reliability \nPresenter: Hongwen Zhang\, Ph.D.\, Indium Corporation\nCo-Authors: Danyang Zheng\, Ph.D.\, Cassandra Goppert\, Mengyao Wen\, Yifan Wu Ph.D.\, Francis Mutuku Ph.D.\, Indium Corporation \n\n4:00pm-4:30pm \n Deformation and Damage Properties of Solder Joints Reflowed at Temperatures Between 80C and 140C \n Presenter: Sai Reddy Munnangi\, Ph.D.\, Binghamton University\nCo-Authors: Anola Semndili\, Ronit Das\, Shantanu Joshi\, Peter Borgesen\, Binghamton University CATEGORIES:CONFERENCE SESSION LOCATION:LTS\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:dfaae59c4fe734d5b9997d2ceaf73b27 URL:http://smtai2026.sched.com/event/dfaae59c4fe734d5b9997d2ceaf73b27 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T203000Z DTEND:20261027T223000Z SUMMARY:MFX5: Solder Paste Printing & Reliability DESCRIPTION:Session Chair: Maurice Dore\, Valeo\nSession Co-Chair: Jeff Schake\, ASMPT SMT Solutions\n\n3:30pm-4:00pm\nAre Gaps Bad for Printing? \n Presenter: Hong Kim Lee\, Indium Corporation \n\n 4:00pm-5:00pm\nReliability Evaluation of Low-Silver Solder Alloy Solder Paste \nPresenter: Shantanu Joshi\, \;Koki Solder America Inc.\nCo-Authors: Yuki Yamamoto\, Kimiaki Mori\, Satoshi Otani\, Noriyoshi Uchida\, Jasbir Bath\, Jerome McIntyre\, Koki Solder America Inc \n\n4:30pm-5:00pm \nSolder Powder Size Types and Their Associated Print Capabilities in Ultra High Density Applications \nPresenter: Chrys Shea\, Shea Engineering Services\nCo-Authors: Shantanu Joshi\, Michael Butler\, Koki Solder America\n\n5:00pm-5:30pm\nThe Effect of Viscosity on Solder Paste PerformancePresenter: \;Jose Gonzalez\, Ph.D.\, AIM Solder\nCo-Author: Ana Castillo\, M.S.\, Carlos Tafoya I.E.\, David Solis\, I.E.\, Behnam Meschi Amoli\, Ph.D.\, Gayle Towell\, M.S.\, AIM Solder CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:bb2ab6b3662148a8528db7922803eae2 URL:http://smtai2026.sched.com/event/bb2ab6b3662148a8528db7922803eae2 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T203000Z DTEND:20261027T220000Z SUMMARY:RHE4: Conformal Coating and Reliability 2 DESCRIPTION:Session Chair: \;Chintan Sanghani\, SLB\nSession Co-Chair: \;Brian Toleno\, MateriaSolve\n\n3:30pm-4:00pm\n How to Know If Your Conformal Coating Process is Good or Not \;\n Presenter: Jason Keeping\, P.E.\, Celestica\n \n4:00pm-4:30pm \n Defects in Conformal Coating \nPresenter: Doug Pauls\, ItDepends Electronics LLC & Deb Vorwald\, Collins Aerospace \n\n4:30pm-5:00pm \n BGA Solder Joint Solder Joint Reliability Degradation From Incorrect Conformal Coating Processes\n Presenter: David Hillman\, Hillman EAS LLC\nCo-Author: Ross Wilcoxon\, Collins Aerospace CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:bec8e4f5d3c383477c5f41cde7e8318b URL:http://smtai2026.sched.com/event/bec8e4f5d3c383477c5f41cde7e8318b END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T203000Z DTEND:20261027T220000Z SUMMARY:Back 2 Basics Session 4: Test & Verify + Guided Expo Walk DESCRIPTION:Back to Basics\nWhether you’re new to electronics manufacturing or strengthening your foundational knowledge\, Back to Basics provides a practical introduction to the PCB ecosystem. This full-day track at SMTA International features ten sessions led by industry practitioners covering the processes\, equipment\, and decisions that drive quality on the manufacturing floor.\n\nSession Presentations\n"Cleaning and Coating:  \;Protect What You've Built" -  \;Elliott Fowler\, Sandia National Laboratories\n"Trust But Verify: Test and Inspection" - Brittany White\, Schweitzer Engineering Laboratories (SEL)\n\n CATEGORIES:SPECIAL EVENT LOCATION:WFD\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:6ca4aaf034f68ec1abe01abc112a1231 URL:http://smtai2026.sched.com/event/6ca4aaf034f68ec1abe01abc112a1231 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T210000Z DTEND:20261028T000000Z SUMMARY:Electronics Exhibition DESCRIPTION:See full exhibitor listing and floorplan here: https://www.smtai.org/exhibitors CATEGORIES:EXHIBITION LOCATION:EXPO HALL B\,C\,D\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:cd35c8b8573443b3a5afb4ebad94c57f URL:http://smtai2026.sched.com/event/cd35c8b8573443b3a5afb4ebad94c57f END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T210000Z DTEND:20261028T000000Z SUMMARY:Bright Manufacturing Challenge Round 2 (Team Robotics Challenge) DESCRIPTION:What is the Bright Electronics Manufacturing Challenge?\nThe Bright Electronics Manufacturing Challenge is an immersive\, hands-on experience where student teams will design\, fabricate\, and test a custom printed circuit board to serve as the control center for a robot — simulating a real-world engineering product development cycle.\n\nROUND 2 - Assembly\n$500 prize\nHands-on PCB assembly in a timed environment. During Round 2\, the focus shifts to how well students assemble their PCBs\, manage rework\, and validate electrical functionality. Judging will emphasize soldering quality and workmanship. CATEGORIES:SPECIAL EVENT LOCATION:SMTA Booth #2851\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:132dd6465fe827fdcf087f7c43ecfff1 URL:http://smtai2026.sched.com/event/132dd6465fe827fdcf087f7c43ecfff1 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T210000Z DTEND:20261028T000000Z SUMMARY:Tuesday Evening Reception: Pit Stop Party DESCRIPTION:Refuel\, Recharge & Connect. \n\nJoin us at the SMTA Booth for complimentary drinks and light bites! This is a great opportunity to network\, connect with fellow attendees\, and unwind in a fun and relaxed atmosphere. CATEGORIES:SPECIAL EVENT LOCATION:SMTA Booth #2851\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:e6cf027f36a79a92de28d153230b799e URL:http://smtai2026.sched.com/event/e6cf027f36a79a92de28d153230b799e END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261027T220000Z DTEND:20261027T230000Z SUMMARY:RHE Town Hall: The Impact of Conformal Coating on Reliability DESCRIPTION:Join SMTA for a Town Hall open to all attendees\, featuring an engaging and interactive discussion on conformal coating and its impact on solder joint reliability.\n\nThe Town Hall will immediately follow the Reliability\, Harsh Environment (RHE) technical session on conformal coating\, which provides important background and context for the discussion. \n\nThis attendee-driven forum welcomes a wide range of perspectives\, experiences\, and opinions. Audience questions and comments will shape the discussion\, creating a dynamic exchange of ideas on one of the industry's most relevant and debated topics.\n\nPlease submit questions in advance to: hillmaneas@gmail.com CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:003db054a9b422d494bfd359ca03928c URL:http://smtai2026.sched.com/event/003db054a9b422d494bfd359ca03928c END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T123000Z DTEND:20261028T220000Z SUMMARY:SMTA Registration DESCRIPTION:\n CATEGORIES:REGISTRATION LOCATION:LOBBY\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:6a2077dedae59def766c0babf0b40553 URL:http://smtai2026.sched.com/event/6a2077dedae59def766c0babf0b40553 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T150000Z DTEND:20261028T220000Z SUMMARY:Electronics Exhibition DESCRIPTION:See full exhibitor listing and floorplan here: https://www.smtai.org/exhibitors CATEGORIES:EXHIBITION LOCATION:EXPO HALL B\,C\,D\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:2fa59011d158da10322caa89d4c1a765 URL:http://smtai2026.sched.com/event/2fa59011d158da10322caa89d4c1a765 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T150000Z DTEND:20261028T153000Z SUMMARY:Electronics Assembly Explorer Kickoff DESCRIPTION:Welcome to the Electronics Manufacturing Explorer \nStep into the world of electronics manufacturing through hands-on challenges\, expert conversations\, and practical problem-solving - all on the SMTA International expo floor. Enter for a chance to win a pair of Bose noise cancelling headphones!\n\nCan You Keep Production Moving?\nYou are the lead manufacturing engineer for a new electronics product. As production begins\, challenges appear throughout the assembly process\, and you are tasked with getting things back on track.\n \nHow It Works\n-Read the scenario for each manufacturing process.\n-Consider how the problem or challenge can be identified\, prevented\, or resolved.\n-Locate an exhibiting company or piece of equipment that could help.\n-Capture a photo with your solution as proof of your visit and upload it to the Explorer site.\n-Complete the station to move to the next challenge.\n \nThe subject of your submission photos will depend on the solution to each challenge. Some might involve a short conversation\, and others may be a specific piece of equipment. Be creative and ask questions - we're counting on you! CATEGORIES:SPECIAL EVENT LOCATION:Room 13 - Level 1\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:5524b915e38ab6c503ef21b2385e6dc8 URL:http://smtai2026.sched.com/event/5524b915e38ab6c503ef21b2385e6dc8 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T150000Z DTEND:20261028T160000Z SUMMARY:SMTA International Keynote Presentation DESCRIPTION:Information coming soon…. CATEGORIES:SPECIAL EVENT LOCATION:Room 13 - Ground Floor\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:340d9016aac76618570ef073e1a2873c URL:http://smtai2026.sched.com/event/340d9016aac76618570ef073e1a2873c END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T153000Z DTEND:20261028T210000Z SUMMARY:Bright Manufacturing Challenge Round 3 (Team Robotics Challenge) DESCRIPTION:What is the Bright Electronics Manufacturing Challenge?\nThe Bright Electronics Manufacturing Challenge is an immersive\, hands-on experience where student teams will design\, fabricate\, and test a custom printed circuit board to serve as the control center for a robot — simulating a real-world engineering product development cycle.\n\nROUND 3- The Final Challenge\n$2\,000 prize\nThe culminating event — teams bring their completed robots to life in a real-world competition on a physical arena floor. Round 3 evaluates the integration of electronics\, firmware\, mechanical design\, and teamwork under pressure. It demonstrates how effectively teams turned their PCB design into a functional\, mission-capable robot.\n\nTimeline\n10:30am-12:00pm: Speed Round Qualifying1:30pm-2:00pm: Quarterfinals2:05pm-2:25pm: Shake-out Runs2:45pm-3:00pm: Semifinals3:15pm-3:30pm: Final3:45pm Award: Ceremony CATEGORIES:SPECIAL EVENT LOCATION:SMTA Booth #2851\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:fde81fd99306eb0752190698bb204819 URL:http://smtai2026.sched.com/event/fde81fd99306eb0752190698bb204819 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T160000Z DTEND:20261028T173000Z SUMMARY:APT1: Advanced Interconnect Materials and Reliability DESCRIPTION:Session Chair: \;Andrew Mawer\, NXP Semiconductors\nSession Co-Chair: \;Prathiksha Ramprasad Dhanpal\, Westcliff University\n \n11:00am-11:30am \n Improving Cu-to-Cu Bonding through Cu Nanoparticle Characteristics and Substrate Residual Stress Control \nPresenter: Albert Wu\, Ph.D.\, National Central University\n Co-Authors: Li-Chen Wu\; Shao-Chi Chen\; En-Szu Chang\; Chang-Meng Wang\, National Central University\n\n11:30am-12:00pm \nCT-Based Analysis of Cu Loading and Particle Size Effects in Cu-Sn Particulate SystemsPresenter: Gilad Nave\, SLBCo-Authors: Md Asif Faisal Beg\, Mark Kostinovsky\, Mohamed El Hadachy\, F. Patrick McCluskey\, SLB \n \n12:00pm-12:30pm \nMetal Thermal Interface Materials (TIM) Portfolio Part 1: Indium-Based Solder TIMsPresenter: Ronald Lasky\, Ph.D.\, P.E.\, Indium CorporationCo-Authors: Miloš Lazić\, Kyle Aserian\, Ryan Mayberry\, Carson Burt\, Indium Corporation \n\n CATEGORIES:CONFERENCE SESSION LOCATION:APT\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:c97679e89e97fd49292b624cf4aeea9c URL:http://smtai2026.sched.com/event/c97679e89e97fd49292b624cf4aeea9c END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T160000Z DTEND:20261028T173000Z SUMMARY:RHE5: Mechanical Testing and Interconnect Reliability DESCRIPTION:Session Chair: \;Cathi Miles\, Raytheon Technologies\nSession Co-Chair: \;Tim Pearson\, Collins Aerospace\n\n11:00am-11:30am \;\n Sinusoidal Vibration Testing of Wafer Level Chip Scale Packages \n Presenter: Jayse McLean\, John Deere Intelligent Solutions Group \n\n11:30am-12:00pm \n High Density Connector Solder Joint Producibility and Reliability Evaluation for Military & Aerospace Environments \nPresenter: Jacob Weber & Daphne Gates\, Collins Aerospace\nCo-Authors: Kimera Cho\, Colette Anctil\, John Halverson\, Tim Pearson\, Ross Wilcoxon\, Collins Aerospace \n\n12:00pm-12:30pm \n Improving the Mechanical Reliability of a SAC305 Solder Joint by Using Different SAC Solder Pastes and Additional Doping Elements \n Presenter: George Winstead\, Ph.D.\, Technology Service Corporation\nCo-Authors: Sa’d Hamasha\, Ph.D.\, John Evans\, Ph.D.\, Auburn University CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:ab4d7c430b113b98960478d400881502 URL:http://smtai2026.sched.com/event/ab4d7c430b113b98960478d400881502 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T160000Z DTEND:20261028T180000Z SUMMARY:Interactive Presentations (Posters) on the Show Floor DESCRIPTION:Explore cutting-edge research and technical innovations at the Interactive Presentations session. This interactive poster event allows attendees to connect directly with presenters\, ask questions\, and gain valuable insights into the latest developments shaping the electronics manufacturing industry.\n\nPosters/Presenters:\nExpanding Electronic Technician Workforce Opportunities – Introduction to PCB Layout\, Grant Emmel\, Madison Area Technical CollegeExpanding Electronic Technician Workforce Opportunities – Introduction to PCB Assembly\, Andy Kurth\, Madison Area Technical CollegeReliability Assessment of Copper-Wire-Based Micro-Via BGA Pad Repair\, George Isaac\, Lockheed MartinHybrid Parylene + ALD Al₂O₃ Conformal Coating for Hermetic Moisture Protection of Electronic Devices\, George Isaac\, Lockheed Martin CATEGORIES:SPECIAL EVENT LOCATION:EXPO HALL B\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:2259814f51f6946bfa921d18eda5f607 URL:http://smtai2026.sched.com/event/2259814f51f6946bfa921d18eda5f607 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T160000Z DTEND:20261028T170000Z SUMMARY:SMTA Benefits & Max (AI) Demonstration Session DESCRIPTION:SMTA Benefits & Max (AI) Demonstration Session\n\nWhat Can SMTA Do for You? Stop by the SMTA booth for an overview of the benefits\, resources\, and opportunities available to you with a membership. See how Max\, our AI research assistant\, can be an asset in your job every day. CATEGORIES:SPECIAL EVENT LOCATION:SMTA Booth #2851\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:d0b00f77d80ad1945feccdfb663ce524 URL:http://smtai2026.sched.com/event/d0b00f77d80ad1945feccdfb663ce524 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T163000Z DTEND:20261028T173000Z SUMMARY:MFX6: Conformal Coating DESCRIPTION:Session Chair: Adam Klett\, Ph.D.\, KYZEN Corporation\nSession Co-Chair: \;Jeff Kennedy\, Retired (Formerly with ZESTRON Corporation)\n\n11:30am-12:00pm \;\n Conformal Coating - Between De-wetting and Crystalline Growth. The Quality Problem Identification by FT-IR Spectroscopy\n Presenter: Viktoria Rawinski\, Rawinski GMBH\n\n12:00pm-12:30pmThe Dirty Dozen - 12 Common Mistakes Made When Cleaning Circuit AssembliesPresenter: Michael Konrad\, Aqueous Technologies CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:0d0b8c2c9c2ea460ac6331c2371ced77 URL:http://smtai2026.sched.com/event/0d0b8c2c9c2ea460ac6331c2371ced77 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T180000Z DTEND:20261028T190000Z SUMMARY:NextGen10 Award Ceremony DESCRIPTION:Next Gen 10 Awards Ceremony\nCelebrate the emerging leaders shaping the future of the electronics manufacturing industry as SMTA recognizes this year’s Next Gen 10 honorees.\n CATEGORIES:SPECIAL EVENT LOCATION:SMTA Booth #2851\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:124e1ea25f48aaac9e695e1a1eedcae6 URL:http://smtai2026.sched.com/event/124e1ea25f48aaac9e695e1a1eedcae6 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T190000Z DTEND:20261028T210000Z SUMMARY:APT2: Advanced Packaging and Reliability DESCRIPTION:Session Chair: Marie Cole\, Retired (Formerly with IBM Corporation)\nSession Co-Chair: \n\n2:00pm-2:30pm \n Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration\n Presenter: Charles Woychik\, NHanced Semiconductors\n \n2:30pm-3:00pm\n Failure Modes in Flip Chip and Wire Bonded Packages\n Presenter: Mumtaz Bora\, pSemi \n\n3:00pm-3:30pm \n Finite Difference Based Model to Estimate Eutectic SnPb Solder Joint Fatigue Life \n Presenter: Robert Darveaux\, Ph.D.\, TMBS\, LLC \nCo-Authors: Andrew Mawer\, NXP Semiconductors\; Jean-Paul Clech\, Ph.D.\, EPSI\; Pradeep Lall\, Ph.D.\, Auburn University\n\n3:30pm-4:00pm\n Copper Core Solder Columns Transfer Heat from Semiconductor Chip Packages More Efficiently than Solder Balls at Cryogenic Temperatures for Quantum\, Aerospace\, Data Centers and Harsh Environments\n Presenter: Martin Hart\, Topline Corporation CATEGORIES:CONFERENCE SESSION LOCATION:APT\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:2f6ff778b8bdf07044587f590a6adf31 URL:http://smtai2026.sched.com/event/2f6ff778b8bdf07044587f590a6adf31 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T190000Z DTEND:20261028T210000Z SUMMARY:MFX7: OPS Excellence DESCRIPTION:Session Chair: \;Nick Ostrom\, Lockheed Martin\nSession Co-Chair: \;Sharissa Johns\, Lockheed Martin\n\n2:00pm-2:30pm \n Manufacturing Readiness: The Six Pillars of Operational Excellence \nPresenter: Mark Dydyk\, Dydyk Consulting LLC \n\n 2:30pm-3:00pm \n The Lost Art of Auditing PCB and SMT Suppliers \n Presenter: Albert Block\, Better Boards\n \n3:00pm-3:30pm\n Don't Change It Yet: A Data-Driven Framework for Extending Cleaning Agent Bath Life \n Presenter: Ram Wissel\, KYZEN Corporation \n\n3:30pm-4:00pm \n Evaluation of Solder Paste Printability with Solder Paste Inspection Equipment After Extended Stencil Cleaning Cycle Intervals \n Presenter: Shantanu Joshi\, Koki Solder America\nCo-Authors: Takeshi Yahagi\, Jasbir Bath\, Koki Solder America Inc\; Ray Welch\, Joel Scutchfield\, Brent Fischthal\, Koh Young Technology CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:87f7bfbf881f6f2133c66e3d74b4a369 URL:http://smtai2026.sched.com/event/87f7bfbf881f6f2133c66e3d74b4a369 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T190000Z DTEND:20261028T210000Z SUMMARY:RHE6: Predictive Modeling DESCRIPTION:Session Chair: Charlie Polidoro\, Inventec Performance Chemicals \;\nSession Co-Chair: \;Thiagarajan Raman\, Google\n \n2:00pm-2:30pm\n A Metamodel for Screening Solder Fatigue Life of BGA Joints with Voids \nPresenter: Arvind Purushotaman\, Synopsys\nCo-Author: Josh Akman\, Synopsys \n\n2:30pm-3:00pm \n Comparison of Analytical Thermomechanical Modeling and Finite Element Analysis for Lead-Free Wafer-Level Packages Subjected to Temperature Cycling\n Presenter: Jean-Baptiste Libot\, Ph.D.\, Hooke Electronics\nCo-Author: Philippe Milesi\, Hooke Electronics \n\n3:00pm-3:30pm \n Simulating Reflow Deformation on Highly Complex Printed Circuit Board Designs \nPresenter: Tyler Ferris\, Ansys \n\n3:30pm-4:00pm \n Mission Planning and Digital Twin Workflow for Thermo-Mechanical Solder Fatigue Prediction of Electronics \nPresenter: Josh Akman\, Synopsis\nCo-Authors: Mina Karimaghaei\, Ian Pond\, Synopsys CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:945f71e629d54e746f4c9b7ef0503ac0 URL:http://smtai2026.sched.com/event/945f71e629d54e746f4c9b7ef0503ac0 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T210000Z DTEND:20261028T230000Z SUMMARY:SMTA Officer Meeting and Social DESCRIPTION:All current Chapter and Alliance Group officers are invited to attend the Annual Officer Meeting. This event is a great opportunity to connect with fellow officers and the SMTA Board of Directors\, hear the latest organizational updates\, and celebrate outstanding volunteer achievements. \; CATEGORIES:SPECIAL EVENT LOCATION:TBA\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:d0f22aae9b2f5f6e2b8760d43d60f720 URL:http://smtai2026.sched.com/event/d0f22aae9b2f5f6e2b8760d43d60f720 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T213000Z DTEND:20261028T230000Z SUMMARY:APT3: Korean Packaging Integration Association DESCRIPTION:Session Chair: \;Sung-Jin Kim\, Chungbuk National UniversitySession Co-Chair: \;HyunHo Kim\, Korea Packaging Integration Association \;\n4:30pm-5:00pmAI and HPC Advanced Packaging TechnologyPresenter: YoungDo Kweon\, AMKOR Technology\n5:00pm-5:30pmMetal- Oxide Sphere-Structured Thermal Interface Material for Efficient Heat Dissipation\nPresenter: Jinsub Park\, Ph.D.\, Hanyang University5:30pm-6:00pmComprehensive review on Artificial Synaptic Devices with Amorphous Oxide Semiconductor Thin Film Transistors  \;for Neuromorphic Computing: Materials\, Devices\, and Emerging Applications\nPresenters: Sang Yeol Lee\, PhD.\, \;Gachon University \nCo-Authors: \;Sandeep Kumar\, Hyeonji Kim\, \;Gachon University CATEGORIES:CONFERENCE SESSION LOCATION:APT\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:c5b0d8f5111fe348f99380796d9f783e URL:http://smtai2026.sched.com/event/c5b0d8f5111fe348f99380796d9f783e END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T213000Z DTEND:20261028T230000Z SUMMARY:RHE7: Lead-Free Solder Evolution DESCRIPTION:Session Chair: \nSession Co-Chair:\n\n 4:30pm-5:00pm \n RoHS: Twenty Years Later\n Presenter: Ronald Lasky\, Ph.D.\, P.E.\, Indium Corporation \n\n5:00pm-5:30pm \n A Review on Impact of Isothermal Aging on Thermal Cycling Reliability of Ball Grid Array Packages Assembled Using SAC Lead-Free Solder Alloy\n Presenter: Anto Raj\, Ph.D.\, Medtronic \nCo-Author: Richard Coyle\, Ph.D.\, Nokia Bell Labs\n\n5:30pm-6:00pm\nImpact of Surface Finish on Voiding in Mixed Alloy Solder Paste Systems\nPresenter: Thuy Nguyen\, Indium Corporation\nCo-Authors: \;Hongwen Zhang\, Ph.D.\, Adam Murling\, \; \;Ronald Lasky\, Ph.D.\, P.E.\,Indium Corporation \n CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:e9e17edd5415e479ea33bdffdaca54c7 URL:http://smtai2026.sched.com/event/e9e17edd5415e479ea33bdffdaca54c7 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261028T220000Z DTEND:20261029T003000Z SUMMARY:Wednesday Reception: Halloween Bash DESCRIPTION:Information coming soon…. CATEGORIES:SPECIAL EVENT LOCATION:LOBBY\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:1f7f0db87f2ab070c4457df91cfaac7c URL:http://smtai2026.sched.com/event/1f7f0db87f2ab070c4457df91cfaac7c END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T123000Z DTEND:20261029T190000Z SUMMARY:SMTA Registration DESCRIPTION:\n CATEGORIES:REGISTRATION LOCATION:LOBBY\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:e9d3945c164e9747ad9c5a32a1222a1b URL:http://smtai2026.sched.com/event/e9d3945c164e9747ad9c5a32a1222a1b END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T133000Z DTEND:20261029T153000Z SUMMARY:MFX8: Unique Processes for Assembly 1 DESCRIPTION:Session Chair: \;Ray Prasad\, SMT Principles and Practice\nSession Co-Chair:\n\n8:30am-9:00am \n A Study of How Nozzle Tip Diameter and PCB Copper Mass Impact the Transfer of Thermal Energy during Mini-Wave Selective Soldering \n Presenter: Joseph Clure\, KurtzERSA Inc \nCo-Authors: \;Thomas Shoaf\, David Miller\, \;KurtzERSA Inc \n\n9:00am-9:30am \n Comparative Evaluation of Eutectic and Non-Eutectic Lead-Free Alloy Behavior in Hand Soldering Applications \n Presenter: Gayle Towell\, AIM Solder \nCo-Authors: Kevin Pigeon\, Lauren Porto\, Leo Lambert\, Marcia McLaughlin\n\n9:30am-10:00am \n Shelf-Life Study of Near-Chip Connectors on PCB and in Tape and Reel\n Presenters: Christine Taylor\, Ph.D.\, IBM Corporation & Tony Sass\, IBM Corporation\n\n10:00am-10:30am \n Meeting the Challenges of Proper Tinning Today \n Presenter: Brian Watson\, Ph.D.\, HyRel Technologies \nCo-Authors: \;John Kerr\, Scott Baker\, \;HyRel Technologies CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:75cb5e8799874a78c82992f90d29c98e URL:http://smtai2026.sched.com/event/75cb5e8799874a78c82992f90d29c98e END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T133000Z DTEND:20261029T170000Z SUMMARY:SMT Process Technologist (CSMTPT) Certification Exam DESCRIPTION:SMT Process Technologist (CSMTPT) Certification\nOne comprehensive examination. Two professional credentials.\nValidate your advanced process knowledge\, troubleshooting skills\, and technical decision-making across both Surface Mount and Liquid Soldering assembly processes.\n\nVIEW CERTIFICATION INFORMATION\n\nSMTA International is the first opportunity to earn SMTA's new Certified SMT Process Technologist (CSMTPT) credentials. Designed for experienced electronics manufacturing professionals with approximately 7–10 years of industry experience\, the CSMTPT validates applied process knowledge\, troubleshooting\, process optimization\, and technical decision-making across two major areas of electronics assembly.\n\nCandidates complete one comprehensive examination covering both Surface Mount and Liquid Soldering processes. Successful completion of the full examination earns two SMTA professional credentials:\n\nCSMTPT – Surface Mount\nRecognizes demonstrated competency in surface mount assembly processes\, including solder paste and stencil engineering\, component placement\, reflow\, inspection\, troubleshooting\, and rework.\n\nCSMTPT – Liquid Soldering\nRecognizes demonstrated competency in wave\, selective\, through-hole\, and related soldering processes\, including flux and solder application\, thermal processing\, inspection\, troubleshooting\, rework\, and specialized soldering processes.\nThe examination emphasizes the ability to apply process knowledge to real-world manufacturing situations rather than simply recall technical information. Following the initial launch at SMTA International\, the CSMTPT examination will become available to the broader industry through an online\, proctored format. CATEGORIES:CONFERENCE SESSION LOCATION:Room 57\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:36fe09b12681e787288bcd7221bdcd85 URL:http://smtai2026.sched.com/event/36fe09b12681e787288bcd7221bdcd85 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T133000Z DTEND:20261029T170000Z SUMMARY:PDC10: PCB Interposer Design Strategies for Heterogeneous System-in-Package Technology DESCRIPTION:Instructor:\n Vern Solberg\n\n Course Overview:\n This half-day tutorial provides PCB design engineers and manufacturing professionals with guidance on developing next-generation semiconductor packaging solutions\, including 2D\, 2.5D\, and 3D System-in-Package (SiP) technologies and ultra-high-density interposers. As advanced electronics increasingly rely on chiplet-based architectures and heterogeneous integration\, this course explores design strategies\, manufacturing considerations\, and reliability challenges associated with high-density packaging technologies. Participants will gain insight into evolving package architectures\, interposer technologies\, and practical design approaches for future electronic systems.\n\n Topics Include:\n • Evolution of advanced array packaging and industry standards\n BGA\, FBGA\, die-size packages\, and chiplet package technologies\n • 2D\, 2.5D\, and 3D semiconductor die and package stacking Wire-bond memory stacking Homogeneous and heterogeneous package integration Package-on-package technologies and risk considerations\n • PCB design guidelines for high-density array packaging Multiple-die and stacked package methodologies 2.5D high-density BGA applications\n • HDI and UHDI substrate and interposer design Organic\, silicon\, polymer\, and glass-based interposer technologies Fabrication methods and design considerations\n • Wafer-level and panel-level packaging technologies Fan-out wafer-level packaging (FOWLP) Fan-out panel-level packaging (FOPLP) Mold-first manufacturing approaches\n • Heterogeneous integration and hybrid/direct bond interconnect technologies \nWho Should Attend:\n This course is designed for PCB designers\, design engineers\, semiconductor packaging professionals\, manufacturing engineers\, and test specialists involved in advanced electronic product development. It is also beneficial for OEM\, ODM\, EMS\, and OSAT professionals seeking a deeper understanding of next-generation packaging technologies and their impact on design\, manufacturing\, and supply chain strategies.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC10\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:2c72afcd7cfa2037778f2d8f22349207 URL:http://smtai2026.sched.com/event/2c72afcd7cfa2037778f2d8f22349207 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T133000Z DTEND:20261029T170000Z SUMMARY:PDC8: Test Probes and Test Fixtures 101 for ICT/FCT: Back to Basics DESCRIPTION:Instructors:\n Matthias Zapatka & Travis Walker\n INGUN USA\, Inc.\n\n Course Overview:\n This back-to-basics course provides a practical introduction to selecting and applying test probes and fixtures for successful printed circuit board assembly (PCBA) testing\, including in-circuit test (ICT) and functional test (FCT). The course covers essential fixture and probe technologies\, helping engineers\, technicians\, and test professionals understand the fundamentals needed to develop reliable and effective test solutions. A hands-on session allows participants to explore probe plate assembly and discuss real-world test fixture design challenges.\n\n Topics Include:\n • Overview of test fixture technologies\n • Fundamentals of in-circuit and functional testing\n • Test probe technologies\, including pogo pins and receptacles\n • Selecting the right probes and fixtures for PCBA test applications\n • Test fixture design considerations and best practices\n • Hands-on probe plate assembly exercise and Q&A\n\n Who Should Attend:\n This course is designed for production test engineers\, PCBA design engineers\, test planners\, technicians\, buyers\, and anyone involved in developing\, specifying\, or supporting ICT and functional test solutions. It is suitable for beginners as well as intermediate and advanced-level professionals looking to strengthen their understanding of test fundamentals.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC8\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:7f61c3575963264df889c6d873c9adee URL:http://smtai2026.sched.com/event/7f61c3575963264df889c6d873c9adee END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T133000Z DTEND:20261029T170000Z SUMMARY:PDC9: Practical PCB Strain Measurement for Reliability Evaluation DESCRIPTION:Instructor:\n Takahiro James Hara\n Kyowa Americas Inc.\n\n Course Overview:\n This course provides a practical introduction to PCB strain measurement techniques used for evaluating the reliability and durability of electronic assemblies. Participants will learn the fundamentals of strain measurement\, strain gage selection and installation\, data acquisition methods\, and techniques for improving measurement accuracy. A hands-on session provides experience with strain gage installation\, measurement setup\, and real-time data collection. The course equips engineers with practical knowledge to implement reliable strain measurement methods for design validation\, manufacturing evaluation\, and failure prevention.\n\n Topics Include:\n • Fundamentals of strain measurement and strain gages\n Strain measurement principles Strain gage types and characteristics Selecting strain gages for PCB applications Overview of PCB strain measurement techniques\n • Hands-on strain gage installation and data acquisition PCB sample preparation and strain gage installation Wiring and measurement system setup Real-time data collection and recording\n • Improving measurement accuracy and reliability Common sources of measurement error Temperature compensation methods Signal filtering and noise reduction Sampling rates and FFT fundamentals Best practices for repeatable measurements\n • Q&A and technical discussion \nWho Should Attend:\n This course is designed for engineers and professionals involved in electronic assembly design\, manufacturing\, and reliability evaluation. It is especially beneficial for design engineers\, reliability and test engineers\, manufacturing and process engineers\, quality engineers\, and professionals interested in implementing PCB strain measurement for high-reliability applications.\n\n CATEGORIES:PROFESSIONAL DEVELOPMENT COURSE LOCATION:PDC9\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:e85a333a726875fb91b5c4f8bc9c34a5 URL:http://smtai2026.sched.com/event/e85a333a726875fb91b5c4f8bc9c34a5 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T140000Z DTEND:20261029T153000Z SUMMARY:APT4: Substrates DESCRIPTION:Session Chair: \nSession Co-Chair: \n\n9:00am-9:30am \n Sintered Cu Paste as a Via- Filling Material for Through-Glass Vias (TGVs) - Via Planarization by Chemical Mechanical Polishing (CMP )- \n Presenter: Yoshinori Ejiri\, Resonac Co.\, Ltd. \nCo-Authors: Masumi Sakamoto\, Chiaki Shimizu\, Naoyuki Kikuchi\, Masayoshi Nishimoto\, Seiji Kai\, Hiroshi Uragami\, Resonac Co.\, Ltd.\n\n9:30am-10:00am \n Thermal-Mismatch Stress Analysis and Suppression of SEWARE in Glass Core Substrates with Multilayer ABF Build-Up Layers \n Presenter: Takamasa Takano\, Dai Nippon Printing Co. Ltd. \n Co-Author: \;Satoru Kuramochi\, Dai Nippon Printing Co. Ltd. \n\n10:00am-10:30am \n Epoxy Adhesives with Precision Beads to Control the Air-Gaps for SMT Planar Inductor Applications \n Presenter: Yiliang Wu\, CollTech Materials Corporation \nCo-Authors: Fen Zhang\, Jack Chen\, CollTech Materials Corporation CATEGORIES:CONFERENCE SESSION LOCATION:APT\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:f80522c2b50b8e224a514812b62dbc90 URL:http://smtai2026.sched.com/event/f80522c2b50b8e224a514812b62dbc90 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T140000Z DTEND:20261029T153000Z SUMMARY:RHE8: Harsh Use Conditions DESCRIPTION:Session Chair: \nSession Co-Chair:\n\n 9:00am-9:30am \n Electromigration Behavior of Solder Joints as a Function of Current Density and Joint Temperature \nPresenter: Nithin Lakshminarayan\, Universal Instruments Corporation\nCo-Authors: Michael Meilunas\, Universal Instruments Corporation\; Martin Anselm\, Ph.D.\, Rochester Institute of Technology (RIT) \n\n9:30am-10:00am\n Advanced Packaging Qualification for Harsh Environments \n Presenter: Gilad Nave\, Ph.D.\, SLB\nCo-Authors: Masahiro\, Tsuriya\, iNEMI\; David Locker\, US Army\n\n 10:00am-10:30am \n Atomic Layer Deposition/Parylene Conformal Nanocoatings \n Presenter: Rakesh Kumar\, Ph.D.\, Specialty Coating Systems\, Inc. CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:0b32c3d2e10d5020196ce9ec64b15300 URL:http://smtai2026.sched.com/event/0b32c3d2e10d5020196ce9ec64b15300 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T140000Z DTEND:20261029T190000Z SUMMARY:Electronics Exhibition DESCRIPTION:See full exhibitor listing and floorplan here: https://www.smtai.org/exhibitors CATEGORIES:EXHIBITION LOCATION:EXPO HALL B\,C\,D\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:dd7314be2d9f88db248cd1dd99c444e7 URL:http://smtai2026.sched.com/event/dd7314be2d9f88db248cd1dd99c444e7 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T160000Z DTEND:20261029T170000Z SUMMARY:MFX9: Unique Processes for Assembly 2 DESCRIPTION:Session Chair: \nSession Co-Chair: \n\n11:00am-11:30am \;\nHow Heavy Copper Designs Influence Through‑Hole Barrel FillPresenter: Mei Ming Khaw\, Keysight TechnologiesCo-Author: Xi Lin\, Por\, Keysight Technologies \n\n11:30am-12:00pm \n SMT Defects Bringing you Down? We’ve Got SolutionPresenters: Tony Lentz\, FCT Solder & Greg Smith\, StenTech\, Inc CATEGORIES:CONFERENCE SESSION LOCATION:MFX\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:8b094030bba9464d2681820b36e2258e URL:http://smtai2026.sched.com/event/8b094030bba9464d2681820b36e2258e END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T160000Z DTEND:20261029T170000Z SUMMARY:RHE9: Factors Affected Thermal Cycling Performance DESCRIPTION:Session Chair: \nSession Co-Chair: \n\n11:00am-11:30am\n Ball Grid Array Footprint Impacts on Reliability \n Presenter: William Fox\, Lockheed Martin \nCo-Author: Ben Gumpert\, Lockheed Martin \;\n\n11:30am-12:00pm\n Effects of Thermal Cycling on Electromigration Life of SnAgCu Solder Joints \nPresenter: Anola Semndili\, Binghamton University\nCo-Authors: Sai Kiran Reddy Munnangi\, Sitaram Panta\, Eric Cotts\, Ph.D.\, Peter Borgesen\, Binghamton University CATEGORIES:CONFERENCE SESSION LOCATION:RHE\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:1d2e34ce63dc6d30dd213961ea3bd423 URL:http://smtai2026.sched.com/event/1d2e34ce63dc6d30dd213961ea3bd423 END:VEVENT BEGIN:VEVENT DTSTAMP:20260912T163317Z DTSTART:20261029T160000Z DTEND:20261029T163000Z SUMMARY:Electronics Assembly Explorer Raffle DESCRIPTION:\n CATEGORIES:SPECIAL EVENT LOCATION:SMTA Booth #2851\, Donald E Stephens Convention Center\, Rosemont\, IL\, USA SEQUENCE:0 UID:0f6c30f9eb3b43f837c41ce5a5f70ac9 URL:http://smtai2026.sched.com/event/0f6c30f9eb3b43f837c41ce5a5f70ac9 END:VEVENT END:VCALENDAR